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Micron MTA18ASF4G72AZ-3G2B1 32GB DDR4 UDIMM 3200MT/s | ECC Server RAM

MPN:MTA18ASF4G72AZ-3G2B1 By:Micron Warranty:1 year
US$622 - $673
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General

Product TypeMemory Module
Memory Capacity32 GB
Memory TechnologyDDR4
Product Voltage1.2 V
RAM Speed3200 MHz
RAM StandardDDR4-3200/PC4-25600
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL22
RankDual Rank x8
Quantity of Pins288-pin
RAM GenreUDIMM

Engineer's Note

This DDR4-3200 UDIMM module with ECC is tailored for entry-level servers and professional workstations using platforms like AMD Ryzen PRO or Intel Xeon E-series, where data integrity is critical. Its dual-rank x8 organization improves memory interleaving for higher throughput, while unbuffered ECC at CL22 delivers a balance of low latency and reliable error correction for workloads such as content creation, CAD, and light virtualization.

Technical Specs & Insights

1. ECC protection catches and corrects single-bit errors silently, safeguarding data integrity for critical workloads like financial transactions and virtualization hosts where memory faults cannot be tolerated.
2. High-density capacity allows dense server consolidation, letting you run more virtual machines or containers per node without swapping to storage, which preserves QoS under multi-tenant pressure.
3. Elevated transfer speed feeds modern multi-core server CPUs with the bandwidth they need to accelerate in-memory databases, real-time analytics, and heavy caching layers.
4. Dual rank interleaving hides precharge gaps by alternating bank accesses, keeping memory channels fully utilized during sustained read/write bursts in consolidated environments.
5. Standardized latency timing ensures glitch-free first-boot stability across a broad range of server boards and processors, reducing compatibility risks in mixed-fleet deployments.

Why These Specs Matter

The MTA18ASF4G72AZ-3G2B1 is a 32 GB DDR4-3200 UDIMM engineered for professional desktop workstations where reliability is non-negotiable, and its four core attributes directly address the real-world pain points of creators and technical users. For a 3D artist rendering an architectural flythrough overnight, the ECC error correction silently detects and fixes single-bit memory errors caused by background radiation. Without it, a flipped bit could corrupt a frame—or crash the application after hours of processing—forcing a costly restart. That same project benefits from the module’s 3200 MHz speed and dual-rank design, which sustain high bandwidth while the render engine streams massive texture libraries and scene data across all cores. During a 4K video export in DaVinci Resolve, the 1.2 V low-voltage operation keeps thermals in check inside a chassis already heated by a GPU, maintaining clock stability throughout the marathon session. The 32 GB capacity becomes indispensable when assembling a real-time motion graphics comp with dozens of high-bitrate clips, preventing disk paging that would grind the timeline to a halt. With this memory, what you gain is not just specifications on paper—it is uninterrupted creative flow, data integrity you can trust, and the certainty that your workstation will deliver predictable performance when deadlines are tight.

Endurance & Reliability

General Virtualization
A single 32GB ECC UDIMM can launch several lightweight VMs on an entry-level server. For better performance and redundancy, install two modules (64GB) in dual-channel mode. For larger consolidation, four 32GB DIMMs (128GB) populate quad-channel platforms, delivering ample headroom for diverse workloads while ECC ensures data integrity.

In-Memory Database
In-memory databases like SAP HANA thrive on pure capacity and low latency. Deploy four 32GB dual-rank ECC UDIMMs (128GB) to hold substantial datasets entirely in RAM, with quad-channel operation maximizing throughput. Scale to eight modules (256GB) if the database grows; always fill all channels evenly to sustain uniform latency and avoid bottlenecks.

High-Performance Computing (HPC)
HPC clusters need maximum bandwidth per core. Fully populate each server’s memory channels with identical 32GB dual-rank DIMMs—often six or eight modules for dual-socket Xeon E-2300 nodes. This configuration delivers 3200 MT/s across all channels, accelerates vectorized math, and the ECC capability safeguards simulation data over long runs. Plan for at least 128–256GB per node.

Verified Compatibility

Rigorously tested and verified for servers like Dell PowerEdge R250, HPE ProLiant MicroServer Gen10 Plus, and Lenovo ThinkSystem ST50.

FAQ

Q: Can I mix this MTA18ASF4G72AZ-3G2B1 with other memory modules of different brands or speeds?

A: Mixing is not recommended for servers. Unbuffered ECC modules require identical part numbers and ranks to maintain signal integrity and avoid memory training failures.

Q: Is this memory compatible with my system?

A: It is designed for Intel Xeon E-2300/E-2400 series and AMD Ryzen Pro platforms on chipsets like C256, X570, or B550 that explicitly support ECC UDIMMs.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate one identical DIMM per channel first, typically the blue slot of each bank, to enable symmetric dual-channel mode and maximize bandwidth with dual-rank interleaving.

Q: Does this module support overclocking or XMP profiles?

A: No. This JEDEC-compliant server UDIMM operates at fixed 3200 MT/s without XMP. Reliable ECC function requires running strictly at standard parameters.

Q: What warranty and typical failure rate can I expect?

A: It carries a 1-year warranty. The JEDEC-grade UDIMM exhibits an extremely low annualized failure rate, typically under 0.3%, under proper environmental conditions.

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