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Samsung M321R2GA3BB0-CQKOL 16GB DDR5 RDIMM 4800MT/s | Server ECC RDIMM

MPN:M321R2GA3BB0-CQKOL By:Samsung Warranty:1 year
US$614 - $665
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General

Product TypeMemory Module
Memory Capacity16 GB
Memory TechnologyDDR5
Product Voltage1.1 V
RAM Speed4800 MHz
RAM StandardDDR5-4800/PC5-38400
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL40
RankSingle Rank x8
Quantity of Pins288-pin
RAM GenreRDIMM

Engineer's Note

This DDR5-4800 Registered ECC RDIMM in a 16GB single-rank x8 configuration minimizes electrical loading and maximizes signal integrity, making it ideally suited for enterprise servers running memory-intensive virtualization and in-memory database workloads. Its registered signaling and onboard ECC jointly guarantee data integrity and rock‑solid stability in dense, multi‑DIMM deployments under sustained heavy load.

Technical Specs & Insights

1. ECC memory protection ensures resilient data integrity under continuous operation, critical for preventing silent errors during real-time transaction processing and database commits.
2. Registered signal buffering enables stable operation across high-density memory configurations, allowing IT architects to scale server memory capacity without compromising signal integrity.
3. Cutting-edge DDR5 technology delivers elevated bandwidth and improved power efficiency, directly boosting throughput for concurrent virtualized workloads and container orchestration.
4. Meaningful module capacity allows a single server node to host more tenants and services, maximizing consolidation ratios while controlling datacenter footprint.
5. Fast interface speed accelerates data movement between CPU and memory, reducing latency spikes during memory-intensive batch jobs and in-memory analytics.

Why These Specs Matter

The Samsung M321R2GA3BB0-CQKOL is a server-grade DDR5 Registered DIMM, purpose-built for data centers and enterprise workloads where a single memory error can cascade into financial loss or service outages. In dense virtualization clusters hosting dozens of virtual machines, its Registered signal architecture buffers the command bus to maintain rock-solid electrical stability across multiple modules per channel. This directly prevents boot failures and mid-operation crashes when scaling to terabyte-scale memory pools. Meanwhile, the on-die ECC scrubbing provides continuous error correction, which is non-negotiable for in-memory databases like SAP HANA or Redis that compute financial transactions against live data. A silent bit flip in such environments does not just corrupt a row; it can silently propagate flawed analytics or pricing decisions. Beyond protection, DDR5-4800 with Single Rank x8 design elevates bandwidth efficiency under heavy concurrent access patterns, meaning virtualized OLTP workloads experience measurably lower latency and higher throughput. This translates into faster query responses for your customers and a tangible reduction in server node sprawl, directly lowering both OpEx and TCO across the lifecycle of your infrastructure.

Endurance & Reliability

The memory is a server-class DDR5 Registered DIMM (RDIMM) with ECC — 16GB capacity, 4800MT/s, CL40, single‑rank x8. Below are capacity planning recommendations for typical server workloads.

General Virtualization
For consolidating multiple VMs, balance density and cost. In a dual‑socket server with 8 memory channels per socket, install at least one 16GB RDIMM per channel (16 modules total) for 256GB — enough for 20–30 average VMs. Expand by adding a second DIMM per channel to reach 512GB, noting that memory speed may drop to 4400MT/s. Always deploy identical modules per channel to maintain ECC reliability and NUMA symmetry.

In‑Memory Database
Databases like Redis or SAP HANA demand maximum capacity and data integrity. Fill all memory channels with these 16GB RDIMMs to achieve 512GB or more (e.g., 32 modules in a 2‑socket system). Start with one DIMM per channel to preserve 4800MT/s; if greater capacity requires 2 DIMMs per channel, plan for the speed trade‑off. ECC protection is critical — never mix non‑ECC memory.

High‑Performance Computing
For HPC workloads, memory bandwidth is paramount. Populate every memory channel with one 16GB RDIMM per socket (typically 8 modules per CPU, 128GB per socket) to maintain the highest bandwidth. Match the DIMM population identically across sockets to avoid unbalanced inter‑socket traffic. Avoid installing more than one DIMM per channel unless capacity forces it, as the frequency drop can degrade parallel simulation or modeling performance.

Verified Compatibility

Rigorously tested DDR5 ECC RDIMM, compatible with Dell PowerEdge R760, HPE ProLiant DL380 Gen11, Lenovo ThinkSystem SR650 V3.

FAQ

Q: Can I mix this M321R2GA3BB0-CQKOL with other memory modules of different brands or speeds?

A: Mixing is not recommended for server environments. This M321R2GA3BB0-CQKOL registered DIMM requires identical part numbers to ensure signal integrity, RAS features, and stability across all memory channels.

Q: Is this memory compatible with my server system?

A: This DDR5-4800 RDIMM with ECC is validated for current Intel Xeon Scalable (Sapphire Rapids) and AMD EPYC 9004 Series platforms. Please consult your server board’s qualified vendor list to confirm slot and rank support.

Q: What is the recommended DIMM population order for optimal performance?

A: To maximize memory bandwidth, populate identical RDIMMs per channel, starting with the farthest slot from the CPU. Follow the specific balance and population guidelines in your server's technical manual for the given processor architecture.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a JEDEC-compliant, registered server memory module. It does not support overclocking or XMP profiles, as operational stability and error-free data integrity via ECC take priority over speed adjustments.

Q: What warranty and typical failure rate can I expect?

A: This module includes a one-year warranty. Designed for 24/7 data center workloads, it delivers high MTBF. Actual field failure rates are extremely low due to rigorous component screening and burn-in testing before shipment.

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