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| Model | M391B5273CH0-YH9 |
|---|---|
| Compliance Standards | EU RoHS,FCC |
| Product Type | Memory Module |
| Memory Capacity | 4 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.35V |
| RAM Speed | 1333MHz |
| RAM Standard | DDR3-1333/PC3-10600 |
| Error Identifying | ECC |
| Signal Type | Unbuffered |
| Column Access Strobe (CAS) | CL9 |
| Rank | Dual Rank x8 |
| Quantity of Pins | 240-pin |
| RAM Genre | UDIMM |
This Samsung DDR3L UDIMM with ECC is an unbuffered memory module designed for entry-level servers, small-scale NAS systems, and single-socket workstations where data integrity is critical but registered memory is not required. Its dual-rank x8 organization paired with error-correcting code (ECC) capability ensures reliable operation under continuous light to moderate workloads, while the 1.35V low-voltage operation and CL9 latency provide an efficient balance of power savings and responsive performance on compatible Intel Xeon E3 or AMD AM3+ platforms.
1. ECC protection silently corrects single-bit errors, preserving data integrity in long-running financial or database workloads where even a silent bit-flip is unacceptable.
2. Dual Rank x8 organization interleaves access across more internal banks, boosting effective bandwidth for virtualized environments under mixed tenant demands.
3. The low 1.35V supply voltage cuts power consumption per DIMM, directly lowering cooling costs in dense server racks that run non‑stop.
4. A 1333 MHz clock delivers consistent 10.6 GB/s throughput, enough to keep a medium‑sized web or file server responsive under concurrent access.
5. At 4 GB capacity per module, this UDIMM fills entry‑level single‑socket servers with ample memory for lightweight containers or dedicated network appliance roles without waste.
Based on the UDIMM form factor, 240-pin design, and ECC support, the M391B5273CH0-YH9 is a server-grade memory module purpose-built for entry-level servers and workstations that demand rock-solid data integrity without the cost of registered DIMMs. In a virtualization cluster running multiple VMs, a single undetected bit flip in hypervisor memory can silently corrupt guest operating systems or trigger unexplained crashes, leading to costly downtime. ECC actively corrects these single-bit errors, ensuring that your virtualized workloads—from domain controllers to development sandboxes—remain stable and trustworthy. Equally critical is the 1.35V low-voltage operation, which directly translates to lower power draw and reduced cooling requirements in dense 24/7 server racks, guarding against thermal throttling while trimming operational expenses. Furthermore, the dual-rank x8 organization interleaves memory banks to serve concurrent access patterns efficiently, improving bandwidth for latency-sensitive in-memory databases like Redis. This means real-time analytics queries complete faster without data corruption risks, letting you meet strict SLAs with confidence.
General Virtualization
Equip the server with four identical M391B5273CH0-YH9 modules to reach 16 GB total capacity across all DIMM slots, enabling a balanced mix of light to medium VMs. The ECC error correction ensures data integrity for multiple guest operating systems, while the low 1.35 V operating voltage reduces power consumption in always‑on hosts. Populate matching pairs to maintain dual‑channel bandwidth and stable performance.
In-Memory Database
Maximize the available memory by filling every slot with these 4 GB ECC UDIMMs; a 16 GB configuration delivers a reliable foundation for small to mid‑size in‑memory datasets like Redis or Memcached cache layers. Use identical part numbers to eliminate timing mismatches, and pair the modules for dual‑channel operation to slightly lower access latency. Plan horizontal scaling across nodes if the workload demands larger in‑memory footprints beyond the single‑host ceiling.
High-Performance Computing (HPC)
Install four matched M391B5273CH0-YH9 sticks to leverage full dual‑channel 128‑bit memory bandwidth for throughput‑sensitive HPC jobs. The 1.35 V low‑power UDIMM design helps contain thermal loads in dense compute clusters, and ECC protection guards against silent data corruption during long‑running simulations. For workloads that benefit from reduced provisioning overhead, a 16 GB symmetric population provides a consistent performance profile across identical compute nodes.
Rigorously tested server memory, compatible with Dell PowerEdge R720, HP ProLiant DL360p Gen8, Lenovo ThinkServer TS440, and similar systems.
Q: Can I mix this M391B5273CH0-YH9 with other memory modules of different brands or speeds?
A: Mixing is not recommended. For server ECC UDIMM, even slight differences can cause instability. We strongly advise using identical modules—same model, rank, and batch—to ensure reliable data integrity.
Q: Is this memory compatible with my system? I’m using an Intel Xeon E3-1200 v2 series.
A: Yes, it is compatible with platforms supporting DDR3 ECC unbuffered UDIMMs, such as Intel Xeon E3-1200 v2/v3, or AMD AM3+ with ECC support. Verify your motherboard specifically supports 1.35V DDR3 ECC UDIMM.
Q: What is the recommended DIMM population order for optimal performance?
A: Follow your server motherboard manual, but typically populate identical DIMMs per channel, filling blue slots first in multi-channel configurations. Dual Rank x8 modules like this one should be installed symmetrically for balanced memory bandwidth.
Q: Does this module support overclocking or XMP profiles?
A: No. As an enterprise-grade server UDIMM, it adheres strictly to JEDEC DDR3-1333/PC3-10600 specifications. Overclocking and XMP are not supported, prioritizing stability and error correction over frequency manipulation.
Q: What warranty and typical failure rate can I expect with this module?
A: We provide a one-year warranty. Typical AFR (Annualized Failure Rate) for such Samsung server UDIMMs is well under 0.5% under nominal operating conditions, offering excellent long-term reliability for critical workloads.