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Micron MTA36ASF4G72PZ-3G2R 32GB DDR4 RDIMM 3200MT/s | Reliable ECC

MPN:MTA36ASF4G72PZ-3G2R By:Micron Warranty:1 year
US$568 - $615
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General

Product TypeMemory Module
Memory Capacity32 GB
Memory TechnologyDDR4
Product Voltage1.2 V
RAM Speed3200 MHz
RAM StandardDDR4-3200/PC4-25600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL22
RankDual Rank x4
Quantity of Pins288-pin
RAM GenreRDIMM

Engineer's Note

This 32GB DDR4-3200 RDIMM with ECC and registered signaling is engineered for enterprise servers running memory-intensive workloads such as virtualization, in-memory databases, and mission-critical applications where data integrity cannot be compromised. Its dual-rank x4 configuration maximizes bandwidth and capacity per channel while maintaining stable operation under full load, and the CL22 latency at 1.2V balances power efficiency with consistent error correction.

Technical Specs & Insights

1. ECC protection detects and corrects single-bit errors in real time, safeguarding financial transactions and in-memory databases against silent data corruption that could otherwise cause costly downtime.
2. Registered signal buffering reduces the electrical load on the memory controller, enabling densely populated servers to maintain rock-solid stability even with massive RAM configurations.
3. A 32-gigabyte capacity per module allows a single 2U server to host far more virtual machines or containerized microservices without sacrificing memory headroom for hypervisor overhead.
4. The 3200 megahertz transfer rate elevates memory bandwidth, accelerating real-time analytics and large-scale inference workloads that repeatedly scan in-memory datasets.
5. Dual rank x4 organization interleaves accesses across internal banks, keeping the server’s multi-channel memory subsystem fully utilized and delivering consistent throughput under heavily consolidated virtualization.

Why These Specs Matter

The Micron MTA36ASF4G72PZ-3G2R is a 32GB DDR4-3200 RDIMM engineered for enterprise servers, and its four defining characteristics directly confront the reliability and scalability challenges that keep data center architects awake at night.

Its ECC capability neutralizes silent data corruption caused by cosmic radiation or electrical noise — a single uncorrected bit flip in a financial transaction database or a virtualized guest’s kernel memory can cascade into catastrophic billing errors or node crashes. Combined with Registered signal buffering, this module lets you populate all channels of a 2U virtualization host without overloading the memory controller, preserving rock-solid stability when you are orchestrating two dozen live-migrating VMs. The dual-rank x4 organization maximizes interleaving, slashing access latency for in-memory analytics platforms like Redis or SAP HANA under pounding user concurrency. Backed by a native 3200 MT/s transfer rate at a low 1.2V, it delivers the bandwidth needed to keep multi-socket database joins fluent and the thermal headroom to run dense hyperscale racks efficiently. This is not just a memory spec — it is a blueprint for workload uptime and quality of service that your business depends on.

Endurance & Reliability

General Virtualization
Populate all memory channels per CPU—typically eight 32GB RDIMMs—for 256GB per socket at 3200MT/s. The 1.2V dual-rank ECC design supports dense VMs efficiently, and the registered buffer ensures stability with large memory footprints. Four modules per socket (128GB) is acceptable, but full-channel population avoids NUMA bottlenecks.

In-Memory Database
Fill all DIMM slots; a dual-socket server with 12 slots per CPU yields 768GB using these 32GB dual-rank RDIMMs. Rank interleaving from the x4 organization lowers latency for in-memory databases such as Redis. ECC and registered buffering provide critical data integrity under heavy writes, and one DIMM per channel sustains full speed.

High-Performance Computing (HPC)
Use one 32GB RDIMM per memory channel (8 or 12 per CPU) to achieve maximum DDR4-3200 bandwidth. Dual-rank enhances bank-level parallelism for simulation codes; ECC prevents silent data corruption over multi-day runs. Symmetric population across channels yields 256–384GB per node, and avoiding more than one DIMM per channel preserves peak frequency, ideal for MPI workloads.

Verified Compatibility

Proven server reliability. Compatible with Dell PowerEdge R750, HPE ProLiant DL380 Gen10, Lenovo ThinkSystem SR650 V2, and more.

FAQ

Q: Can I mix this MTA36ASF4G72PZ-3G2R with other memory modules of different brands or speeds?

A: Mixing modules is not recommended. For reliable server operation, use identical RDIMMs with the same speed, rank, and ECC type. Mismatched modules may cause boot failures or memory errors.

Q: Is this memory compatible with my Intel Xeon or AMD EPYC server?

A: Yes, this DDR4-3200 RDIMM is designed for servers using Intel Xeon Scalable or AMD EPYC 7002/7003 series. Verify your motherboard supports registered ECC memory and check the official memory QVL.

Q: What is the recommended DIMM population order for optimal performance?

A: Follow your server motherboard guidelines. Typically, populate identical DIMMs in the same memory channel slots first. For dual-processor systems, ensure balanced memory configuration across both processors.

Q: Does this module support overclocking or XMP profiles?

A: No. This is an enterprise-grade registered ECC module adhering to JEDEC standards. It operates at fixed 3200 MT/s with CL22 latency; overclocking or XMP is not supported for data integrity.

Q: What warranty and typical failure rate can I expect?

A: This module includes a 1-year warranty. Server RDIMMs have a very low annualized failure rate (below 0.5%), ensuring high reliability for mission-critical workloads.

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