General

Engineer's Note

Designed as a VLP Registered ECC DDR3 module, this Samsung M392B2G70DM0-YK002 is ideal for dense 1U/2U server deployments and memory-intensive workloads like virtualization and in-memory databases. Its dual-rank x4 organization and 1.35V low-voltage operation maximize signal integrity and thermal efficiency while the ECC and registered architecture ensure robust data integrity under sustained heavy loads.

Technical Specs & Insights

1. ECC error correction silently intercepts and fixes single-bit memory faults, preserving data integrity for transactional databases and preventing unplanned server downtime.
2. Registered buffering stabilizes high-density memory channels, allowing IT architects to populate many DIMMs per server for robust virtualization consolidation without signal degradation.
3. Dual rank x4 interleaving keeps the memory pipeline saturated under heavy loads, sustaining consistent throughput during simultaneous live migrations and analytics queries.
4. The very low-profile form factor ensures optimal board spacing in dense rack servers, improving active cooling efficiency to curb thermal throttling in round‑the‑clock data centers.
5. Sixteen gigabyte capacity per stick raises the memory ceiling per socket, enabling more virtual machines or containers to run concurrently without dipping into high-latency swap storage.

Why These Specs Matter

The M392B2G70DM0-YK002 is a server-grade DDR3 VLP RDIMM, engineered for environments where uptime and data integrity are non-negotiable. When you deploy a dense virtualization cluster, ECC memory quietly corrects single-bit errors caused by cosmic rays or electrical noise before they corrupt a live VM, preventing silent data corruption that could cascade into application failures. The registered signal buffer isolates the memory controller from heavy load, allowing these 16 GB modules to scale seamlessly across 24-slot servers without timing instability—critical when you consolidate dozens of tenants onto one box. Its dual-rank x4 organization leverages rank interleaving to keep data flowing while one rank refreshes, directly accelerating memory-hungry in-memory databases like SAP HANA. As a Very Low Profile module running at just 1.35V, it also reduces power draw and improves airflow in blade chassis, cutting thermal strain so your hosting farm sustains performance density without throttling. Every attribute directly safeguards the reliability, capacity, and energy efficiency your enterprise services demand.

Endurance & Reliability

The M392B2G70DM0-YK002 is a 16GB DDR3-1600 ECC Registered VLP RDIMM designed for space- and power-constrained servers. Capacity planning must consider the host’s channel count and workload profile.

General Virtualization
In a dual-socket server with four channels per CPU, install one 16GB DIMM per channel for 128GB total, enabling full interleaving for ~25 mixed VMs. Increase to two DIMMs per channel (256GB) when VM density grows, using identical modules to maintain reliability.

In-Memory Database
Maximize capacity to hold entire datasets in RAM. Fill all available slots—commonly 24 in a 2P server—with these 16GB RDIMMs to obtain 384GB. The dual-rank x4 organization provides low latency for real-time analytics; ensure a matched set per channel to avoid calibration faults.

High Performance Computing
Achieve peak bandwidth by deploying two DIMMs per channel (2DPC) across all channels. For a node with 8 channels, 16 x 16GB delivers 256GB and sustains 1600MHz operation. The VLP profile improves chassis airflow, critical for dense compute clusters.

Verified Compatibility

Rigorously tested server memory, compatible with Dell PowerEdge R720/R620, HP ProLiant DL380p Gen8, and IBM System x3650 M4.

FAQ