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Samsung M393B2G70QH0-YH9 16GB DDR3 RDIMM 1333MT/s | Reliable ECC RAM

MPN:M393B2G70QH0-YH9 By:Samsung Warranty:1 year
US$43 - $46
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General

Product TypeMemory Module
Memory Capacity16 GB
Memory TechnologyDDR3
Product Voltage1.35 V
RAM Speed1333 MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

This DDR3-1333 Registered ECC RDIMM, operating at a low 1.35V, is purpose-built for server platforms that demand uncompromising data integrity under sustained memory loads. Its dual-rank x4 organization and registered signaling enhance signal stability and channel utilization, making it ideal for memory-dense virtualization clusters and database servers where ECC is essential to prevent silent data corruption.

Technical Specs & Insights

1. ECC protection silently corrects single-bit errors, safeguarding transactional data integrity in financial or database workloads.
2. Registered signal buffering stabilizes high-density memory configurations, enabling reliable scaling across multiple DIMMs per channel.
3. The low-voltage operation reduces power consumption and cooling overhead in dense server racks without sacrificing throughput.
4. Dual rank x4 organization interleaves memory accesses, boosting sustained bandwidth for virtualized environments under heavy load.
5. Ample module capacity supports larger memory footprints per server, increasing VM consolidation ratios and reducing total cost of ownership.

Why These Specs Matter

The Samsung M393B2G70QH0-YH9 is a 16GB DDR3 RDIMM built specifically for server workloads, where its ECC, registered buffer, dual-rank x4 layout, and 1.35V operation directly confront the real costs of downtime and inefficiency. In virtualization clusters, uncorrected memory errors from background radiation can silently corrupt hypervisor data or crash multiple guest VMs. ECC actively detects and fixes single-bit flips, preserving the integrity of your entire virtual fleet without manual intervention. The registered clock driver buffers command and address signals, which stabilizes the memory bus when populating all DIMM slots—this means you can confidently scale a host to hundreds of gigabytes for dense VM hosting without signal degradation. The dual-rank x4 architecture interleaves internal banks to deliver higher bandwidth and lower effective latency, a tangible advantage for in-memory databases like Redis or SAP HANA where microsecond delays directly impact transaction response times. Simultaneously, operating at 1.35V instead of 1.5V trims power consumption roughly twenty percent, reducing cooling overhead in blade chassis and allowing servers to sustain peak throughput within strict thermal budgets. Together, these four engineered characteristics transform the DIMM into a reliability and efficiency pillar for modern data centers.

Endurance & Reliability

General Virtualization
For typical hypervisor workloads, install modules in balanced sets across all memory channels to maximize throughput. A starting configuration of six 16GB RDIMMs (96GB total) per dual-socket server allows comfortable overcommit ratios for mixed virtual machines. Scale in identical 16GB sticks to retain uniform rank loading, avoiding performance drops from mixed capacities.

In-Memory Database
Low-latency datasets demand the largest possible capacity with registered ECC stability, so fully populate the server with 16GB dual-rank x4 RDIMMs. The 1.35V low-voltage rating helps reduce thermal output in densely packed nodes, sustaining clock margins during sustained high-load operations. Prioritize matching kits over mixed batches to prevent subtle signal integrity issues on the memory bus.

High-Performance Computing
HPC jobs benefit from populating all memory channels with identical 16GB modules, enabling peak bandwidth while maintaining ECC reliability for long-running simulations. Registered DIMMs support higher per-channel capacities, making them ideal for scaling to 128GB–256GB per node without sacrificing speed. The DDR3-1333 CAS 9 timing offers predictable access patterns, and the dual-rank design can improve interleaving in compute-bound workloads.

Verified Compatibility

Server memory, rigorously tested for Dell PowerEdge R720, HP DL380p Gen8, and Lenovo ThinkServer RD430.

FAQ

Q: Can I mix this M393B2G70QH0-YH9 with other memory modules of different brands or speeds?

A: Mixing is not recommended. For server environments, identical modules ensure stability. Different brands or speeds may cause compatibility issues, reduced performance, or system instability under ECC registered operation.

Q: Is this memory compatible with my server system?

A: This DDR3-1333 ECC Registered RDIMM supports platforms like Intel Xeon E5-2600 series or AMD Opteron 6300 series. Verify your motherboard’s QVL and ensure support for 1.35V low-voltage registered DIMMs before purchase.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical modules per channel starting with slot 1 of each memory bank (e.g., blue slots first). Follow your server board’s manual for balanced interleaving. Typically, group dual-rank x4 DIMMs symmetrically across memory channels.

Q: Does this module support overclocking or XMP profiles?

A: No. This server-grade RDIMM adheres strictly to JEDEC standards for reliability. It does not support XMP or overclocking, as stability is paramount in enterprise environments like those served by this ECC memory.

Q: What warranty and typical failure rate can I expect?

A: This module includes a 1-year warranty. Typical annualized failure rate for enterprise DDR3 RDIMMs is under 1% under specified operating conditions, backed by rigorous component screening and burn-in testing.

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