| Model | M393B5170FHD-YH9 |
|---|---|
| Product Type | Memory Module |
| Compliance Standards | EU RoHS,FCC |
| Memory Capacity | 4 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.35V |
| RAM Speed | 1333MHz |
| RAM Standard | DDR3-1333/PC3-10600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL9 |
| Rank | Dual Rank x4 |
| Quantity of Pins | 240-pin |
| RAM Genre | RDIMM |
This Samsung M393B5170FHD-YH9 is a server-grade RDIMM engineered for virtualization and in-memory database workloads, where its registered signal architecture and ECC ensure signal integrity and data reliability under dense, multi-rank configurations. Its dual-rank x4 design and 1.35V low-voltage operation maximize memory capacity and energy efficiency in 24/7 data center environments, while CL9 latency at 1333MHz delivers consistent, stable performance for mission-critical applications.
1. Error Correcting Code (ECC) memory detects and silently resolves single-bit data corruption in real time, preserving transactional integrity for financial databases and virtualization hosts where even a flipped bit can cascade into costly downtime.
2. Registered DIMMs amplify command and address signal strength through an onboard buffer, allowing servers to populate all 24 slots without signal degradation and reliably support multi-terabyte memory footprints for large in-memory workloads.
3. Dual Rank x4 bank interleaving reduces access latency by overlapping read/write operations across separate rank groups, sustaining higher IOPS under the mixed workload patterns typical of consolidated hypervisor environments.
4. Operating at 1.35V instead of the legacy 1.5V standard trims power draw per module by nearly 10%, a cumulative saving that directly lowers energy bills and thermal hotspots across a rack-scale deployment running 24/7.
5. The 1333MHz clock speed translates to a peak bandwidth of 10.6 GB/s per channel, matching the throughput demands of midsize enterprise application servers while keeping the memory bus stable under sustained load.
Samsung’s M393B5170FHD-YH9 is a server-class RDIMM engineered to eliminate the pain points that keep IT managers awake at night. In a dense virtualisation cluster, its ECC engine acts as a silent shield, continuously correcting single-bit errors caused by background radiation or electrical noise. Without this, a flipped bit could silently corrupt a hypervisor’s memory state, cascading into unexplained VM crashes or data integrity failures that take hours to trace. The registered (buffered) architecture cleans and re-drives command signals, so you can populate all 24 DIMM slots in a dual-socket host without signal degradation, giving you the stable, high-capacity footprint needed to consolidate dozens of virtual machines onto a single box. At 1.35 volts, this DDR3L module draws measurably less power than legacy 1.5 V alternatives, which compounds into significant annual savings on electricity and cooling across a multi-rack data centre. For in-memory databases like Redis or SAP HANA, the dual-rank x4 organisation interleaves memory banks to deliver higher sustained bandwidth under heavy concurrent access. This means real-time fraud scoring or trading platforms consistently meet their sub-millisecond response targets, even during peak loads, keeping transactions accurate and your business reputation intact.
Server Memory Capacity Planning for M393B5170FHD-YH9 (4GB DDR3-1333 ECC RDIMM)
This registered ECC DDR3 module suits legacy servers. Below are guidelines for typical workloads.
General Virtualization
Virtualized environments demand ample memory for multiple VMs. Populate all memory channels symmetrically with identical 4GB RDIMMs to maximize capacity. For a dual-socket server with 12 DIMM slots per CPU, install 12 modules per socket (96GB) to avoid NUMA penalties and provide consolidation headroom.
In-Memory Database
In-memory databases like Redis or SAP HANA require large, low-latency memory footprints. Use the maximum number of supported identical DIMMs, fully populating all channels with these dual-rank x4 modules. A configuration of 24 x 4GB (96GB) per server ensures consistent access times and sufficient capacity, while ECC protects data integrity.
High Performance Computing (HPC)
HPC workloads are sensitive to memory bandwidth. Install modules in multiples of the memory channel count (e.g., 8 or 12 identical DIMMs per socket) for full interleaving. For a dual-socket system, 16 x 4GB (64GB) delivers balanced bandwidth for MPI tasks. Avoid mixing different ranks or capacities.
Rigorously tested, compatible with Dell PowerEdge R720, R620, HP DL380p Gen8, and Lenovo x3650 M4.
Q: Can I mix this M393B5170FHD-YH9 with other memory modules of different brands or speeds?
A: Mixing this registered ECC module with different brands or speeds is not recommended. It may cause instability or failure to POST. For reliable server operation, use identical part numbers across all channels.
Q: Is this memory compatible with my Intel or AMD server platform?
A: It is compatible with systems supporting DDR3 ECC Registered DIMMs, such as Intel Xeon E5-2400 v1/v2 and AMD Opteron 4000 series. Verify your motherboard’s QVL for this specific Samsung part number.
Q: What is the recommended DIMM population order for optimal performance?
A: Populate identical DIMMs per channel, starting with the slots farthest from the CPU (usually blue or white). Follow your server manual; for this dual-rank module, populate one DIMM per channel first for balanced memory interleaving.
Q: Does this module support overclocking or XMP profiles?
A: No. This is an enterprise server RDIMM built for stability at JEDEC standard DDR3-1333 CL9. It does not support overclocking, XMP, or voltage adjustments beyond the 1.35V specification.
Q: What warranty and typical failure rate can I expect?
A: This Samsung module carries a 1-year warranty. As a tier-1 server DIMM, it demonstrates an annualized failure rate (AFR) typically below 0.2% under specified operating conditions, ensuring high reliability.