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Samsung M392B4G70DE0-YH9Q2 32GB DDR3 RDIMM 1333MHz | Reliable ECC RAM

MPN:M392B4G70DE0-YH9Q2 By:Samsung Warranty:1 year
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General

ModelM392B4G70DE0-YH9Q2
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity32 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankQuad Rank x4
Quantity of Pins240-pin
RAM GenreVLP RDIMM

Engineer's Note

This 32GB DDR3-1333 VLP RDIMM with ECC and registered signaling is a server-grade module purpose-built for dense virtualization, in-memory databases, and other enterprise workloads that demand uncompromising data integrity. Its quad-rank x4 configuration maximizes per-channel capacity within legacy 1.35V low-voltage platforms, while buffered command/address lines preserve signal stability across fully populated 240-pin memory banks.

Technical Specs & Insights

1. Generous memory capacity enables massive virtualization workloads, allowing dozens of VMs to coexist on a single server without memory contention.
2. Error‑correcting code protection prevents single‑bit data corruption, safeguarding transactional integrity in financial and database servers.
3. Registered signal buffering stabilizes command and address lines across fully loaded memory channels, essential for maintaining uptime in multi‑DIMM configurations.
4. Quad‑rank design packs higher capacity per module for dense server deployments, though it demands careful system board compatibility to handle the increased electrical loading without sacrificing speed.
5. Low voltage operation trims datacenter power draw and thermal waste, directly lowering cooling overhead and total cost of ownership.

Why These Specs Matter

When deploying dense virtualization clusters or running an in‑memory database, every bit of data integrity and every rack‑unit of space matters. The Samsung M392B4G70DE0-YH9Q2 is a 32GB DDR3L VLP RDIMM engineered specifically to address these enterprise realities. Its ECC technology actively corrects single‑bit errors, protecting your financial transactions or customer records from silent corruption that could crash entire workloads — a non‑negotiable requirement when uptime equals revenue. The registered signal buffer stabilizes command and address lines, allowing you to populate all server channels with quad‑rank x4 modules without sacrificing clock cycle reliability; this directly translates to confidently scaling memory capacity for large virtual machine fleets or Redis clusters under heavy concurrent access. The quad‑rank x4 architecture delivers deeper bank parallelism, sustaining bandwidth during intensive database caching even at 1333MHz. Crucially, the very‑low‑profile (VLP) form factor fits effortlessly into 1U and blade servers where standard DIMMs obstruct airflow or simply cannot be installed, enabling maximum density without thermal compromise. Pair that with 1.35V operation, and you achieve significant power savings across a data center full of nodes — reducing both electricity cost and cooling burden while maintaining the 24×7 durability your infrastructure demands.

Endurance & Reliability

General Virtualization
For general virtualization hosts, balance memory capacity and cost by populating one DIMM per channel to maximize bandwidth while leaving room for growth. Install a minimum of two M392B4G70DE0-YH9Q2 modules (64 GB total) in a dual-socket server to comfortably host 10–15 light VMs. Scale in matched pairs up to 128 GB per socket to avoid memory contention as VM density increases.

In-Memory Database
In-memory databases demand low latency and high availability. Fully populate all memory channels with identical 32 GB quad-rank RDIMMs to achieve the largest possible memory pool, often 256 GB or more per server. The registered ECC nature of these modules safeguards critical data integrity, while the CL9 latency supports rapid transactional throughput without stalls.

High-Performance Computing (HPC)
HPC clusters prioritize per-core memory bandwidth. Deploy these modules in a balanced configuration — typically one DIMM per channel across all sockets — to sustain parallel data streams for scientific simulations. For memory-bound workloads, scale to 64–128 GB per node using four or eight identical sticks, ensuring uniform rank interleaving and optimal throughput under sustained load.

Verified Compatibility

Rigorously validated for Dell R720, HP DL380p Gen8, IBM x3650 M4 server compatibility.

FAQ

Q: Can I mix this M392B4G70DE0-YH9Q2 with other memory modules of different brands or speeds?

A: Mixing is not advised. Mismatched brands or speeds may compromise signal integrity and ECC functionality. For guaranteed stability in server environments, populate exclusively with identical Samsung M392B4G70DE0-YH9Q2 modules.

Q: Is this memory compatible with my system?

A: This DDR3 registered ECC RDIMM is designed for Intel Xeon E5-2400/2600 v1/v2 and AMD Opteron 6300 series platforms. Always consult your server’s qualified vendor list to confirm support for Samsung PN M392B4G70DE0-YH9Q2.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate each memory channel starting from the slot farthest from the CPU. For quad-rank DIMMs, install in the first slot per channel (commonly blue). Follow your server platform’s manual to balance ranks across channels.

Q: Does this module support overclocking or XMP profiles?

A: No. This Samsung registered server module adheres strictly to JEDEC DDR3-1333 specifications. It does not support overclocking or XMP profiles, ensuring mission‑critical reliability and data integrity.

Q: What warranty and typical failure rate can I expect?

A: This module is covered by a 1‑year warranty. Samsung server memory typically exhibits an annualized failure rate (AFR) below 0.5% when operated within specified voltage and temperature limits.

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