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Micron MTA18ASF2G72AZ-3G2R1R 16GB DDR4 UDIMM 3200MT/s | Reliable ECC

MPN:MTA18ASF2G72AZ-3G2R1R By:Micron Warranty:1 year
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General

Product TypeMemory Module
Memory Capacity16 GB
Memory TechnologyDDR4
Product Voltage1.2V
RAM Speed3200MHz
RAM StandardDDR4-3200/PC4-25600
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL22
RankDual Rank x8
Quantity of Pins288-pin
RAM GenreUDIMM

Engineer's Note

This DDR4-3200 ECC UDIMM is purpose-built for entry-level servers and professional workstation platforms where data integrity is critical, supporting unbuffered operation to maintain responsive performance under transactional workloads. Its dual-rank x8 configuration enhances interleaving and memory bandwidth efficiency, while the CL22 timing and native 1.2V voltage deliver reliable, power-conscious operation ideal for always-on systems and virtualized environments.

Technical Specs & Insights

1. ECC protection detects and corrects single-bit errors in real time, preserving data integrity for mission‑critical enterprise applications and reducing silent corruption risks in always‑on servers.
2. Dual Rank x8 organization maximizes bank‑level parallelism, helping sustain high memory throughput when hosting dense virtual machines under concurrent workloads.
3. 3200 MHz speed delivers the elevated bandwidth needed to feed multi‑core server CPUs, accelerating database queries and in‑memory analytics without bottlenecks.
4. 16 GB capacity provides sufficient headroom to consolidate multiple light‑to‑medium VMs or containers on a single node, improving resource utilization without sacrificing isolation.
5. 1.2V low operating voltage curbs power consumption per DIMM, which scales into meaningful energy savings and cooler thermal profiles across large server fleets.

Why These Specs Matter

Identified by its 288-pin UDIMM form factor and ECC technology, the MTA18ASF2G72AZ-3G2R1R is a server and workstation memory module built for professionals who cannot tolerate data corruption or downtime. In a virtualized small business server running multiple guest operating systems, a single undetected bit-flip in active memory can silently cascade into database inconsistencies or complete hypervisor crashes. The unbuffered ECC design of this 16GB DDR4-3200 module catches and corrects single-bit errors on the fly, preserving the integrity of every transaction without the added latency of a register—critical when you need responsive access to financial records or customer databases. When deployed in a content creation workstation handling 4K video rendering or large CAD assemblies, the dual-rank x8 organization interleaves memory banks to sustain higher sustained bandwidth, preventing frame drops during timeline scrubbing. Its low 1.2V operating voltage helps keep thermal load in check inside compact tower or rackmount chassis, while the true 3200MHz speed and CL22 timing deliver fast, predictable performance. This means fewer failed renders, stable overnight workloads, and confidence that your machine will not corrupt the project file you have been refining for hours. This is not just memory—it is insurance for your data and your deadlines.

Endurance & Reliability

General Virtualization
For moderate consolidation of virtual machines, deploy four 16 GB ECC UDIMMs across a quad-channel platform to reach 64 GB total. This configuration balances cost and density while ECC guards against in-memory errors that could corrupt multiple tenants. Scale to eight identical modules (128 GB) when hosting heavier workloads or more VMs, keeping channels symmetrically populated for uniform memory latency.

In-Memory Database
In-memory databases such as Redis or SAP HANA demand both capacity and low latency. Fully populate all available memory channels—typically eight modules on a dual-CPU entry server—with these dual-rank x8 16 GB UDIMMs to achieve 128 GB. Dual-rank x8 construction boosts bank-level parallelism, improving transaction throughput. Always mirror channel populations to maximize interleaving and avoid performance cliffs in real-time analytics.

High-Performance Computing
HPC applications thrive on bandwidth, so place one 16 GB UDIMM in every memory channel (e.g., eight modules across eight channels) to fully utilize the CPU’s memory controllers. The 3200 MT/s speed and dual-rank configuration deliver strong sustained throughput for simulation and modeling codes. ECC is non-negotiable in long-running parallel jobs, preventing silent data corruption that would render results unusable.

Verified Compatibility

Rigorously tested, compatible with Dell PowerEdge T350, HPE ProLiant DL20 Gen10 Plus, and Lenovo ThinkSystem ST50 V2.

FAQ

Q: Can I mix this MTA18ASF2G72AZ-3G2R1R with other memory modules of different brands or speeds?

A: Mixing modules is not recommended for server environments. Unbuffered ECC DIMMs may downclock to the slowest installed speed, and mismatched brands can cause subtle stability issues under sustained load.

Q: Is this memory compatible with my system?

A: This 288-pin DDR4-3200 UDIMM ECC module is designed for server/workstation platforms such as Intel Xeon E-2300/E-2200 series or AMD Ryzen PRO platforms. Verify your motherboard supports unbuffered ECC memory.

Q: What is the recommended DIMM population order for optimal performance?

A: For dual-rank x8 UDIMMs, populate one DIMM per channel first to maximize bandwidth. In a one-DPC configuration, install identical modules in the slots specified by your server board’s manual, typically blue slots first.

Q: Does this module support overclocking or XMP profiles?

A: No. This JEDEC-standard DDR4-3200 CL22 ECC UDIMM does not support XMP or overclocking. It operates at fixed 1.2V with industry-standard timings to ensure data integrity and platform validation.

Q: What warranty and typical failure rate can I expect?

A: This module includes a 1-year warranty. Enterprise-class ECC UDIMMs typically exhibit an annualized failure rate (AFR) well below 0.5% under normal operating conditions with adequate cooling.

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