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Micron MTA18ADF2G72AZ-3G2E1ZI 16GB DDR4 UDIMM 3200MT/s Low-Power SODIMM

MPN:MTA18ADF2G72AZ-3G2E1ZI By:Micron Warranty:1 year
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General

Product TypeMemory Module
Memory Capacity16 GB
Memory TechnologyDDR4
Product Voltage1.2V
RAM Speed3200MHz
RAM StandardDDR4-3200/PC4-25600
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL22
RankDual Rank x8
Quantity of Pins288-pin
RAM GenreUDIMM

Engineer's Note

This UDIMM DDR4 module with ECC is purpose-built for entry-level servers and professional workstations, where data integrity is critical for applications like financial modeling, CAD, or light virtualization. Its dual-rank x8 organization and Unbuffered signal type strike an ideal balance between capacity and latency, delivering stable 3200MT/s throughput with CL22 timing for consistent performance under memory-intensive workloads.

Technical Specs & Insights

1. ECC protection detects and corrects single-bit memory errors in real time, preserving data integrity for mission-critical server workloads and preventing silent data corruption in long-running computations.

2. 16GB capacity per module allows higher memory density per server node, enabling more virtual machines or containers to run simultaneously without exhausting physical memory resources.

3. Dual Rank x8 organization interleaves memory accesses across two internal ranks, boosting bank-level parallelism and sustaining throughput under heavy multi-threaded request streams.

4. 3200MHz clock speed delivers a peak transfer rate that reduces latency in data-intensive operations, serving more concurrent queries per second in database and analytics applications.

5. Unbuffered signaling keeps electrical path latency minimal, which benefits latency-sensitive workloads like high-frequency trading or real-time processing where every nanosecond counts.

Why These Specs Matter

Designed for servers and workstations, this Micron 16GB DDR4-3200 UDIMM (MTA18ADF2G72AZ-3G2E1ZI) addresses real-world pain points through four vital features. ECC corrects single-bit errors that can silently corrupt virtual machine data or crash a hypervisor, ensuring transactional integrity for your virtualization cluster. The 3200MT/s speed combined with dual-rank x8 organization interleaves memory banks, dramatically boosting bandwidth for in-memory databases like Redis—reducing query latency even under heavy concurrent loads. Its 1.2V ultra-low voltage slashes power and cooling costs in multi-server deployments, directly lowering TCO while extending component lifespan. Finally, the 16GB capacity per module delivers the ideal density for SMBs running containerized applications or database servers, balancing cost and headroom. In a virtualized environment, ECC prevents downtime from memory errors; for real-time analytics, the dual-rank design accelerates data throughput. These specifications coalesce into a reliable, energy-efficient memory foundation that keeps critical services performing around the clock.

Endurance & Reliability

General Virtualization
For a general virtualization host using these 16 GB ECC UDIMMs, populate memory channels symmetrically to enable interleaving. A baseline of 4 identical modules (64 GB total) comfortably supports 10–15 moderate VMs. Scale by adding matched pairs up to the board’s UDIMM limit, leveraging ECC to safeguard hypervisor and guest stability.

In-Memory Database
Maximize capacity by filling every available slot with these 16 GB dual-rank modules – an 8‑slot platform yields 128 GB, keeping large datasets resident in RAM. The unbuffered ECC design provides bit-error protection critical for transactional integrity. Always install balanced configurations across memory controllers to maintain predictable latency under heavy in-memory workloads.

High-Performance Computing
Prioritize bandwidth by installing one DIMM per channel (e.g., 4 × 16 GB in a quad-channel system), allowing the 3200 MT/s speed to be sustained. Where node memory must scale higher, populate the second DIMM per channel; the dual-rank x8 construction maintains good signal quality, though minor frequency derating may occur. ECC is essential for long-running parallel jobs where silent data corruption cannot be tolerated.

Verified Compatibility

Validated for servers. Tested with Dell PowerEdge T140, HPE ProLiant DL20 Gen10, Lenovo ThinkSystem ST250.

FAQ

Q: Can I mix this MTA18ADF2G72AZ-3G2E1ZI with other memory modules of different brands or speeds?

A: Mixing modules with different speeds or brands is not recommended for server environments. It may cause signal integrity issues, ECC errors, and system instability. Use identical Micron ECC UDIMMs to ensure reliability and validated performance.

Q: Is this memory compatible with my system? (Intel/AMD server platforms)

A: This DDR4-3200 ECC UDIMM supports Intel Xeon E-2300/E-2400 series and AMD Ryzen Pro/EPYC 3000 platforms that accept unbuffered ECC memory. Please verify your motherboard’s QVL for specific model compatibility.

Q: What is the recommended DIMM population order for optimal performance?

A: Typically, populate the blue slots (primary channel) first, one DIMM per channel. For dual-socket servers, follow a balanced configuration by installing identical modules symmetrically per CPU memory controller to utilize all memory channels effectively.

Q: Does this module support overclocking or XMP profiles?

A: No, it adheres to JEDEC DDR4-3200 (PC4-25600) standards at CL22. Server-class ECC UDIMMs prioritize data integrity and stability over overclocking, thus XMP profiles are not supported.

Q: What warranty and typical failure rate can I expect?

A: This Micron module includes a 1-year warranty. Engineered for enterprise environments, it delivers exceptional reliability with an annualized failure rate (AFR) typically below 0.2%, backed by rigorous testing.

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