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Samsung M392B5673FH0-CH9 2GB DDR3 VLP RDIMM 1333MHz|ECC Memory

MPN:M392B5673FH0-CH9 By:Samsung Warranty:1 year
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General

ModelM392B5673FH0-CH9
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity2 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x8
Quantity of Pins240-pin
RAM GenreVLP RDIMM

Engineer's Note

The M392B5673FH0-CH9 is a server-grade DDR3 VLP RDIMM with ECC and registered signaling, purpose-built for virtualization and in-memory database workloads where data integrity and signal stability under heavy load are critical. Its Dual Rank x8 organization delivers optimized interleaving for higher bandwidth efficiency, and the CL9 timing ensures low-latency access in dense server deployments.

Technical Specs & Insights

1. Registered signal buffering decouples the electrical load from the memory controller, enabling dense server configurations to populate all DIMM slots without sacrificing signal integrity.
2. ECC protection detects and corrects single-bit memory errors on the fly, reducing the risk of silent data corruption in long-running enterprise applications.
3. Dual Rank x8 organization increases bank-level parallelism, maximizing memory bandwidth utilization for virtualized workloads that rely on consistent low-latency access.
4. The VLP form factor reduces physical height to just 0.72 inches, allowing these modules to fit into slim 1U rack servers where airflow and space are critically constrained.
5. DDR3 technology provides a proven, power-efficient foundation for legacy server platforms, ensuring seamless compatibility and stable operation in existing data center fleets.

Why These Specs Matter

When deploying mission-critical server infrastructure, the Samsung M392B5673FH0-CH9 module is engineered to eliminate the silent threats that undermine data integrity and uptime. As a VLP RDIMM with ECC and registered signal technology, this 2GB DDR3-1333 module directly addresses the primary pain points in dense virtualized clusters and memory-intensive databases. In a VMware or Hyper-V environment hosting dozens of virtual machines, any single-bit error in memory can cause cascading guest crashes or silent data corruption. The ECC capability of this module automatically detects and corrects these bit flips, ensuring your VM fleet remains stable and your transactional data stays accurate without cryptic system halts. Furthermore, the registered design buffers command and address signals, maintaining rock-solid signal integrity when you populate all memory channels in a 1U or blade server. This stability is absolutely critical for in-memory databases like Redis or Memcached, where the dual-rank x8 organization enhances bandwidth utilization for sub-millisecond cache responses. The very low profile form factor also prevents mechanical conflict with dense CPU heatsinks, making it a reliable workhorse for sustained 24/7 operation where conventional modules simply fail. For the data center engineer, this translates directly into fewer emergency call-outs and uncompromised data fidelity.

Endurance & Reliability

General Virtualization
For light to moderate virtualization using this 2GB Registered ECC DDR3 module, populate at least six modules (12GB) per host to support a small number of virtual machines. Distribute modules symmetrically across all available memory channels—typically one DIMM per channel—to maintain balanced memory bandwidth and reduce latency. For slightly denser consolidation, double the count to twelve modules (24GB) while keeping channel interleaving intact.

In-Memory Database
In-memory datasets demand maximum capacity and fault tolerance. Begin with a minimum of twelve of these 2GB RDIMMs (24GB) for small caching or analytics instances, although larger deployments will quickly require populating every available DIMM slot. Leverage the module’s ECC and registered signal features to sustain data integrity under continuous high-speed access, and fill all channels equally to prevent memory bandwidth bottlenecks.

High-Performance Computing
HPC workloads prize bandwidth and low latency over raw capacity. Install one module per memory channel across all processors—six or eight modules total (12–16GB) is a common starting point for node-level parallel jobs. The dual-rank x8 organization and CL9 latency of this VLP RDIMM help deliver consistent throughput in tightly coupled simulations, while ECC ensures computational accuracy during long-running cluster tasks.

Verified Compatibility

Rigorously tested DDR3 Registered ECC VLP RDIMM for servers: Dell R720, HP DL380p Gen8, Cisco C220 M3.

FAQ

Q: Can I mix this M392B5673FH0-CH9 with other memory modules of different brands or speeds?

A: Mixing is strongly discouraged. This is a registered ECC RDIMM, and combining modules with different brands, speeds, or ranks may cause stability issues or force the system to default to the lowest common specification.

Q: Is this memory compatible with my server?

A: It is designed for servers with Intel 5500/5600 series or AMD Opteron 6100/6200 platforms supporting DDR3-1333 Registered ECC memory. Verify your motherboard’s qualified vendor list (QVL) and 1.5V RDIMM support.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical RDIMMs per channel, starting from the farthest slot from the CPU. Typically, fill slots in sets of three for triple-channel or two for dual-channel architectures, following your server's manual.

Q: Does this module support overclocking or XMP profiles?

A: No. As an enterprise-grade Registered ECC RDIMM, it strictly adheres to JEDEC DDR3-1333 standards with no support for overclocking or XMP profiles, ensuring maximum data integrity and stability.

Q: What warranty and typical failure rate can I expect?

A: This module includes a one-year warranty. With rigorous factory testing, the AFR (annualized failure rate) is typically below 0.5% under normal operating conditions, ensuring high reliability for server deployments.

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