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Micron MTA18ASF4G72AZ-2G6 32GB DDR4 UDIMM 2666MT/s | Reliable ECC RAM

MPN:MTA18ASF4G72AZ-2G6 By:Micron Warranty:1 year
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General

Product TypeMemory Module
Memory Capacity32 GB
Memory TechnologyDDR4
Product Voltage1.2V
RAM Speed2666MHz
RAM StandardDDR4-2666/PC4-21300
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL19
RankDual Rank x8
Quantity of Pins288-pin
RAM GenreUDIMM

Engineer's Note

This DDR4-2666 ECC Unbuffered DIMM is tailored for entry-level servers and workstation platforms requiring data integrity, such as small business virtualization hosts or file servers. Its dual-rank x8 architecture improves memory bandwidth utilization while ECC error correction safeguards against single-bit errors, ensuring 24/7 operational stability.

Technical Specs & Insights

1. ECC error correction silently detects and fixes single-bit memory faults, protecting mission‑critical server applications from data corruption and unplanned downtime.
2. Thirty-two gigabyte module capacity raises the memory ceiling per channel, allowing IT to pack more virtual machines onto each host without performance penalties.
3. Dual Rank x8 organization interleaves access across bank groups, maintaining consistent bandwidth saturation for mixed read/write database loads.
4. The 2666 megatransfers per second data rate supplies enough throughput to keep modern server CPU cores fed during real-time analytics and in-memory caching.
5. Operating at just 1.2 volts drives down overall rack power draw, lowering cooling expenses in dense data-center deployments while preserving long-term signal stability.

Why These Specs Matter

Designed as an unbuffered ECC UDIMM, this 32GB DDR4-2666 module is purpose-built for entry-level servers and workstations where data integrity meets cost-effectiveness. Its ECC corrects single-bit errors silently, preventing a flipped bit from crashing a virtualized host or corrupting a transaction database—a critical safeguard when consolidating multiple VMs onto a single socket. The unbuffered architecture eliminates register latency inherent in RDIMMs, yielding snappier response for latency-sensitive workloads like in-memory caching with Redis. A dual-rank x8 organization lets the memory controller interleave requests across two internal ranks, significantly increasing throughput. For a database server under heavy concurrent load, this means faster query execution without populating extra DIMM slots. Operating at just 1.2V, the module slashes power draw and heat output, directly reducing cooling expenses in always-on virtualization clusters. For the IT manager, it delivers uncompromised data integrity, responsive application performance, and a lean energy footprint—all from a single high-capacity module.

Endurance & Reliability

Based on its ECC, Unbuffered, 288-pin form factor, this 32GB DDR4-2666 module targets entry-level servers and workstations. Below are capacity planning guidelines for typical server workloads.

General Virtualization
Deploy a matched pair (64 GB total) in dual-channel mode to serve moderate VM density with reliable ECC protection. For heavier consolidation, populate all four DIMM slots with identical modules to reach 128 GB, maintaining symmetric channel population and allowing generous memory overcommitment.

In-Memory Database
Install four identical modules for a full 128 GB footprint, keeping entire datasets resident in DRAM and benefiting from symmetric memory interleaving. Complement this with a high-endurance NVMe drive for fast persistence and logs, and always leave headroom for background maintenance operations.

High-Performance Computing (HPC)
Use four dual-rank x8 modules to fill the memory channels, delivering 128 GB of balanced, high-bandwidth capacity. This configuration maximizes bank-level parallelism and throughput for simulation, modeling, and data-analytics codes. Pair with a multi-core Xeon E or equivalent processor to avoid memory bottlenecks.

Verified Compatibility

Certified for server and workstation use, compatible with Dell PowerEdge T340, Lenovo ThinkStation P340, HP Z2 G4.

FAQ

Q: Can I mix this MTA18ASF4G72AZ-2G6 with other memory modules of different brands or speeds?

A: Mixing this ECC UDIMM with modules of differing brands or speeds is not recommended. Inconsistent timings can undermine error correction and lead to system instability, especially in server environments where data integrity is paramount. Use identical modules for guaranteed reliability.

Q: Is this memory compatible with my system?

A: This DDR4-2666 ECC Unbuffered DIMM is designed for workstation and entry-server platforms supporting 288-pin UDIMMs. It is validated on Intel Xeon E-2100/E-2200 series and AMD Ryzen PRO processors with compatible chipsets. Please verify your motherboard’s ECC UDIMM support through the qualified vendor list.

Q: What is the recommended DIMM population order for optimal performance?

A: For optimal performance, populate identical DIMMs per channel, following your server board's manual. Typically, this means using the farthest slot from the CPU in each channel first to maintain signal integrity, then balancing dual-rank modules symmetrically across memory channels.

Q: Does this module support overclocking or XMP profiles?

A: No. As a server-grade ECC memory module, it strictly adheres to JEDEC standard DDR4-2666 (PC4-21300) timings at 1.2V. Overclocking and XMP profiles are not supported, as operational stability and data accuracy take precedence over performance tuning in server environments.

Q: What warranty and typical failure rate can I expect?

A: This module is backed by a one-year warranty. It is engineered with Micron’s rigorous testing and high-quality components, resulting in an extremely low annualized failure rate typical of enterprise ECC DIMMs, ensuring dependable long-term operation.

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