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Samsung M386A8K40DM2-CTD 64GB DDR4 RDIMM 2666MHz | Reliable ECC Memory

MPN:M386A8K40DM2-CTD By:Samsung Warranty:1 year
US$523 - $566
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General

Product TypeMemory Module
Memory Capacity64 GB
Memory TechnologyDDR4
Product Voltage1.2 V
RAM Speed2666 MHz
RAM StandardDDR4-2666/PC4-21300
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL19
RankQuad Rank x4
Quantity of Pins288-pin
RAM GenreRDIMM

Engineer's Note

Designed for enterprise server environments, this 64GB DDR4-2666 RDIMM with ECC and registered signaling ensures data integrity and system stability under heavy virtualization and in-memory database workloads. Its quad-rank x4 configuration maximizes per-channel capacity density, while CL19 latency and 1.2V operation balance performance with power efficiency for 24/7 mission-critical deployments.

Technical Specs & Insights

1. With its high-density module capacity, this memory enables denser virtual machine consolidation per physical server, reducing hardware sprawl and operating costs in large-scale data centers.
2. End-to-end ECC protection eliminates silent data corruption, delivering the unwavering data integrity required for financial transactions and critical database operations.
3. Registered signal buffering stabilizes command and address lines across fully loaded memory channels, ensuring reliable operation in high-capacity, multi-socket server deployments.
4. Quad-rank organization maximizes bank-level interleaving, keeping memory pipelines saturated and providing consistent throughput for memory-analytics and heavy OLTP workloads.
5. The elevated transfer rate supplies ample per-channel bandwidth, preventing memory bottlenecks when hypervisors juggle numerous concurrent containerized services and background replication tasks.

Why These Specs Matter

The M386A8K40DM2-CTD is a server-grade DDR4 RDIMM engineered for mission-critical enterprise environments. Its four defining characteristics directly address the pain points of modern data centers. ECC protection eliminates single-bit errors that silently corrupt data in financial transactions or customer records—a catastrophic risk in in-memory databases like SAP HANA. The Registered signal buffer isolates the memory controller from electrical loads, ensuring rock-solid stability when populating all channels with high-density modules in a virtualization cluster hosting dozens of VMs. The massive 64GB capacity per stick allows you to pack 1TB of RAM into a dual-socket server, keeping large datasets in-flight without costly storage paging. Finally, the Quad Rank x4 organization interleaves memory banks to boost bandwidth, dramatically accelerating parallel queries and VM live migrations. For your virtualized cluster or real-time analytics platform, this module means zero downtime from memory errors, predictable performance under extreme multi-tenancy, and the headroom to scale workloads without compromise.

Endurance & Reliability

This 64GB DDR4-2666 ECC Registered RDIMM (quad rank, 1.2V) is purpose‑built for server environments where data integrity and large memory footprints matter. Use the following capacity planning guidelines for three key workloads.

General Virtualization
Populate memory channels symmetrically with identical 64GB RDIMMs to maximise bandwidth and avoid NUMA imbalances. In a typical dual‑socket hypervisor hosting dozens of VMs, aim for at least eight modules per CPU (1 TB total) to comfortably absorb overcommitment while keeping critical services responsive. Distribute modules evenly across all memory channels to maintain balanced latency.

In‑Memory Database
In‑memory databases (e.g., SAP HANA, Redis) demand vast capacity and error‑free operation. Leverage the ECC and registered signalling of these 64GB DIMMs to build a 1 TB configuration from just 16 modules, populating every available channel in a two‑socket server. This approach delivers both high capacity and the interleaved memory bandwidth essential for real‑time analytics, while the quad‑rank design keeps per‑channel loading within server platform limits.

High‑Performance Computing
HPC nodes often combine per‑core memory bandwidth with dense capacity. Install six or eight of these 64GB RDIMMs per socket in a balanced configuration (e.g., one DIMM per channel) to saturate memory bandwidth for simulation or modelling codes. The high module capacity reduces the total number of DIMMs needed to reach top‑end memory targets, lowering power draw and improving cooling efficiency inside dense cluster racks.

Verified Compatibility

Rigorously tested, compatible with Dell PowerEdge R760, HPE ProLiant DL380 Gen10, Lenovo ThinkSystem SR650, and Cisco UCS servers.

FAQ

Q: Can I mix this M386A8K40DM2-CTD with other memory modules of different brands or speeds?

A: Mixing is discouraged. Different brands, speeds, or DRAM configurations can cause ECC and registered logic conflicts. For reliable operation, use identical M386A8K40DM2-CTD modules with matching capacity, rank, speed, and chip organization.

Q: Is this memory compatible with my server system?

A: This DDR4-2666 ECC RDIMM is designed for Intel Xeon Scalable and AMD EPYC platforms using C620/SP3 chipsets that support registered memory. Please consult your server board’s qualified vendor list for validated compatibility.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical DIMMs into balanced memory channels as per your motherboard manual. Normally, use the furthest slot from the CPU first, filling all channels symmetrically to enable interleaving and ensure full memory bandwidth.

Q: Does this module support overclocking or XMP profiles?

A: No. This registered server memory operates strictly at JEDEC standard DDR4-2666. Overclocking and XMP profiles are not supported, as enterprise ECC RDIMMs prioritize data integrity and stability over peak frequency.

Q: What warranty and typical failure rate can I expect?

A: It includes a one-year warranty. Samsung enterprise-grade modules have an extremely low annualized failure rate, typically under 0.2%, due to rigorous qualification, advanced component selection, and extensive manufacturing testing.

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