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Samsung M393B1G73QH0-YK009 8GB DDR3 RDIMM 1600MT/s Reliable ECC Memory

MPN:M393B1G73QH0-YK009 By:Samsung Warranty:1 year
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General

ModelM393B1G73QH0-YK009
Compliance StandardsEU RoHS,FCC
Product TypeMemory Module
Memory Capacity8 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1600MHz
RAM StandardDDR3-1600/PC3-12800
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL11
RankDual Rank x8
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

Designed for server and datacenter environments, the Samsung M393B1G73QH0-YK009 is an 8 GB DDR3L-1600 registered ECC RDIMM that ensures data integrity and system stability for virtualization, in-memory database, and other mission‑critical workloads. Its dual‑rank x8 organization boosts throughput via rank interleaving, while the registered signal architecture and 1.35 V low‑voltage operation deliver robust signal integrity and improved power efficiency in dense, high‑capacity deployments.

Technical Specs & Insights

1. ECC capability detects and corrects single-bit memory errors in real time, safeguarding transactional integrity for database and financial workloads where data corruption is not an option.
2. Registered signal buffering strengthens address and command bus integrity, enabling fully populated multi-DIMM configurations that remain stable under the punishing 24/7 loads of dense virtualization.
3. Dual Rank x8 organization leverages interleaved accesses to boost effective bandwidth, keeping latency-sensitive applications responsive when consolidating numerous virtual machines on a single host.
4. Low-voltage operation curbs power draw and thermal output per module, directly trimming energy bills and reducing the thermal strain that accelerates hardware aging in large server farms.
5. Eight-gigabyte module capacity supplies the granular density needed for high memory-to-core ratios, allowing expansive in-memory caching and more guest instances per physical server without resorting to costly, oversized DIMMs.

Why These Specs Matter

Understanding your memory module’s true value comes from the environment it’s designed for. The M393B1G73QH0-YK009 is a registered DDR3 server DIMM, purpose-built for enterprise workloads where conventional desktop memory simply cannot deliver.

In a virtualized cluster running dozens of VMs per host, memory reliability is the foundation. The module’s ECC technology transparently corrects single-bit errors caused by cosmic rays or electrical noise—preventing silent data corruption that could crash a hypervisor or alter financial transactions. Its Registered signal buffer stabilizes the electrical load, allowing you to populate all 24 DIMM slots without signal degradation, so you can confidently scale to hundreds of gigabytes of usable memory. This directly supports dense consolidation and reduces costly downtime. Shift to an in-memory database like Redis or SAP HANA, and the Dual Rank x8 organization becomes critical. It interleaves ranks to increase effective bandwidth and lower latency under heavy concurrent access, helping real-time analytics return results faster. Meanwhile, the 1.35V low-voltage operation cuts power consumption and cooling requirements across a rack of servers, which translates directly into lower operational expenditure without sacrificing the 1600MHz speed your applications need. Together, these four characteristics ensure your infrastructure stays resilient, responsive, and cost-efficient around the clock.

Endurance & Reliability

General Virtualization
Deploy this 8 GB Registered DDR3-1600 RDIMM in a balanced virtualization host by populating multiple DIMMs per channel to maximize capacity while maintaining ECC reliability. For typical hypervisor workloads running 20–30 light VMs, install six or eight identical modules in a dual‑socket server to achieve 48–64 GB total, leaving room for memory overcommit.

In‑Memory Database
In‑memory databases demand both capacity and data integrity; start with a fully populated memory bank using at least 12 of these 8 GB RDIMMs (96 GB) to hold large datasets entirely in RAM. The registered, dual‑rank x8 design at 1.35 V ensures stable signal integrity under sustained loads, and you can scale to 16 modules (128 GB) for high‑concurrency Redis or SAP HANA environments.

High‑Performance Computing
HPC clusters benefit from the bandwidth of multiple channels when every node is densely configured. Populate all available slots per CPU—typically 8 or 16 modules per node—to create a uniform 64–128 GB pool that keeps MPI processes in cache‑coherent memory. The ECC protection is critical for long‑running simulations, and the 1.35 V low‑profile RDIMM form factor helps control power budgets in dense rack deployments.

Verified Compatibility

Rigorously tested server memory, compatible with Dell PowerEdge R720, HP DL380p Gen8, Lenovo RD630.

FAQ

Q: Can I mix this M393B1G73QH0-YK009 with other memory modules of different brands or speeds?

A: Mixing brands or speeds is strongly discouraged for server RDIMMs. Different DIMMs may cause signal integrity issues and system instability. Always use identical part numbers for mission‑critical reliability.

Q: Is this memory compatible with my system?

A: It is compatible with Intel Xeon E5/E7 and select AMD Opteron platforms that support DDR3 low‑voltage (1.35V) Registered ECC memory. Verify your server board explicitly lists 8GB DDR3-1600 RDIMM support.

Q: What is the recommended DIMM population order for optimal performance?

A: Follow your server’s technical guide. Typically, populate identical DIMMs in balanced channels per CPU, filling the farthest slots first. Symmetric population ensures maximum interleaving and bandwidth.

Q: Does this module support overclocking or XMP profiles?

A: No, this is an enterprise‑grade Registered ECC module built to JEDEC standards. It does not support overclocking or XMP to maintain data integrity and 24/7 stability.

Q: What warranty and typical failure rate can I expect?

A: This product includes a one‑year warranty. Enterprise ECC memory exhibits an extremely low annualized failure rate, far below consumer parts, delivering mission‑critical reliability under continuous operation.

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