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Samsung M392B5670EH1-CH9 2GB DDR3 VLP RDIMM 1333MT/s | Reliable ECC

MPN:M392B5670EH1-CH9 By:Samsung Warranty:1 year
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General

ModelM392B5670EH1-CH9
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity2 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankSingle Rank x4
Quantity of Pins240-pin
RAM GenreVLP RDIMM

Engineer's Note

Designed for space-constrained 1U/2U rack servers, this Samsung VLP RDIMM delivers 2GB of DDR3-1333/PC3-10600 capacity with ECC and registered signal integrity, making it ideal for virtualization, in-memory databases, and workloads where data accuracy is paramount. Its single-rank x4 configuration and CL9 CAS latency reduce electrical loading on the memory bus, enabling stable operation in fully populated 24/7 environments.

Technical Specs & Insights

1. ECC protection corrects single-bit errors on the fly, preserving data integrity in mission-critical enterprise databases and preventing silent data corruption.
2. Registered signal buffering stabilizes high-density memory configurations, enabling seamless scaling across all DIMM slots in large-scale server deployments.
3. Very low-profile RDIMM form factor unlocks airflow-optimized cooling in dense 1U/2U server chassis, reducing thermal throttling and improving system longevity.
4. Single rank x4 organization delivers predictable access latency and balanced command bus loading, ideal for environments prioritizing consistent response times over maximum capacity.
5. Low single-digit CAS latency minimizes data access delays, sustaining fast response times for caching and middleware applications.

Why These Specs Matter

Judging by its Registered ECC architecture and VLP RDIMM form factor, M392B5670EH1-CH9 is unequivocally a server memory module, purpose‑built for mission‑critical data center workloads. Its four defining characteristics translate directly into tangible uptime and performance gains where consumer RAM would fail.

The integrated ECC engine continuously detects and corrects single‑bit errors in real time—an absolute necessity for memory databases like Redis or SAP HANA, where a silent bit flip could corrupt a financial transaction or crash a live analytics node. The Registered buffer then steps in to stabilize signal integrity across fully populated 24‑DIMM servers, enabling dense virtualization clusters to host dozens of VMs without memory‑related kernel panics. Unlike standard‑height modules, the Very Low Profile design frees up airflow in 1U rack enclosures, lowering operating temperatures and preventing thermal throttling in compute‑intensive rendering farms. Finally, the Single Rank x4 organization and 1333MHz clock rate strike an ideal balance between command‑rate efficiency and sustained bandwidth, ensuring that a hypervisor can service simultaneous I/O requests with consistent, low‑latency access—critical when your entire business logic runs in‑memory. In essence, this module turns unpredictable hardware degradation into a manageable, reliable foundation.

Endurance & Reliability

General Virtualization
For general virtualization hosts running multiple VMs, this 2GB Registered ECC DDR3-1333 module is best deployed in balanced quantities. Populate at least six to eight identical modules across all memory channels to maximize interleaving and memory bandwidth, while ECC ensures VM stability. Aim for 24GB to 32GB total capacity on a dual-socket platform to comfortably run a dozen light to medium workloads.

In-Memory Database
In-memory databases demand both capacity and data integrity, making registered ECC mandatory. To support datasets entirely in RAM, fully populate every DIMM slot with these 2GB RDIMMs, reaching 128GB or more on a typical two-socket server. The 1.5V operation and x4 organization provide reliable, low-latency access critical for high-throughput transactional systems, though 2GB modules today are best suited for smaller caching layers rather than large-scale production deployments.

High-Performance Computing
HPC clusters benefit from this memory’s registered ECC and single-rank x4 design, which allows higher DIMM counts per channel at full speed. Configure compute nodes with the maximum supported DIMMs per CPU, using identical sticks to preserve memory interleaving and uniform access latencies across cores. For memory-bandwidth-bound simulations, populating all channels with eight or more modules per socket ensures optimal throughput while ECC keeps long-running calculations error-free.

Verified Compatibility

Rigorously tested DDR3 server-grade RDIMM, compatible with Dell PowerEdge R720, HP ProLiant DL380p Gen8, and similar platforms.

FAQ

Q: Can I mix this M392B5670EH1-CH9 with other memory modules of different brands or speeds?

A: Mixing with other DDR3 RDIMMs is possible, but identical part numbers per channel ensure stability. Different speeds force the system to operate at the lowest common frequency.

Q: Is this memory compatible with my server?

A: This is a DDR3 Registered ECC 2GB VLP RDIMM. It is designed for Intel Xeon 5500/5600 series or AMD Opteron 6100 platforms with 240-pin slots. Verify your server's qualified vendor list.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical DIMMs per memory channel starting with the slot farthest from the CPU. For dual-processor servers, balance capacity evenly across both CPUs for uniform memory access.

Q: Does this module support overclocking or XMP profiles?

A: No, this Samsung RDIMM adheres strictly to JEDEC DDR3-1333 standards. It does not support XMP or overclocking, as server platforms prioritize data integrity and stability.

Q: What warranty and typical failure rate can I expect?

A: This module includes a 1-year warranty. Samsung server memory exhibits an annualized failure rate (AFR) well below 0.5%, ensuring excellent reliability in enterprise environments.

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