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Samsung M393B2G70BHO-YH9 16GB DDR3 RDIMM 1333MT/s | Reliable Reg. ECC

MPN:M393B2G70BHO-YH9 By:Samsung Warranty:1 year
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General

ModelM393B2G70BHO-YH9
Product TypeMemory Module
Compliance StandardsCE,WEEE,RoHS
Memory Capacity16 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

Designed for legacy server platforms, this Samsung 16GB DDR3-1333 Registered ECC module (M393B2G70BHO-YH9) is optimized for memory-intensive enterprise workloads such as virtualization, in-memory databases, and mission-critical applications where data integrity is non-negotiable. Its Dual Rank x4 organization and 1.35V low-voltage operation enhance signal stability and power efficiency, while Registered ECC with CL9 latency ensures robust error correction and reliable performance in multi-DIMM configurations.

Technical Specs & Insights

1. Registered signal type buffers address and command lines to maintain signal integrity across large memory populations, enabling dense server configurations without sacrificing reliability.
2. ECC error correction actively detects and fixes single-bit memory faults, preserving data integrity for mission-critical workloads where even silent corruption is unacceptable.
3. Dual Rank x4 organization interleaves access across multiple banks of DRAM, boosting effective bandwidth and reducing latency under the concurrent query loads typical in virtualized environments.
4. 1.35V low-voltage operation cuts overall server power draw and cooling demands, directly lowering total cost of ownership in hyperscale data centers.
5. 16GB capacity per module maximizes memory density within limited DIMM slots, allowing hosting of more virtual machines and larger in-memory databases per physical host.

Why These Specs Matter

This Samsung DDR3L RDIMM (M393B2G70BHO-YH9) is a 16GB server memory module meticulously engineered for enterprise environments. Its four defining attributes directly address critical infrastructure demands. First, ECC protection continuously corrects single-bit errors and detects multi-bit faults, a non-negotiable safeguard for financial transaction databases or hypervisors where silent data corruption translates to monetary loss or system crashes. Second, the registered signal buffer stabilizes command and address lines, enabling dense server configurations—think fully populated 24-slot virtualization hosts—without signal degradation, ensuring that a fleet of virtual machines runs reliably under load. Third, the dual-rank x4 organization maximizes bandwidth efficiency through rank interleaving; in memory-bound database caches like Redis, this reduces fetch latency and sustains high IOPS, keeping in-memory queries snappy. Finally, operating at a low 1.35V, the module slashes power consumption per cycle, directly lowering OpEx in data centers by reducing cooling overhead across thousands of nodes. This combination delivers predictable, energy-efficient, and rock-solid memory performance for mission-critical workloads where uptime and data integrity are non-negotiable.

Endurance & Reliability

General Virtualization
For general virtualization hosts, populate all memory channels with these 16GB RDIMMs to balance capacity and bandwidth. A common configuration is four or eight modules per CPU socket (64–128GB total) to comfortably run dozens of virtual machines and maintain NUMA awareness. The 1.35V low-voltage operation also reduces power and cooling overhead in dense server farms.

In-Memory Database
In-memory databases demand maximum capacity and data integrity. Fill every available DIMM slot with these 16GB registered ECC modules, targeting 256GB or more per node. Using dual-rank x4 modules across all channels delivers strong interleaving and signal reliability, while built-in ECC protects against corruption during sustained heavy write and read loads.

High-Performance Computing
For HPC, memory bandwidth is critical. Install one 16GB RDIMM per channel to sustain the full rated 1333MHz speed, typically yielding 96–128GB in a dual-socket node. The registered ECC design and 1.35V efficient operation deliver the stability and low energy draw required for long-running parallel simulations and data-intensive calculations.

Verified Compatibility

Rigorously tested, compatible with Dell PowerEdge R720, HP ProLiant DL380p Gen8, and similar servers.

FAQ

Q: Can I mix this M393B2G70BHO-YH9 with other memory modules of different brands or speeds?

A: Mixing this registered ECC RDIMM with modules of different brands or speeds is not recommended. It may cause instability or fail to POST, as server platforms require identical DIMM specifications for reliable multi-channel operation.

Q: Is this memory compatible with my system?

A: This DDR3-1333 registered ECC module is designed for server platforms supporting Intel Xeon E5-2400/E5-2600 v1/v2 or AMD Opteron 6300 series. Verify your board explicitly supports 1.35V, 16GB Dual Rank x4 RDIMMs.

Q: What is the recommended DIMM population order for optimal performance?

A: Follow your server board’s manual; typically populate identical DIMMs in blue slots first for Channel A/B. For dual-socket systems, balance memory across both CPUs to maintain uniform memory access and maximize throughput.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a server-grade registered DIMM with ECC, designed for stability at JEDEC standard DDR3-1333. It does not support overclocking, XMP profiles, or any timing manipulation; such features are exclusive to desktop memory.

Q: What warranty and typical failure rate can I expect?

A: This module includes a one-year warranty. Its typical annualized failure rate (AFR) is extremely low, under 0.5%, when operated within specified voltage and temperature ranges in a compliant server environment.

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