| Basic Information | Product Collection |
|---|---|
| 5318N | Basic Information |
| Ice Lake | Basic Information |
| Q2"21 | Basic Information |
| 24 | Performance |
| 48 | Performance |
| 2.1 GHz | Performance |
| 3.4 GHz | Performance |
| 36 MB | Performance |
| FCLGA4189 | Architecture & Process |
| 10 nm | Architecture & Process |
| 2 | Architecture & Process |
| 6 TB | Memory |
| DDR4-2667 | Memory |
| 8 | Memory |
| Yes | Memory |
| Yes | Memory |
| 4.0 | Expansion |
| 64 | Expansion |
| 3 | Expansion |
| 11.2 GT/s | Expansion |
| 64-bit | Advanced Technologies |
| 2.0 | Advanced Technologies |
| Yes | Advanced Technologies |
| Yes | Advanced Technologies |
| Yes | Advanced Technologies |
| Yes | Advanced Technologies |
| Yes | Advanced Technologies |
| 150 W | Power |
Engineer's Note: The Intel Xeon Gold 5318N pairs 24 cores / 48 threads with a 2.1 GHz base clock that boosts to 3.4 GHz on demand and 36 MB of on-die cache, making it a drop-in candidate for latency-sensitive business applications. The 150 W thermal envelope keeps it inside standard server cooling budgets. Its FCLGA4189 socket means it slots into existing platforms without board redesign. Positioned as the workhorse tier of the Scalable family, balancing per-core speed and core density, it is built for sustained multi-user workloads.
1. 150 W TDP: the thermal envelope is sized for sustained all-core loads in multi-socket chassis, so the processor holds its rated clocks through long batch windows instead of throttling halfway through. It also keeps per-socket cooling and power costs predictable when you scale out — datacenter capacity planning runs on numbers like these.
2. 36 MB of shared cache: a large last-level cache keeps hot working sets on-die, cutting memory round-trips for databases and compilers. Fewer main-memory accesses translate directly into lower average latency and better tail performance under load — often the difference you feel before any benchmark confirms it.
3. 2.1 GHz base / 3.4 GHz turbo: the frequency governor drops light threads onto boosted cores, so single-threaded paths (license checks, stored procedures, log processing) finish fast while background jobs keep the remaining cores saturated. The result is responsive interactive performance without sacrificing aggregate throughput.
4. Memory platform on the Intel Xeon Gold 5318N: support for DDR4-2667, up to 6 TB of RAM, 8 memory channels. This is the headroom in-memory databases and dense VM farms need — capacity for growth, bandwidth for the data streams in between.
5. 64 PCIe lanes (PCIe 4.0): the lane budget drives expansion. NVMe SSDs, 25/100GbE NICs, and GPU accelerators each consume 8–16 lanes, and this processor keeps enough lanes free to build a storage-dense or GPU-accelerated node without a PCIe switch — saving cost and a hop of latency.
If your roadmap includes latency-sensitive business applications, the Intel Xeon Gold 5318N turns architectural decisions into predictable outcomes. Its 24-core layout sizes the node for expected concurrency, the 3.4 GHz turbo headroom keeps interactive paths responsive, and 6 TB of addressable memory gives the platform room to grow. Every unit passes functional testing before shipment, and our bulk-pricing desk keeps multi-socket refresh projects inside budget.
Q: Is it new or refurbished? What warranty applies?
A: We offer both new and tested refurbished units — the condition is shown on each listing. All processors include a one-year warranty and pass functional testing (boot, memory controller, all cores) before dispatch.
Q: What memory does it require?
A: The platform supports DDR4-2667. Use ECC registered memory (RDIMM/LRDIMM) — desktop UDIMMs are not compatible with Xeon sockets. Faster modules will downclock to the processor's rated speed.
Q: Do you offer bulk pricing for fleet upgrades?
A: Yes. Multi-socket refresh projects and fleet orders get consolidated pricing — request a quote through the form on this page with your target quantity, and our team responds with an offer typically within one business day.
Q: Will 150 W TDP fit my server's cooling budget?
A: 150 W is within the standard envelope for its socket generation, so existing chassis cooling handles it under sustained all-core load. Confirm your server's supported TDP range if you are upgrading from a lower-tier part.
Q: Can I mix this processor with different models in the same server?
A: In multi-socket servers, matched processors (same model, same stepping) are strongly recommended. Mixed models can cause boot failures or instability because memory controllers and QPI/UPI links negotiate to the lowest common configuration.