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Trade Assurance
| Error Identifying | Non-ECC |
|---|---|
| Signal Type | Unbuffered |
| Compliance Standards | EU RoHS,FCC |
| Product Type | Memory Module |
| Memory Capacity | 4 GB |
| Memory Technology | DDR3 |
| RAM Speed | 1600 |
| RAM Standard | DDR3-1600/PC3-12800 |
| Column Access Strobe (CAS) | CL11 |
| Rank | Single Rank x8 |
| Quantity of Pins | 204-pin |
| RAM Genre | SoDIMM |
This DDR3-1600 SO-DIMM is a standard non-ECC unbuffered notebook memory module, ideally suited for upgrading older laptops and mobile workstations where plug-and-play compatibility and low power consumption are critical. Its single-rank x8 configuration ensures stable operation and reduced electrical load on the memory controller, making it a reliable drop-in upgrade for systems with stringent power and form-factor constraints.
1. SoDIMM form factor slots effortlessly into ultra-slim notebooks and all-in-ones, ensuring a straightforward upgrade path without compatibility headaches.
2. A moderate capacity handles everyday productivity suites and browser-based workflows with ease, giving aging laptops a tangible boost in responsive multitasking.
3. DDR3-1600 operation delivers brisk data throughput that reduces idle-wait during OS boot and application loads, directly translating to snappier daily use on the go.
4. CL11 timing strikes a balance between access latency and power draw, keeping system feel fluid without overworking the memory controller or draining the battery prematurely.
5. Single-rank x8 organization lowers electrical load and thermal output, contributing to cooler palm-rest temperatures and longer battery runtime during off-plug sessions.
Designed specifically for notebook platforms, the Samsung M471B5173DB0-YK0 is a 4 GB DDR3-1600 SODIMM that transforms aging laptops into responsive daily drivers. Its unbuffered, non-ECC architecture and 204-pin form factor guarantee seamless plug-and-play compatibility across a vast range of ultrabooks and small-form-factor systems, eliminating guesswork during upgrades. The single-rank x8 configuration reduces electrical load on the memory controller, which translates to cooler operation and extended battery life—critical when you are working remotely from a café or finalising a presentation on a cross-country flight. With a CAS latency of just 11 cycles, application launches feel crisp, and multitasking between a dozen browser tabs, spreadsheets, and video conferences stays fluid rather than bogged down by lag. For a mobile workstation user juggling large email archives and lightweight photo editing, the 1600 MT/s bandwidth keeps productivity smooth without the power penalty of faster, hotter modules. When upgrading a thin-and-light notebook that ships with only soldered memory, this single SODIMM slot solution revives the machine affordably, meeting strict EU RoHS and FCC compliance for safety and environmental assurance. You gain reliable, low-power memory that directly addresses the real-world frustrations of sluggish boot times, constant swapping to disk, and premature battery drain.
Based on the specifications — DDR3 1600MHz SoDIMM, 204-pin, non-ECC, unbuffered, single-rank x8, 4GB capacity — this is a laptop memory module. The following capacity planning guidance addresses typical mobile use cases.
Laptop Upgrade
For aging notebooks still running on a single 4GB stick, adding a second identical 4GB module is the most cost-effective path to 8GB. This enables dual-channel mode, directly improving integrated graphics performance and multitasking responsiveness. If the system already has 4GB, replacing the existing module with an 8GB kit (2x4GB or a single 8GB SoDIMM) provides a meaningful boost for modern web browsing and office applications.
Mobile Workstation
Memory-intensive professional workloads — such as CAD, 3D rendering, or large dataset analysis — demand maximum capacity. Given the 4GB baseline, replace all factory modules with a 16GB or 32GB kit (2x8GB or 2x16GB) if the chipset supports it. Prioritize identical dual-channel matched pairs to maintain data integrity under sustained heavy loads, even though this is non-ECC memory.
Ultrabook Power Saving
While this specific module is standard voltage DDR3 (1.5V), ultrabook upgrades should prefer DDR3L (1.35V) variants for lower power draw and extended battery life. If the ultrabook’s soldered memory cannot be replaced, verify idle power states supported by the new module. A single high-density 8GB low-voltage SoDIMM delivers capacity with minimal impact on runtime, ideal for thin-and-light systems focused on longevity.
Rigorously tested, compatible with laptops like Dell Latitude E6430, HP EliteBook 8470p, Lenovo ThinkPad X230.
Q: Can I mix this M471B5173DB0-YK0 with other memory modules of different brands or speeds?
A: Mixing is possible, but all modules will operate at the slowest common speed and timings. For optimal reliability in laptops, identical modules are strongly recommended, as mismatched ranks or densities can cause instability.
Q: Is this memory compatible with my system?
A: This 204-pin DDR3L SoDIMM fits notebooks supporting DDR3-1600/PC3-12800. Verify your laptop manufacturer’s QVL or chipset generation (e.g., Intel 8/9 series) to ensure 4GB single-rank unbuffered non-ECC modules are fully supported.
Q: What is the recommended DIMM population order for optimal performance?
A: Install this single module into the primary slot, typically slot 0 or the one labeled 'DIMM1'. For dual-channel capable laptops, adding a second identical module in the paired slot will enable dual-channel mode for increased bandwidth.
Q: Does this module support overclocking or XMP profiles?
A: This standard JEDEC-compliant module does not support XMP or aggressive overclocking. It runs strictly at DDR3-1600 CL11 per its SPD profile, ensuring maximum compatibility and stable operation in thermal-constrained laptop environments.
Q: What warranty and typical failure rate can I expect?
A: This Samsung module carries a 1-year warranty. Typical annualized failure rate (AFR) for genuine DDR3 SoDIMMs is below 0.5% under normal operating conditions, backed by rigorous component screening and EU RoHS/FCC compliance testing.