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Samsung M383L6420DTS-CA0 512MB DDR RDIMM 200MHz| Reliable ECC Memory

MPN:M383L6420DTS-CA0 By:Samsung Warranty:1 year
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General

ModelM383L6420DTS-CA0
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity512 MB
Memory TechnologyDDR
Product Voltage2.5V
RAM Speed200MHz
RAM StandardDDR-200/PC1600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL2
RankSingle Rank x4
Quantity of Pins184-pin
RAM GenreRDIMM

Engineer's Note

The M383L6420DTS-CA0 is a legacy server-grade DDR RDIMM designed for 184-pin platforms that demand data integrity in aging enterprise systems. Its Registered signal topology with ECC ensures stable operation in multi-slot configurations, while the aggressive CL2 latency and Single Rank x4 organization minimize access delays for latency-sensitive workloads such as small-scale databases or embedded industrial controllers.

Technical Specs & Insights

1. End-to-end error correction safeguards transactional integrity, preventing silent data corruption in long-running database and virtualization workloads.
2. Register logic buffers address and command signals, enabling stable multi-DIMM configurations essential for high-density server racks.
3. Ultra-tight column access strobe latency minimizes memory fetch delays, accelerating response times for latency-sensitive enterprise applications.
4. Single-rank x4 organization reduces electrical loading on the memory bus, allowing servers to populate more channels without sacrificing signal quality.
5. Modest module capacity targets dedicated embedded controllers or lightweight network appliance roles, where deterministic low-latency access outweighs raw volume.

Why These Specs Matter

The M383L6420DTS-CA0 is a server-class Registered ECC DDR memory module engineered for environments where data integrity and system uptime are paramount. In a virtualized cluster, such as an ESXi farm running dozens of critical VMs, its Registered signal buffering eliminates electrical loading bottlenecks, enabling you to fully populate memory banks with stability—no more mysterious host crashes under memory pressure. The onboard ECC continuously scrubs for radiation-induced bit flips, directly preventing silent data corruption that could silently poison a database record or crash an application without a trace. This is life-or-death for in-memory databases like Redis or SAP HANA: the aggressive CL2 latency delivers rapid first-word access, keeping transaction latencies predictably low. Simultaneously, the Single Rank x4 architecture enhances this reliability. With x4-organized DRAM, a chip-level failure contaminates only a single data bit per access, a fault ECC can seamlessly correct without service interruption. For your mission-critical workloads, this module transforms raw specifications into a trustworthy foundation where every byte stays accurate through every second of operation.

Endurance & Reliability

General Virtualization
For legacy virtualization hosts using DDR-200 Registered ECC memory, plan for maximum module population across all available DIMM slots to offset the low 512 MB density. A typical dual-socket server from that era may support 8 to 12 slots; install at least eight modules (4 GB total) to run a lightweight hypervisor and 3–5 minimal virtual machines. Always populate in identical pairs to maintain interleaved memory banks and stable ECC protection.

In-Memory Database
In-memory databases are severely constrained by 512 MB RDIMMs, so capacity must be achieved through quantity. Fill every slot on a multi-socket platform — for example, 12 modules yield 6 GB, enough for small Redis or Memcached instances with careful dataset sizing. Use single-rank x4 modules in a balanced configuration across memory risers to preserve low latency and sustain the registered command pipeline under heavy transactional loads.

High-Performance Computing
For period-correct HPC clusters relying on DDR-200, capacity and bandwidth are both limited. Populate all memory channels symmetrically with eight or more modules per node, delivering 4–6 GB to accommodate MPI processes and modest datasets. Prioritize CL2 latency and identical part numbers like the M383L6420DTS-CA0 to prevent timing skew. Registered ECC is mandatory for result integrity during multi-day compute runs, so never substitute unbuffered modules.

Verified Compatibility

Rigorously tested server memory, compatible with Dell PowerEdge 1650/2650, HP ProLiant DL360 G2, IBM xSeries 335.

FAQ

Q: Can I mix this M383L6420DTS-CA0 with other memory modules of different brands or speeds?

A: Mixing is strongly discouraged in server environments. Different brands, speeds, or rankings may cause instability, POST failures, or memory errors. For reliable ECC operation, populate all channels with identical registered DIMMs.

Q: Is this memory compatible with my Intel or AMD server platform?

A: It is compatible with older Intel and AMD server boards supporting 184-pin DDR Registered ECC memory. Verify your board specifically requires PC1600/DDR-200 RDIMMs and supports 2.5V, single-rank x4 modules before purchase.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical RDIMMs per channel, starting with the slot farthest from the CPU. For this single-rank module, install in the first bank of each channel to minimize loading and maintain balanced memory interleaving.

Q: Does this module support overclocking or XMP profiles?

A: No. Server-grade registered ECC DIMMs are built for stability at JEDEC standard timings. Overclocking or XMP is not supported and can compromise data integrity and the error-correction capabilities of the module.

Q: What warranty and typical failure rate can I expect?

A: This module is backed by a 1-year warranty. Being an enterprise-class registered DIMM with ECC, it exhibits a very low annualized failure rate when operated within its specified voltage and temperature ranges.

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