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Samsung M391B5273BH1-CH9 4GB DDR3 UDIMM 1333MT/s | Reliable ECC Memory

MPN:M391B5273BH1-CH9 By:Samsung Warranty:1 year
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General

ModelM391B5273BH1-CH9
Compliance StandardsEU RoHS,FCC
Product TypeMemory Module
Memory Capacity4 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL9
RankDual Rank x8
Quantity of Pins240-pin
RAM GenreUDIMM

Engineer's Note

This Samsung DDR3 UDIMM with ECC provides reliable data integrity for single-socket servers and entry-level workstations, making it well-suited for file storage, light virtualization, and other memory-sensitive workloads. Its dual-rank x8 organization improves interleaving bandwidth, and the unbuffered design with CL9 latency ensures low access times in cost-sensitive platforms requiring error correction.

Technical Specs & Insights

1. ECC protection continuously detects and corrects single-bit errors in real time, preventing silent data corruption that could crash a small business server or undermine database integrity.
2. Dual Rank x8 organization interleaves memory accesses across two internal ranks, sustaining peak bandwidth to handle simultaneous requests from multiple light virtual machines without stalling.
3. Unbuffered UDIMM design eliminates the register chip to reduce latency and cost, while still delivering full ECC value for entry-level NAS appliances and cost-conscious server builds.
4. 1333MHz clock speed translates to a reliable 10.6 GB/s throughput, comfortably supporting the steady I/O streams of a file server or web hosting node under moderate user loads.
5. CL9 latency minimizes the clock cycles between a read command and data delivery, sharpening responsiveness for transactional workloads like email services or point-of-sale backends.

Why These Specs Matter

The Samsung M391B5273BH1-CH9 is a DDR3 ECC Unbuffered DIMM purpose‑built for entry‑level servers and small‑business workstations, where every bit of data matters and downtime is not an option. Its ECC capability constantly scans and corrects single‑bit memory errors in real time—a silent safeguard that prevents cosmic‑ray‑induced corruption from crashing your virtualization host or silently mangling financial records in an always‑on inventory database. The unbuffered architecture eliminates the extra clock cycle latency that registered modules impose, so your lightweight hypervisor or file server responds snappily under bursty workloads, while still staying electrically simple for low‑cost server boards. A dual‑rank x8 organization cleverly interleaves two internal ranks of memory chips, allowing concurrent page accesses that raise effective bandwidth without adding latency; for a memory‑intensive caching service like Redis, this means noticeably faster key lookups and a higher transaction throughput. Finally, the CAS 9 timing at 1333 MHz, driven by a stable 1.5 V supply, delivers repeatable, cool‑running performance that long‑lived micro‑servers demand—keeping your always‑on email or web hosting stable year after year with minimal power stress.

Endurance & Reliability

General Virtualization
Deploy 4 GB ECC UDIMMs in multiples of four across dual-channel platforms to maximize memory interleaving while retaining error correction. A typical hypervisor host benefits from 32 GB (8 × 4 GB) for moderate VM density; double that for heavy consolidation. Ensure identical Dual Rank x8 modules for consistent CAS 9 timing and 1.5 V operation.

In-Memory Database
Capacity and reliability take priority. Populate all available DIMM slots with these 4 GB Dual Rank modules to reach the highest supported UDIMM capacity, often 32 GB on quad‑slot boards. ECC is critical for data integrity, and unbuffered design keeps latency low for real‑time transaction processing.

High‑Performance Computing
Maximize memory bandwidth by installing symmetric pairs per channel. For HPC nodes requiring ECC protection, use six or eight identical M391B5273BH1 modules to achieve 24 GB or 32 GB at DDR3‑1333. Dual rank x8 organization delivers strong streaming performance, while 1.5 V standard voltage helps maintain power‑efficient compute density.

Verified Compatibility

Rigorously tested, this ECC UDIMM fits servers like Dell PowerEdge R210 II, HP ProLiant MicroServer Gen8, Lenovo ThinkServer TS140.

FAQ

Q: Can I mix this M391B5273BH1-CH9 with other memory modules of different brands or speeds?

A: Mixing ECC UDIMMs from different brands or speeds is not recommended. It can cause instability or disable error correction. For reliable server operation, populate with identical modules.

Q: Is this memory compatible with my Intel Xeon E3 or AMD Opteron server platform?

A: This DDR3-1333 ECC UDIMM is compatible with select Intel Xeon E3-1200 series and AMD Opteron 4000/3000 platforms. Verify your server board's specific memory QVL for support.

Q: What is the recommended DIMM population order for optimal performance?

A: Install DIMMs in pairs, starting with the slots farthest from the CPU. Usually, fill blue slots first if dual-channel, then black. Refer to your server board's manual for exact ordering to enable memory interleaving.

Q: Does this module support overclocking or XMP profiles?

A: No. This is an ECC server memory module designed for stability at JEDEC standard DDR3-1333. It does not support overclocking or XMP profiles, prioritizing data integrity over speed.

Q: What warranty and typical failure rate can I expect?

A: This module comes with a one-year warranty. Typical failure rates are extremely low, usually under 0.2% annually, due to rigorous testing and ECC-grade components designed for 24/7 operation.

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