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| Signal Type | Unbuffered |
|---|---|
| Product Type | Memory Module |
| Compliance Standards | CE,WEEE,RoHS |
| Memory Capacity | 4 GB |
| Memory Technology | DDR3 |
| RAM Speed | 1600 |
| RAM Standard | DDR3-1600/PC3-12800 |
| Column Access Strobe (CAS) | CL11 |
| Rank | Single Rank x8 |
| Quantity of Pins | 204-pin |
| RAM Genre | SoDIMM |
This is a laptop memory module (SO-DIMM) ideal for upgrading mobile workstations and ultra-portable notebooks, offering plug-and-play compatibility with low-voltage energy efficiency. Its single-rank x8 architecture and unbuffered signal type minimize electrical loading on the memory controller, ensuring stable 1600 MT/s operation and extended battery life under light-duty workloads.
1. SoDIMM form factor means this module fits seamlessly into space-constrained laptop chassis, enabling effortless pop-in upgrades without the need for bulky adapters.
2. DDR3 technology ensures broad backward compatibility with a vast installed base of older notebooks, making it a reliable choice for extending system life.
3. The 4 GB capacity provides a comfortable headroom for web browsing, office applications, and streaming, transforming sluggish netbooks into usable daily companions.
4. Operating at 1600 MT/s, the module delivers fluid data throughput for typical mobile workloads while maintaining low power draw to preserve battery runtime.
5. Single Rank x8 configuration minimizes memory controller load and heat generation inside tightly packed notebooks, contributing to cooler palm rests and longer uninterrupted use.
When you install the Samsung M474B5173QH0-YK0 into your notebook, you are not just adding 4 GB of unbuffered DDR3 memory—you are directly addressing the real-world frustrations of sluggish multitasking and difficult upgrades. This 204-pin SoDIMM is purpose-built for laptops, meaning its compact form factor guarantees a drop-in fit for everything from slim ultrabooks to mobile workstations. The unbuffered architecture eliminates the signal delays that buffered server modules require, so your CPU gets immediate access to data; for a field engineer running CAD software alongside diagnostics tools on a workstation, that translates to snappier viewport panning and faster report generation. With a 1600 MT/s data rate and PC3-12800 bandwidth, it handles dense spreadsheets and high-resolution presentations without stuttering. The CL11 latency keeps hit times predictably low, which is critical when a financial analyst is switching between multiple browser tabs and real-time data feeds on a thin-and-light. Finally, because this is a single-rank, x8 module, it imposes minimal electrical load on the system’s memory controller, improving compatibility and allowing even older notebooks to recognize the full capacity instantly—turning a sluggish five-minute boot-and-load cycle into a smooth, productive experience without any configuration hassle.
Laptop Upgrade
A single 4GB DDR3-1600 SO-DIMM is typical for older notebooks with one memory slot already occupied. To double capacity without discarding existing modules, simply add a second identical 4GB stick if a free slot is available; this enables dual‑channel operation at 8GB total. For laptops already fully populated, swap both modules for a matched 8GB (2×4GB) or even 16GB (2×8GB) kit to extend the system’s useful life under modern web and office workloads.
Mobile Workstation
Professional applications like CAD or simulation often demand more than the stock 4GB. Maximize capacity by installing the largest supported SO-DIMMs—many DDR3-era mobile workstations accept 8GB or 16GB modules, so populate both slots with identical high‑capacity sticks for a reliable 16GB or 32GB dual‑channel setup. Always verify the chipset and CPU limit; a x8 single‑rank 4GB module can serve as a fallback only when higher‑density sticks are unavailable.
Ultrabook Power Saving
Standard 1.5V DDR3 modules consume more power than the 1.35V DDR3L alternative. For thin‑and‑light systems where battery runtime is critical, replace existing memory with low‑voltage DDR3L-1600 SO-DIMMs of identical capacity to reduce thermal output and extend unplugged endurance without sacrificing performance. Pair two low‑voltage modules in dual‑channel to keep the memory bus energy‑efficient during light productivity tasks.
Rigorously tested; compatible with DDR3 1600MHz SoDIMM laptops: Dell Latitude E6430, HP EliteBook 8470p, Lenovo ThinkPad T430.
Q: Can I mix this M474B5173QH0-YK0 with other memory modules of different brands or speeds?
A: Mixing modules of different brands or speeds may cause instability. For reliable operation, we recommend using identical DDR3-1600 SO-DIMMs with matching CAS latency, rank, and capacity.
Q: Is this memory compatible with my laptop?
A: This 204-pin DDR3 SO-DIMM fits notebooks supporting 3rd/4th Gen Intel Core or AMD A-series APUs. Please verify your system supports DDR3-1600 unbuffered memory and a maximum of 4GB per slot.
Q: What is the recommended DIMM population order for optimal performance?
A: If your laptop has two slots, install a matched pair of identical modules for dual-channel performance. When using a single module, either slot is acceptable; consult your service manual for slot location details.
Q: Does this module support overclocking or XMP profiles?
A: This module adheres to JEDEC DDR3-1600 specifications and does not support XMP or overclocking. It runs at standard voltage and timings for broad compatibility and stability.
Q: What warranty and typical failure rate can I expect?
A: This module is covered by a one-year warranty. It is manufactured to high quality standards with CE, WEEE, and RoHS compliance, resulting in a very low annualized failure rate.