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Samsung M393B1K70CH0-CH9E4 8GB DDR3 RDIMM 1333MT/s | Enterprise ECC

MPN:M393B1K70CH0-CH9E4 By:Samsung Warranty:1 year
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General

ModelM393B1K70CH0-CH9E4
Compliance StandardsEU RoHS,FCC
Product TypeMemory Module
Memory Capacity8 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

The M393B1K70CH0-CH9E4 is an 8GB DDR3-1333 registered ECC RDIMM designed for legacy server platforms, making it ideal for virtualization hosts and memory-intensive enterprise workloads requiring high data integrity. Its dual-rank x4 organization with CL9 latency and registered signaling ensures stable operation under heavy load by reducing electrical load on the memory bus while ECC actively corrects single-bit errors in real time.

Technical Specs & Insights

1. ECC error correction silently detects and fixes single-bit memory errors, safeguarding financial transactions and critical database operations from silent data corruption.
2. Registered signal buffering stabilizes command and address lines, allowing dense server populations to operate reliably under heavy sustained loads.
3. 8 GB capacity per module lets IT architects scale memory up to hundreds of gigabytes per server, squeezing more VM instances onto each physical host without sacrificing performance.
4. Dual Rank x4 organization interleaves memory accesses across ranks, boosting throughput and hiding refresh latency for consistent virtualization and database response times.
5. 1333 MHz clock speed delivers solid memory bandwidth that keeps legacy enterprise application tiers responsive, extending the useful life of cost-conscious data center deployments.

Why These Specs Matter

The Samsung M393B1K70CH0-CH9E4 is a server-grade DDR3 Registered DIMM, and its design speaks directly to the reliability demands of data center workloads. The error-correcting code (ECC) on this module is non-negotiable for financial transaction systems and scientific simulations, where a single bit flip caused by cosmic rays can corrupt a calculation or silently alter a balance sheet. In dense virtualization clusters running dozens of VMs per host, the registered signal buffer stabilizes the memory bus even with all DIMM slots populated, preventing boot failures and random crashes that would otherwise bring shared services to a halt. Its dual-rank x4 organization boosts data throughput by allowing the memory controller to interleave accesses across two internal rank groups, which is critical for in-memory databases like Redis or SAP HANA that demand high bandwidth to process millions of queries per second. With a 1333MHz clock and CL9 latency, it delivers a predictable response time under sustained load, ensuring that your virtualized infrastructure and real-time analytics stay consistent around the clock—because in a server, stability is not a feature; it is the entire value proposition.

Endurance & Reliability

General Virtualization
For a DDR3-1333 ECC RDIMM platform, a balanced virtualized host typically demands 64–128 GB of total memory. We recommend populating all available memory channels with identical 8 GB modules—six or eight modules for dual‑socket servers—to benefit from memory interleaving and maximize bandwidth while preserving error correction. Stick to a single rank per channel where possible to reduce electrical loading.

In-Memory Database
In‑memory workloads such as Redis or SAP HANA require large capacity and the highest reliability. Deploy 16 or 24 modules (128–192 GB) of this 8 GB RDIMM, fully filling the server’s DIMM slots to reach the box’s maximum supported RAM. Configure sparing and mirroring modes in the BIOS if the database demands extreme availability, sacrificing raw capacity for automatic fail‑over.

High‑Performance Computing (HPC)
HPC clusters prefer uniform, moderate‑capacity nodes to gain aggregate throughput. Equip each node with 8 to 12 modules (64–96 GB) arranged symmetrically across memory controllers, using Channel Interleaving to sustain the 10.6 GB/s bandwidth. Registered ECC at 1.5 V keeps power predictable, and the dual‑rank x4 organization helps deliver the sustained throughput needed by MPI jobs without throttling under load.

Verified Compatibility

Rigorously tested server DDR3 RDIMM. Compatible with Dell PowerEdge R720, HP ProLiant DL380p Gen8, Lenovo System x3650 M4.

FAQ

Q: Can I mix this M393B1K70CH0-CH9E4 with other memory modules of different brands or speeds?

A: Mixing RDIMMs is not recommended. Registered ECC memory requires identical ranks, timings, and speed. Mixed modules may cause stability issues or fail to boot, especially in servers demanding strict signal integrity.

Q: Is this memory compatible with my server system?

A: This DDR3-1333 Registered ECC RDIMM suits Intel Xeon 5500/5600 series or AMD Opteron 6100/6200 platforms. Verify your server board supports 240-pin RDIMMs, 1.5V, and dual-rank x4 organization.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical DIMMs per channel, starting with the farthest slot from the CPU. For dual-socket servers, balance memory across both processors. Follow your motherboard’s population guide to maintain NUMA symmetry.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a JEDEC-standard server RDIMM without XMP. Overclocking is not supported; it is designed for reliable 1333MHz operation with CL9 at 1.5V to ensure data integrity in mission-critical environments.

Q: What warranty and typical failure rate can I expect?

A: This module includes a 1-year warranty. Typical AFR (annualized failure rate) for enterprise-grade DDR3 RDIMMs is below 0.5% under normal operating conditions, reflecting robust manufacturing and ECC protection.

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