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Trade Assurance
| Model | M392B1K73CM0-CH9 |
|---|---|
| Product Type | Memory Module |
| Compliance Standards | EU RoHS,FCC |
| Memory Capacity | 8 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.5V |
| RAM Speed | 1333MHz |
| RAM Standard | DDR3-1333/PC3-10600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL9 |
| Rank | Quad Rank x8 |
| Quantity of Pins | 240-pin |
| RAM Genre | VLP RDIMM |
This Samsung M392B1K73CM0-CH9 is a server-class 8 GB DDR3-1333 Very Low Profile (VLP) RDIMM purpose-built for space-constrained 1U/2U rack servers and high-density virtualization platforms. Its registered ECC architecture combined with a quad-rank x8 organization ensures robust signal integrity across fully populated memory channels and CL9 low-latency access, delivering the data reliability and predictable performance required for memory-resident databases and continuous multi-tenant workloads.
1. This module’s error-correcting code (ECC) capability catches and corrects single-bit memory faults, a non-negotiable feature for financial or database servers where data accuracy is paramount.
2. Its registered bus design buffers command and address lines, allowing multiple DIMMs to coexist on the same channel without signal degradation—critical for scaling up memory in bare-metal hypervisors.
3. Quad Rank x8 organization packs four internal ranks into a single stick, offering the highest capacity per slot while preserving compatibility with platform memory controllers for optimal virtual machine density.
4. The Very Low Profile (VLP) form factor reduces the module height, which improves airflow in tightly-packed blade and 1U rack servers and lowers fan power consumption.
5. With its per-module capacity, IT operators can populate typical triple-channel server boards for a balanced mix of total memory and channel bandwidth, handling more concurrent containers and VMs.
Designed specifically for server environments, the M392B1K73CM0-CH9 is a DDR3-1333 VLP Registered DIMM that directly addresses the critical pain points of data center operators. Its ECC technology is non-negotiable for virtualized clusters: a single undetected bit-flip in a hypervisor’s memory space can silently corrupt an entire virtual machine, leading to application crashes or data loss. With ECC, such errors are caught and corrected in real time, ensuring continuous service integrity. The registered signal type further stabilizes high-density deployments, buffering the command and address lines so that quad-rank configurations like this 8GB module can populate all 24 DIMM slots of a 2U server without signal degradation or boot failures—vital when scaling VMware ESXi hosts.
For in-memory databases such as Redis or SAP HANA, the quad-rank x8 organization improves interleaving and overall bandwidth efficiency under heavy concurrent access. This translates to lower transactional latency and faster query responses, directly impacting user experience and revenue. Moreover, the very-low-profile form factor maximizes airflow in dense 1U/2U chassis, preventing thermal throttling that otherwise degrades 24/7 database performance. This memory module is not just a component; it is a purpose-built guardian of uptime, data fidelity, and throughput in the virtualized enterprise.
General Virtualization
For consolidated virtual machines, capacity and stability are paramount. Deploy this 8GB RDIMM in balanced configurations across all memory channels—such as six or twelve modules for dual-socket platforms—to achieve 48 GB or 96 GB totals. This avoids memory bottlenecks when hosting numerous VMs and leverages ECC to protect guest workloads from soft errors.
In-Memory Database
In-memory databases demand maximum capacity and low latency. Populate every DIMM slot with these quad-rank registered modules to reach the highest supported capacity, e.g., twelve or sixteen sticks for 96 GB or 128 GB. Quad-rank x8 organizations deliver deep bank counts for concurrent access, but observe platform limits and possible speed downgrades when fully populated; always verify motherboard guidelines.
High Performance Computing
HPC workloads benefit from symmetric, channel-interleaved memory subsystems. Install these 1333 MHz ECC modules identically across all memory channels—one or two DIMMs per channel—to sustain uniform bandwidth. For bandwidth-sensitive jobs, dual-rank or quad-rank parts like this one can offer higher throughput per channel, but ensure the CPU’s memory controller can drive them at the rated CL9 latency without throttling.
Rigorously tested server memory, compatible with Dell PowerEdge R710/R720, HP ProLiant DL380p Gen8, and similar systems.
Q: Can I mix this M392B1K73CM0-CH9 with other memory modules of different brands or speeds?
A: Mixing with other modules is not recommended. Registered ECC DIMMs must match speed, rank, and timing for stable server operation. Mismatched specs can cause POST failures or memory errors.
Q: Is this memory compatible with my server? I’m using an Intel Xeon E5 platform.
A: Yes, this DDR3-1333 Registered ECC VLP RDIMM is compatible with Intel Xeon E5 v1/v2 platforms that support 240-pin DDR3 ECC memory. Verify quad-rank support in your board’s memory QVL.
Q: What is the recommended DIMM population order for optimal performance?
A: Install quad-rank DIMMs starting from the farthest slot per channel. For dual-processor servers, balance memory across all memory channels and follow the motherboard’s slot numbering to maximize bandwidth.
Q: Does this module support overclocking or XMP profiles?
A: No. Server Registered ECC memory adheres to JEDEC standard timings and does not support overclocking or XMP. It is designed for reliability at the rated 1333MHz speed.
Q: What warranty and typical failure rate can I expect for this module?
A: This module includes a 1-year warranty. As enterprise-grade ECC memory, it undergoes rigorous screening and offers an annualized failure rate (AFR) typically below 0.5% under specified conditions.