Secure payments
Standard refund policy
Trade Assurance
| Product Type | Memory Module |
|---|---|
| Memory Capacity | 16 GB |
| Memory Technology | DDR4 |
| Product Voltage | 1.2V |
| RAM Speed | 3200MHz |
| RAM Standard | DDR4-3200/PC4-25600 |
| Error Identifying | ECC |
| Signal Type | Unbuffered |
| Column Access Strobe (CAS) | CL22 |
| Rank | Dual Rank x8 |
| Quantity of Pins | 288-pin |
| RAM Genre | UDIMM |
This UDIMM ECC module is engineered for entry-level servers and workstations where unbuffered memory with error correction is critical for data integrity in applications such as file serving, light virtualization, and technical computing. The dual-rank x8 organization at 3200MHz with CL22 latency optimizes memory bandwidth utilization, and the ECC capability reliably detects and corrects single-bit errors to prevent silent data corruption on compatible platforms.
1. ECC protection silently corrects single-bit memory errors in real time, safeguarding transactional data integrity essential for financial and database servers.
2. Unbuffered signal topology reduces access latency versus registered alternatives, giving latency-sensitive edge applications a measurable response time advantage.
3. Dual Rank x8 organization maximizes per-channel bandwidth utilization, preventing memory bottlenecks when hosting dense containerized microservices.
4. 3200 megatransfers per second delivers the throughput headroom needed to feed modern multi-core server CPUs during virtualization spikes and in-memory analytics.
5. Sixteen gigabyte capacity per module strikes an optimal balance for hyper-converged nodes, allowing sufficient VM density without excessive power draw.
Designed for entry-level servers and professional workstations, the Micron MTA18ASF2G72AZ-3G2 is a 16GB DDR4-3200 UDIMM with ECC, and its four defining characteristics translate directly into reliability and performance where they matter most. In a virtualization cluster running multiple VMs on a single host, a single bit flip in ordinary memory can silently corrupt a database or crash a guest operating system. The integrated ECC circuitry detects and corrects these errors in real time, preserving data integrity during financial transaction processing or scientific simulations without costly downtime.
When your workday involves rendering complex 3D models in an application like Blender while simultaneously serving project files to colleagues, the module’s 3200MHz speed and dual-rank x8 organization work together to deliver higher effective bandwidth. This keeps textures loading smoothly and prevents the stuttering that stalls creative flow. Meanwhile, the 1.2V operating voltage reduces thermal load inside compact workstation cases, which helps maintain stable boost clocks on neighboring components during prolonged rendering jobs. Finally, the unbuffered architecture avoids the extra latency of registered designs, giving each memory access the responsiveness required for latency-sensitive engineering analysis tools. For the IT manager or content creator who cannot afford data corruption or sluggish multitasking, this module is a clear safeguard.
General Virtualization
Deploy this 16 GB ECC UDIMM in sets of four across a quad-channel platform to reach 64 GB total, which suits most hypervisor and container workloads. Populate identical modules per channel to enable memory interleaving and maintain error-free operations under mixed-load multi-tenancy. For denser consolidation, use eight modules for 128 GB while preserving balanced channel population and reliable ECC coverage.
In-Memory Database
Maximize capacity and rank interleaving by filling all available DIMM slots with these dual-rank x8 modules. A fully populated 8-DIMM configuration yields 128 GB, allowing large datasets to reside entirely in DRAM for extreme read/write responsiveness. Pairing identical 16 GB sticks eliminates performance asymmetry and ensures consistent latency under sustained transactional pressure.
High Performance Computing
Install one DIMM per memory channel—ideally four or six modules—to deliver peak bandwidth via independent channels while keeping dual-rank parallelism active. The 3200 MT/s speed and CL22 latency suit throughput-sensitive simulation and modeling codes. Avoid mixing dissimilar capacities; uniform 16 GB ECC UDIMMs guarantee stable vectorized computation and silent data corruption protection across long-running jobs.
Rigorously tested server UDIMM ECC memory; compatible with Dell PowerEdge R350, HPE DL20 Gen10 Plus, Lenovo SR250 V2.
Q: Can I mix this MTA18ASF2G72AZ-3G2 with other memory modules of different brands or speeds?
A: Mixing is not recommended. For optimal stability, all installed ECC UDIMMs should have identical brand, speed, rank, and timings. Mismatched modules may cause POST failures or silent data corruption.
Q: Is this memory compatible with my system?
A: This ECC UDIMM is designed for server and workstation platforms supporting DDR4-3200, such as Intel Xeon E-2300 series with C252/C256 chipsets and AMD AM4/AM5 boards with ECC support. Please verify your motherboard’s QVL.
Q: What is the recommended DIMM population order for optimal performance?
A: Follow your server motherboard manual. Typically, populate identical DIMMs per channel, starting with the slots farthest from the CPU. Balance channels evenly to maintain dual-channel ECC performance.
Q: Does this module support overclocking or XMP profiles?
A: No. This module adheres strictly to JEDEC DDR4-3200 CL22 specifications. It does not support XMP or overclocking, prioritizing data integrity and 24/7 operational stability in server environments.
Q: What warranty and typical failure rate can I expect?
A: It is covered by a 1-year warranty. The module’s typical failure rate is extremely low, well within industry standards, thanks to rigorous testing and Micron’s proven manufacturing quality.