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Micron MTA18ADF2G72AZ-3G2R1R 16GB DDR4 UDIMM 3200MHz|ReliableECCMemory

MPN:MTA18ADF2G72AZ-3G2R1R By:Micron Warranty:1 year
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General

Product TypeMemory Module
Memory Capacity16 GB
Memory TechnologyDDR4
Product Voltage1.2V
RAM Speed3200MHz
RAM StandardDDR4-3200/PC4-25600
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL22
RankDual Rank x8
Quantity of Pins288-pin
RAM GenreUDIMM

Engineer's Note

This ECC Unbuffered DDR4-3200 UDIMM is tailored for entry-level servers and workstations where data integrity is critical, excelling in memory-intensive applications like file storage, light virtualization, and content creation workloads that demand error-free operation. Its dual-rank x8 configuration with CL22 latency delivers balanced throughput and reliable signal integrity, while the 1.2V low-voltage design ensures power efficiency without compromising the 3200MT/s speed.

Technical Specs & Insights

1. ECC protection silently corrects single-bit memory errors, preserving data integrity for always-on enterprise applications where even a minor corruption risks financial or operational disruption.
2. Unbuffered signal topology removes the register clock cycle delay, delivering the lowest possible latency for latency-sensitive virtualized microservices and edge caching nodes.
3. A 16 GB module density provides ample headroom per slot, letting small pedestal servers comfortably host multiple VMs without immediately exhausting DIMM sockets.
4. 3200 MT/s throughput nearly doubles the bandwidth of previous-generation memory, accelerating in-memory database queries and real-time log processing under sustained server loads.
5. Dual rank x8 organization interleaves internal banks to hide row-access overhead, keeping memory channels fully fed and stabilizing multi-VM responsiveness during concurrent demand spikes.

Why These Specs Matter

Built for servers and high-end workstations, this 16GB DDR4-3200 ECC Unbuffered DIMM directly addresses the silent perils of data corruption in always-on environments. The ECC engine isn’t just a specification; it’s your last line of defense against single-bit errors caused by background radiation, which would otherwise quietly corrupt customer records in a memory-intensive database like Redis or crash an entire virtualized cluster. In a scenario where a hypervisor hosts multiple VMs, one flipped bit in memory can bring down production workloads running on different virtual machines simultaneously. Here, single-symbol correction is the difference between seamless uptime and a costly 3 A.M. emergency call. Meanwhile, the dual-rank x8 organization fuels concurrent performance through rank interleaving, allowing the memory controller to read from one rank while refreshing another, which visibly reduces latency spikes during dense SQL queries or when a virtualized environment triggers simultaneous page swaps. Finally, operating at a 1.2V JEDEC standard, this module significantly shrinks your thermal footprint across a rack of 24 nodes, lowering cooling opex without sacrificing the 3200MT/s throughput that modern in-memory analytics demand.

Endurance & Reliability

Capacity Planning Guidance: 16GB DDR4-3200 ECC UDIMM

This Micron 16GB DDR4-3200 ECC Unbuffered DIMM is server-grade memory designed for entry-level servers and workstations that require data integrity without the cost of registered buffers. Proper capacity planning depends on workload characteristics, population rules, and channel architecture.

General Virtualization
Virtualized hosts demand ample memory headroom for multiple VMs and the hypervisor overhead. A single 16GB module is rarely sufficient — plan for a minimum of four identical modules (64GB total) to populate all channels on a typical single-socket platform, enabling balanced interleaving. Use a uniform dual-rank x8 configuration to maximize memory bandwidth per channel while maintaining ECC protection, and reserve 10–15% spare capacity for failover and live migration.

In-Memory Database
In-memory databases like Redis or SAP HANA thrive on both capacity and low latency. Since 16GB sticks are modest, equip all available DIMM slots with identical part numbers to reach the highest possible capacity — typically 128GB or 256GB on dual-socket boards. Running memory at the native 3200MT/s speed with tight CL22 timings ensures minimal access delays. Always install in multiples of the memory-channel count (e.g., 8 or 16 modules) to sustain full memory bandwidth under heavy read/write pressure, and never mix single-ranked DIMMs.

High-Performance Computing
HPC workloads saturate memory bandwidth with large datasets and parallel processing. For maximum throughput, use one dual-rank 16GB DIMM per channel to achieve full population with minimum ranks-per-channel penalty — typically eight identical modules on an 8-channel platform. Dual-rank x8 construction provides the best bandwidth due to rank interleaving; avoid leaving channels empty as this halves effective bandwidth. Validate that the motherboard can drive all slots at 3200MT/s without downclocking, and monitor temperature as dense configurations demand proper airflow.

Verified Compatibility

Proven compatible after rigorous testing with Dell PowerEdge R350, T350, Lenovo ThinkSystem ST50 V2, and HPE ProLiant DL20 Gen10 Plus.

FAQ

Q: Can I mix this MTA18ADF2G72AZ-3G2R1R with other memory modules of different brands or speeds?

A: Mixing modules is not recommended, especially in ECC server environments. Different brands or speeds may cause instability, disable ECC functionality, or force all DIMMs to the lowest common speed and timings.

Q: Is this memory compatible with my system?

A: This DDR4-3200 ECC UDIMM is designed for workstation and entry-level server platforms, such as Intel Xeon E-2300/E-2200 series or AMD Ryzen PRO with supporting chipsets. Verify your motherboard's ECC UDIMM support before purchase.

Q: What is the recommended DIMM population order for optimal performance?

A: Always consult your server motherboard manual. Typically, populate identical DIMMs in the furthest slot of each memory channel first (e.g., slots A2 and B2) to maximize dual-channel interleaving and maintain balanced ranks per channel.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a JEDEC-compliant DDR4-3200 CL22 server memory module with ECC. It does not support XMP profiles or overclocking and operates exclusively at standard timings for platform stability and data integrity.

Q: What warranty and typical failure rate can I expect?

A: This module carries a one-year limited warranty. As a Micron server-grade UDIMM ECC product built with major brand ICs, the annualized failure rate (AFR) is exceptionally low under specified operating conditions and valid system configurations.

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