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| Product Type | Memory Module |
|---|---|
| Compliance Standards | |
| Memory Capacity | 32 GB |
| Memory Technology | DDR4 |
| Product Voltage | 1.2 V |
| RAM Speed | 3200 MHz |
| RAM Standard | DDR4-3200/PC4-25600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL22 |
| Rank | Dual Rank x4 |
| Quantity of Pins | 288-pin |
| RAM Genre | RDIMM |
This Samsung 32GB DDR4-3200 RDIMM (M393A4K40DB3-CWECQ) is engineered for enterprise servers and workstations, where its Registered ECC architecture and Dual Rank x4 configuration deliver exceptional data integrity and memory bandwidth critical for virtualization, in-memory databases, and high-availability workloads. Operating at 1.2V with CL22 timings, this module ensures stable, power-efficient 3200 MT/s performance while Registered signal buffering enables reliable scaling across dense, multi-DIMM server platforms.
1. Registered signal type ensures stable communication across densely populated server boards, enabling reliable operation when scaling up to massive memory configurations for enterprise workloads.
2. ECC protection automatically corrects single-bit errors, preserving data integrity in financial transactions and mission-critical databases where even silent corruption is unacceptable.
3. A 32GB module capacity maximizes memory density per channel, allowing more virtual machines to be packed onto a single physical host without sacrificing performance.
4. Dual Rank x4 organization interleaves accesses across two internal rank groups, sustaining higher bandwidth saturation ideal for in-memory analytics and large-scale virtualization.
5. DDR4-3200 speed delivers a substantial throughput uplift that accelerates real-time data processing and reduces latency in frequently accessed cloud-native applications.
The Samsung M393A4K40DB3-CWECQ is an RDIMM engineered for servers, and its four defining characteristics directly address the realities of demanding data-center workloads. ECC memory actively corrects single-bit errors that otherwise silently corrupt data in long-running virtualization clusters; when a flipped bit inside a live VM triggers a cascade of faults, ECC is what keeps your tenant applications from suffering unexplained crashes. The registered buffer isolates the memory controller from excessive electrical load, so you can fill every channel with these dense 32 GB modules without signal collapse—a prerequisite for scaling an in-memory database like SAP HANA toward many terabytes of hot data. Its dual-rank x4 organization further amplifies throughput through bank interleaving, ensuring that concurrent analytics queries and hundreds of VDI sessions receive the bandwidth they demand, not bursts of contention. At DDR4-3200 and a low 1.2 V, the module balances speed with thermal efficiency even under heavy consolidation. The combined result is straightforward: fewer emergency failovers, predictable low-latency response, and the headroom to confidently expand your private cloud footprint without compromising data integrity.
Capacity Planning Guide for DDR4-3200 RDIMM (32GB, Dual Rank, ECC Registered)
General Virtualization
In a general virtualization host, memory is often the primary scale-up constraint. Populating 8 to 16 modules (256–512 GB) per dual-socket server delivers ample headroom for dozens of mixed VMs. Install identical dual-rank DIMMs symmetrically across all memory channels to maintain balanced bandwidth and predictable NUMA performance.
In-Memory Database
In-memory databases such as Redis or SAP HANA demand capacity and uncompromised data integrity. Start with 16 modules (512 GB) to hold large datasets entirely in RAM, and scale to 24 or more modules as data volumes grow. ECC and registered buffering protect against silent data corruption during sustained high-speed access, while the dual-rank x4 organization sustains throughput at high capacities.
High-Performance Computing (HPC)
HPC clusters need maximum sustained bandwidth and large working sets. Equip each node with 16 or 32 modules (512 GB to 1 TB) to prevent swap-driven slowdowns in simulation or modeling jobs. Configure one dual-rank DIMM per channel (1DPC) across all eight channels per CPU to achieve peak DDR4-3200 bandwidth, a decisive factor for parallel computation efficiency.
Rigorously tested for server use; compatible with Dell PowerEdge R760, HPE ProLiant DL380 Gen11, Lenovo ThinkSystem SR650 V3, and more.
Q: Can I mix this M393A4K40DB3-CWECQ with other memory modules of different brands or speeds?
A: Mixing different brands or speeds is strongly discouraged in server environments. It may cause instability, ECC errors, or performance issues. Identical modules ensure predictable, reliable operation.
Q: Is this memory compatible with my system? (Intel/AMD server platforms)
A: This RDIMM is designed for servers with Intel Xeon Scalable or AMD EPYC CPUs supporting DDR4-3200 ECC Registered memory. Always verify your specific motherboard's qualified vendor list for guaranteed compatibility.
Q: What is the recommended DIMM population order for optimal performance?
A: Follow your server board manual; typically populate balanced identical DIMMs per channel. For dual-processor platforms, install symmetrically across both CPU memory controllers, using matched kits in specified slots.
Q: Does this module support overclocking or XMP profiles?
A: No. This is an enterprise ECC RDIMM strictly adhering to JEDEC 3200MT/s at CL22. Overclocking or XMP is not supported to preserve data integrity critical for server workloads.
Q: What warranty and typical failure rate can I expect?
A: It includes a 1-year warranty. Samsung enterprise RDIMMs exhibit extremely low annual failure rates, typically under 0.5%, delivering the reliability essential for 24/7 mission-critical operations.