General

Engineer's Note

This 32GB DDR4-2400 Registered ECC memory module is engineered for enterprise-class servers and workstations tasked with virtualized environments, in-memory databases, and other data-integrity-critical workloads. Its dual-rank x4 architecture combined with Registered (buffered) signaling and ECC error correction ensures stable signal integrity across high-density memory configurations while actively detecting and correcting single-bit errors to maintain uninterrupted operation.

Technical Specs & Insights

1. Registered buffer technology scales memory to high capacities across numerous DIMM slots while preserving signal integrity, essential for running large-scale virtualization hosts without data access errors.
2. ECC protection continuously detects and corrects single-bit memory faults, delivering the end-to-end data resilience required by transactional databases and financial processing.
3. Dual Rank x4 organization interleaves data across internal banks to sustain near-peak throughput, directly benefiting latency-sensitive analytics and in-memory caching.
4. High-density module capacity allows servers to accommodate more active virtual machines per node, lowering infrastructure cost by consolidating workloads onto fewer physical boxes.
5. Efficient base frequency ensures stable memory performance under 24/7 operation, matching the power and thermal budgets typical of dense rack deployments.

Why These Specs Matter

The Samsung M393A4K40CB1-CRC4Q is a 32GB DDR4-2400 Registered DIMM, purpose-built for enterprise servers where every bit of data integrity and uptime counts. Its four defining characteristics translate directly into hardened reliability for mission-critical workloads. First, ECC error correction continuously detects and corrects single-bit memory errors, silently preventing cosmic-ray-induced data corruption that could crash a virtual machine or poison a financial transaction. In a dense virtualization cluster hosting dozens of tenants, that safeguard means you avoid unexplained hypervisor failures and preserve multi-tenant isolation. Second, the registered signal buffer stabilizes command and address lines as you scale—without it, populating all 24 DIMM slots on a dual-socket server would cause signal degradation and intermittent faults; with RDIMM, your memory bus remains crisp even under full load, essential when running memory-hungry in-memory databases like SAP HANA where a single uncorrected error can scrap an entire analytics query. Third, the dual-rank x4 organization interleaves two internal rank groups per module, boosting bandwidth through parallel bank accesses. This lets a virtualized SQL Server instance sustain higher transaction throughput under concurrent users without stalling on row-activation latency. Finally, the low 1.2V JEDEC voltage and CL17 latency keep thermals in check across a 2U rack server, so cooling overhead stays predictable while your Redis clusters serve sub-millisecond lookups. Simply put, this module turns raw specs into a foundation for always-available services.

Endurance & Reliability

General Virtualization
This Samsung 32GB DDR4-2400 RDIMM is built for dense server virtualization. Deploy six to eight of these dual-rank modules across the memory channels of a typical dual-socket Xeon platform to achieve 192–256 GB, comfortably supporting 40–50 average virtual machines. The registered ECC design ensures stability under the constant memory pressure of mixed-workload hypervisors.

In-Memory Database
For in-memory databases like Redis or SAP HANA, low latency and data integrity are paramount. Populate all memory channels with identical sticks — a 12-module configuration providing 384 GB — to leverage the 1.2V energy efficiency and x4 DRAM width for superior error correction. The CL17 CAS latency at 2400 MT/s delivers a balanced profile for large dataset caching without unexpected power spikes.

High-Performance Computing (HPC)
HPC clusters demand maximum memory bandwidth per node. Install one DIMM per channel (1DPC) using these dual-rank RDIMMs to achieve optimal signal integrity and speed, often sacrificing total capacity for clock stability. A common build employs eight modules for 256 GB per node, providing the sustained throughput needed for MPI-based simulations and finite element analysis while maintaining registered ECC precision.

Verified Compatibility

Validated for Dell PowerEdge R740, HPE ProLiant DL380 Gen10, Lenovo ThinkSystem SR650, fully compatible DDR4-2400 ECC RDIMM.

FAQ