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| Model | M392B2G70DM0-CK0 |
|---|---|
| Product Type | Memory Module |
| Compliance Standards | EU RoHS,FCC |
| Memory Capacity | 16 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.5V |
| RAM Speed | 1600MHz |
| RAM Standard | DDR3-1600/PC3-12800 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL11 |
| Rank | Dual Rank x4 |
| Quantity of Pins | 240-pin |
| RAM Genre | VLP RDIMM |
This DDR3-1600 registered ECC VLP RDIMM is engineered for server platforms where data integrity and high memory density are critical, such as virtualization hosts and in-memory databases. Its dual-rank x4 configuration and registered signaling enhance signal stability and memory bandwidth, while the very low-profile form factor ensures compatibility with space-constrained 1U rack servers and dense blade enclosures.
1. ECC error correction silently detects and fixes single-bit memory faults in real time, preserving data integrity for mission‑critical databases and long‑running virtualization hosts that cannot afford silent corruption.
2. Registered clock driver architecture buffers command and address signals, stabilizing large‑memory configurations so fully loaded server boards maintain reliable signal margin under extreme multi‑DIMM population.
3. Substantial module capacity allows dense virtual machine and container consolidation, increasing workload per physical host while keeping latency‑sensitive in‑memory datasets off swap storage.
4. Dual Rank x4 organization maximizes bank‑group interleaving and channel utilization, delivering sustained bandwidth when simultaneous analytics queries or multiple VMs compete for memory access.
5. Very low‑profile design reduces airflow obstruction in compact 1U servers and blade enclosures, lowering fan power draw and improving thermal headroom for continuous around‑the‑clock operation.
The Samsung M392B2G70DM0-CK0 is a 16GB DDR3-1600 VLP Registered DIMM engineered to eliminate the most persistent risks in data center operations. Its Registered buffer ensures clean command and address signaling even when you fully populate all 24 DIMM slots in a virtualization host, meaning VM density never forces you to compromise on signal stability or risk random system crashes. ECC protection silently corrects single-bit errors induced by cosmic radiation, preventing silent data corruption in memory-hungry databases like SAP HANA where transactional accuracy is absolutely non-negotiable. The Dual Rank x4 architecture interleaves memory accesses to deliver higher effective throughput, while the x4 chip width underpins advanced Chipkill-like resilience, essential for financial analytics platforms where a single DRAM failure must not halt the entire server. Finally, its Very Low Profile form factor maximizes airflow in dense 1U servers and blade enclosures, directly reducing fan speeds and cooling overhead as you scale out. Together, these four traits mean you deploy servers with unwavering confidence in data integrity, uptime, and total cost of ownership.
This is server memory (DDR3-1600 ECC Registered VLP RDIMM). Capacity planning must balance channel population rules, rank count, and memory speed impacts typical of dual-socket platforms. The 16GB dual-rank x4 modules suit dense, power-conscious configurations.
General Virtualization
Populate all memory channels identically to maximize throughput. Aim for 2 DIMMs per channel (2DPC) with these dual-rank modules – on a dual-socket system with 8 channels this yields 256GB at 1600MHz. Reserve one or two slots per riser for future growth, keeping configurations symmetrical across NUMA nodes.
In-Memory Database
Maximize capacity while protecting data integrity. Fill all 24 DIMM slots of a typical 2-socket server: 24 x 16GB provides 384GB, ideal for large dataset caching. Operate at 2DPC/3DPC with rank multiplexing; expect a slight speed drop to 1333MHz or 1066MHz at 3DPC, which is acceptable for capacity-bound workloads.
High-Performance Computing (HPC)
Prioritize memory bandwidth and latency. Install one DIMM per channel (1DPC) to maintain the full 1600MHz speed, e.g., 8 x 16GB = 128GB per node. Use identical VLP modules in all channels to avoid performance cliffs. For memory-bandwidth-bound codes, this lean configuration keeps dual-rank access parallelism while minimizing electrical loading on the bus.
Rigorously tested, guaranteed compatible with Dell R720, HP DL380 Gen8, and similar ECC registered servers.
Q: Can I mix this M392B2G70DM0-CK0 with other memory modules of different brands or speeds?
A: Mixing different brands or speeds is strongly discouraged for Registered ECC memory. It may cause signal integrity issues, system instability, or unbootable configurations. Always use identical modules with the same part number for validated compatibility.
Q: Is this memory compatible with my system?
A: This DDR3-1600 Registered ECC VLP RDIMM is designed for dual-socket servers using Intel Xeon E5-2400/2600 v1/v2 or AMD Opteron 6300 platforms. Verify that your motherboard supports 1.5V, 240-pin ECC RDIMM and dual-rank x4 organization.
Q: What is the recommended DIMM population order for optimal performance?
A: Follow your server’s population guide, typically populating identical DIMMs per channel starting with the farthest slot from the CPU. Balance ranks across memory channels to maximize bandwidth; consult the platform manual for exact sequences to avoid performance penalties.
Q: Does this module support overclocking or XMP profiles?
A: No, this module adheres strictly to JEDEC DDR3-1600 CL11 standards. Enterprise Registered memory prioritizes data integrity and stability over overclocking; XMP profiles are not supported and any off-spec operation is not recommended.
Q: What warranty and typical failure rate can I expect?
A: This memory carries a one-year warranty. As an enterprise-grade Registered ECC module built for 24/7 operation, it exhibits an extremely low failure rate with a typical MTBF exceeding 2 million hours under normal operating conditions.