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| Product Type | Memory Module |
|---|---|
| Memory Capacity | 4 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.5V |
| RAM Speed | 1600MHz |
| RAM Standard | DDR3-1600/PC3-12800 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL11 |
| Rank | Dual Rank x8 |
| Quantity of Pins | 240-pin |
| RAM Genre | VLP RDIMM |
Designed for server platforms, this 4GB DDR3-1600 VLP RDIMM with ECC and registered signaling ensures strong data integrity and signal stability in dense, memory-intensive workloads such as virtualization and in-memory databases. Its dual-rank x8 organization boosts memory bandwidth utilization at a CAS latency of 11, while the very low-profile form factor maximizes airflow in 1U and blade chassis.
1. VLP RDIMM form factor enables ultra-dense server configurations, freeing critical PCB real estate and enhancing airflow in 1U rack and blade systems.
2. Registered logic re-drives address and command signals, preserving signal integrity when populating all memory channels for maximum virtualization density.
3. ECC protection automatically detects and corrects single-bit errors, safeguarding transactional data integrity in financial and database servers.
4. Dual-rank x8 construction leverages bank interleaving to sustain near-peak throughput during heavy multi-threaded operations, minimizing CPU idle cycles.
5. 4 GB capacity provides an economical, right-sized module for dedicated edge services and lightweight VM hosts, balancing power consumption and cost per guest.
The Samsung M392B5273DH0-CK0 is a DDR3 Registered ECC Very Low Profile RDIMM, purpose-built for server platforms where data integrity and round-the-clock stability define your bottom line. Every function directly addresses real infrastructure pain points. The ECC capability means single-bit errors, which silently occur due to cosmic radiation or electrical noise, are detected and corrected in real time. In a virtualized cluster hosting multiple guests, an uncorrected flip could corrupt a hypervisor state and cascade into global downtime; this module eliminates that risk for transaction-heavy databases. Registered signal buffers manage electrical loads across high-capacity memory arrays, letting you populate dense dual-socket boards with confidence. Dual-rank x8 organization interleaves access across internal banks, delivering sustained 1600MHz bandwidth when an in-memory database like Redis serves millions of concurrent read operations. Latency spikes shrink, and query throughput stays predictable. Moreover, the VLP height is critical inside 1U blade servers, where thermal headroom is minimal. Lower profile improves airflow, reduces cooling costs, and eases hot-swap servicing without disturbing adjacent DIMMs. This module ultimately safeguards data, stabilizes large-scale deployments, and maximizes performance in constrained enterprise chassis.
General Virtualization
For dense virtualization hosts, populate all available channels with these 4GB VLP RDIMMs to maximize memory capacity while maintaining the power and thermal advantages of very low-profile modules. Aim for balanced per-channel configurations (e.g., six or eight identical DIMMs per CPU) to sustain consistent memory bandwidth under mixed VM workloads, and reserve at least 20% spare capacity for failover and live migration bursts.
In-Memory Database
In-memory databases demand both capacity and data integrity, making registered ECC essential. Deploy modules in multiples of the memory channel count to achieve the largest possible dual-rank footprint without mixing densities, as dual-rank x8 DIMMs offer a favorable balance of capacity and rank interleaving. Target fully populated riser slots on 2-socket platforms to support datasets of 256GB and above, ensuring all DIMMs share the same 1600MHz speed and CL11 latency.
HPC
HPC clusters benefit from the low-profile design, which improves airflow in densely packed nodes, while registered ECC guarantees result accuracy over long compute runs. Configure one DIMM per channel to prioritize peak bandwidth at 1600MHz, using identical dual-rank modules to avoid speed downgrades from rank-mixing. A baseline of 64–128GB per node, built with 4GB RDIMMs, suits mid-scale simulations, and leaving open slots facilitates future scaling without a full node refresh.
Rigorously tested server memory. Proven compatible with Dell PowerEdge R720, HPE DL380p Gen8, Lenovo x3650 M4, etc.
Q: Can I mix this M392B5273DH0-CK0 with other memory modules of different brands or speeds?
A: Mixing is not recommended. For reliable server operation, identical registered ECC DDR3-1600 modules should be used. Mismatched speeds or ranks may force fallback to lower speeds or cause POST failures.
Q: Is this memory compatible with my system?
A: This is a 4GB DDR3-1600 VLP RDIMM. It requires a server platform supporting registered ECC memory, such as Intel Xeon E5/E3 series or AMD Opteron systems with 240-pin DDR3 slots. Verify your board’s qualified vendor list.
Q: What is the recommended DIMM population order for optimal performance?
A: Populate identical modules in sets matching the memory channels. For dual-socket servers, balance across memory banks and follow the motherboard manual’s slot numbering, typically filling blue slots first for dual-rank RDIMMs.
Q: Does this module support overclocking or XMP profiles?
A: No. As an enterprise registered ECC module, it adheres to JEDEC DDR3-1600 standards at 1.5V. Overclocking or XMP is not supported; stability and data integrity are prioritized over frequency tuning in server environments.
Q: What warranty and typical failure rate can I expect?
A: This module comes with a 1-year warranty. Registered ECC memory exhibits very low failure rates under proper thermal conditions. Annualized Failure Rate (AFR) is typically below 0.5% in controlled data center environments.