| Product Type | Memory Module |
|---|---|
| Compliance Standards | RoHS |
| Memory Capacity | 16 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.35V |
| RAM Speed | 1333MHz |
| RAM Standard | DDR3-1333/PC3-10600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL9 |
| Rank | Dual Rank x4 |
| Quantity of Pins | 240-pin |
| RAM Genre | VLP RDIMM |
Designed as a Very Low Profile Registered DIMM with ECC, this 16 GB DDR3-1333 module is tailored for dense server environments such as virtualization hosts and in-memory databases, where its dual-rank x4 organization ensures balanced signal loading and the registered buffer enhances command/address stability across high-capacity configurations. The low 1.35 V operating voltage reduces thermal footprint and energy consumption, while ECC reliably corrects single-bit errors to maintain data integrity in mission-critical workloads.
1. Registered signal buffering stabilizes command and address lines, allowing fully populated memory channels across multi-socket servers without compromising signal integrity.
2. ECC error correction silently detects and fixes single-bit errors, preserving in-memory data accuracy for financial ledgers and transactional databases.
3. VLP RDIMM very low profile minimizes height to fit dense 1U rack enclosures, improving airflow and enabling compact node scaling at hyperscale.
4. 16GB module capacity provides ample headroom per DIMM slot, directly raising virtual machine density and container hosting capability in mid-range virtualization hosts.
5. Dual Rank x4 organization interleaves access across two internal ranks, saturating DDR3 bandwidth to maintain low latency under heavy, multi-tenant cloud workloads.
From the ECC, Registered signals, Dual Rank organization, and the VLP RDIMM designation, this is unmistakably a server-grade memory module engineered for always-on enterprise workloads. In a virtualized cluster hosting dozens of VMs per node, a single undetected bit-flip from background radiation can silently corrupt tenant data or crash a hypervisor. The built-in ECC corrects such errors on the fly, safeguarding transactional integrity and eliminating costly downtime. That reliability is amplified by the Registered architecture, which buffers command and address lines so you can pack multiple 16GB modules across all channels without signal collapse — a non-negotiable requirement when scaling in-memory databases like SAP HANA. Your analytics workload also leans on the Dual Rank x4 arrangement: it interleaves bank accesses to sustain higher bandwidth during sustained reads, directly accelerating real-time query responses. Finally, the 1.35V low-voltage operation and Very Low Profile form factor work together inside dense 1U chassis. Reduced power draw lowers your thermal load while the short PCB unblocks airflow, preventing the throttling that kills performance in a 24/7 database server. For a finance ticker or a production virtualization host, this memory converts into deterministic data, stable large-capacity operation, and lower cooling overhead — the precise metrics that dictate your service-level agreements.
General Virtualization
For general virtualization, deploy these 16GB registered ECC VLP RDIMMs in balanced configurations. In a dual-socket server with four memory channels per CPU, install sixteen modules (two per channel) to provide 256GB. This delivers stable capacity for dozens of VMs while the low-profile, 1.35V design eases cooling in dense racks.
In-Memory Database
In-memory databases demand maximum capacity. Populate all available DIMM slots—for example, 24×16GB to reach 384GB—and leverage the dual-rank x4 organization for high throughput. The VLP form factor fits 1U appliance nodes, and 1.35V ECC operation safeguards data integrity under sustained heavy loads.
High-Performance Computing
For HPC clusters, install one 16GB VLP RDIMM per memory channel (e.g., 8 DIMMs on a dual-CPU 4-channel board) to achieve balanced peak bandwidth and 128GB capacity. The 1.35V ultra-low-profile design cuts node power and thermal footprint, while DDR3-1333 CL9 with dual-rank x4 construction meets the latency demands of tightly coupled parallel workloads.
Rigorously tested server memory: compatible with Dell PowerEdge R620/R720, HP ProLiant DL380p Gen8, Lenovo ThinkServer RD430.
Q: Can I mix this MT36KDZS2G72PZ-1G4E1 with other memory modules of different brands or speeds?
A: Not recommended. Mixing RDIMMs with different brands or speeds can destabilize the memory subsystem and compromise ECC functionality. For validated server reliability, install identical modules only.
Q: Is this memory compatible with my system?
A: This 240-pin DDR3 Registered ECC module supports Intel Xeon E5-2400/2600 v1/v2 and AMD Opteron 6300 platforms. Confirm with your server's qualified vendor list for guaranteed compatibility.
Q: What is the recommended DIMM population order for optimal performance?
A: Follow your server board's guide. Typically, populate identical sticks per channel starting farthest from the CPU. Install balanced sets of four for quad-channel architecture to maximize bandwidth.
Q: Does this module support overclocking or XMP profiles?
A: No. Server-grade RDIMMs adhere to JEDEC standards for constant stability. Overclocking or XMP is not supported; it runs fixed at 1333MHz, CL9, 1.35V for uninterrupted 24/7 enterprise use.
Q: What warranty and typical failure rate can I expect?
A: It includes a 1-year warranty. Manufactured under RoHS, these modules exhibit an annualized failure rate well below 0.5% in properly ventilated, spec-compliant servers, ensuring sustained data center reliability.