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| Model | M393B2G70BH0-CK009 |
|---|---|
| Compliance Standards | EU RoHS,FCC |
| Product Type | Memory Module |
| Memory Capacity | 16 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.5V |
| RAM Speed | 1333MHz |
| RAM Standard | DDR3-1333/PC3-10600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL9 |
| Rank | Dual Rank x4 |
| Quantity of Pins | 240-pin |
| RAM Genre | RDIMM |
This Samsung M393B2G70BH0-CK009 is a server-grade DDR3 RDIMM tailored for virtualization, in-memory databases, and other enterprise workloads requiring uncompromising data integrity. Its ECC and registered architecture, combined with a dual-rank x4 organization, delivers reliable signal integrity and higher memory density scalability in multi-DIMM configurations while maintaining a CAS latency of 9 at 1333MHz.
1. ECC protection detects and corrects single-bit errors in real time, ensuring data integrity for mission-critical database and financial transaction workloads.
2. Registered signal buffering stabilizes command and address lines across fully loaded memory channels, enabling reliable high-density server configurations without signal degradation.
3. Dual Rank x4 organization interleaves memory accesses across internal banks, maintaining channel throughput under heavy simultaneous VM and container consolidation.
4. Generous per-module capacity supports dense virtualization footprints, allowing more guest instances per host and reducing the need for disruptive mid-life hardware upgrades.
5. Elevated clock speed provides the sustained bandwidth required to keep multi-core server processors fed, preventing memory-bound stalls in throughput-intensive analytics environments.
The Samsung M393B2G70BH0-CK009 is a 16GB DDR3-1333 RDIMM purpose-built for enterprise servers, and its four key attributes directly address the reliability and capacity demands of data center workloads. Error-Correcting Code (ECC) continuously scans for and corrects single-bit memory errors, a crucial safeguard against silent data corruption that could crash multiple virtual machines in a dense consolidation cluster. Registered signal buffering then decouples the memory controller from the DRAM loads, allowing you to fully populate all DIMM slots without signal degradation; this stability is vital when provisioning massive memory pools for heavyweight virtualization hosts. The Dual Rank x4 organization uses bank interleaving to boost effective bandwidth, which accelerates in-memory databases like SAP HANA or Redis, delivering lower query latencies and higher transactions per second. Meanwhile, the 16GB capacity and CL9 latency let you allocate generous memory to each VM or database instance, preventing swap thrashing and maintaining consistent responsiveness. Together, these features ensure that your virtualized infrastructure and real-time analytics platforms stay error-free, scalable, and performant around the clock.
General Virtualization
Equip dual-socket servers with identical 16 GB RDIMMs across all memory channels, targeting 256 GB (16 x 16 GB) to support dense VM consolidation. Distribute modules symmetrically between CPUs to leverage NUMA optimizations and maintain balanced memory access for consistent guest performance.
In-Memory Database
Maximize total capacity by populating every available slot with these ECC Registered DIMMs—a 24-slot platform can deliver 384 GB to host large in-memory datasets. The dual-rank x4 design and error correction safeguard data integrity, which is essential for preventing silent corruption in transactional databases.
High-Performance Computing (HPC)
Prioritize memory bandwidth by installing one 16 GB module per channel across all processors; an eight-channel dual-socket system starts at 128 GB for peak throughput. If greater capacity is needed, add a second identical DIMM per channel while verifying that the platform can sustain the rated 1333 MHz speed. Uniform RDIMM population ensures reliability during long-running simulations and parallel computations.
Rigorously tested server DDR3. Compatible: Dell R720, HP DL380p G8, Lenovo RD630.
Q: Can I mix this M393B2G70BH0-CK009 with other memory modules of different brands or speeds?
A: Mixing is not advised. In servers, all DIMMs should share identical part numbers, speed, and rank to ensure signal integrity. Disparate modules often cause ECC errors or system instability.
Q: Is this memory compatible with my system?
A: This DDR3-1333 Registered ECC RDIMM works with server boards that accept 240-pin, 1.5V Registered DDR3 memory. It typically fits Intel Xeon E5-2600 v2 and AMD Opteron 6300 platforms. Please check your server’s QVL for confirmation.
Q: What is the recommended DIMM population order for optimal performance?
A: Populate identical DIMMs in pairs per channel, beginning with the first slot (commonly blue) of each memory bank. Balance total capacity equally across both processor sockets to maximize interleaving and memory bandwidth.
Q: Does this module support overclocking or XMP profiles?
A: No. As a server-grade Registered ECC module, it strictly follows JEDEC DDR3-1333 specifications. Overclocking and XMP are not supported because data integrity and rock-solid stability are paramount in server environments.
Q: What warranty and typical failure rate can I expect?
A: It includes a 1-year warranty. Enterprise RDIMMs like this one demonstrate very low annualized failure rates, generally below 0.5%, providing exceptional reliability for mission-critical operations.