| Model | M392B1K70DM0-CK0 |
|---|---|
| Product Type | Memory Module |
| Compliance Standards | EU RoHS,FCC |
| Memory Capacity | 8 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.5V |
| RAM Speed | 1600MHz |
| RAM Standard | DDR3-1600/PC3-12800 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL11 |
| Rank | Dual Rank x4 |
| Quantity of Pins | 240-pin |
| RAM Genre | VLP RDIMM |
This 8GB DDR3-1600 VLP RDIMM (M392B1K70DM0-CK0) with ECC and registered signal type is engineered for legacy enterprise servers and storage systems, delivering critical data integrity in virtualized environments and light in-memory database caching. Its dual-rank x4 organization and very low-profile form factor maximize DIMM density in 1U/2U chassis while maintaining signal stability under fully populated configurations.
1. Very low-profile form factor enhances airflow and cooling in dense server chassis, maintaining stable operation under sustained load.
2. On-chip error correction safeguards data integrity for mission-critical databases and financial transaction processing.
3. Registering on the command bus stabilizes high-capacity memory configurations, essential for maximizing virtualization host density.
4. Dual rank interleaving keeps memory channels efficiently saturated, accelerating large in-memory datasets for real-time analytics.
5. High clock frequency speeds up data access, cutting latency for latency-sensitive enterprise applications.
The Samsung M392B1K70DM0-CK0 is a server-grade DDR3 VLP RDIMM built for enterprise workloads where stability and data integrity directly impact the bottom line. Its ECC engine continuously corrects single-bit errors, eliminating silent data corruption that could crash an in-memory database or propagate faulty figures through a financial transaction log—a non-negotiable safeguard when every bit counts. The registered buffer redistributes command and address signals, allowing you to populate all 24 DIMM slots in a dense virtualization cluster without signal droop; this translates to more virtual machines per node and simpler scaling. Beneath the heat spreader, a dual-rank x4 organization employs bank interleaving to keep bandwidth saturated and latency low during query storms or simultaneous VM migrations. Perhaps most practical for the data center floor is the Very Low Profile form factor. In 1U and 2U chassis, VLP modules improve front-to-back airflow and eliminate the clearance headaches that standard-height DIMMs cause around CPU heatsinks, directly reducing thermal throttling and maintenance calls. For IT teams extending the life of legacy DDR3 platforms, this memory ensures that critical virtualization, database, and analytics applications run with uncompromising reliability.
General Virtualization
For general virtualization hosts, deploy this 8GB VLP RDIMM in multiples of three or four per CPU to populate all memory channels and maintain balanced interleaving. A typical configuration of six to eight modules (48–64GB) per socket suits moderate-density VM workloads, leaving spare DIMM slots for future scale-out. Registered ECC ensures data integrity under sustained multi-tenant loads.
In-Memory Database
In-memory databases demand maximum capacity and fault tolerance, so populate every available DIMM slot with identical 8GB RDIMMs to reach 128GB or more per server. Keep all channels symmetric and avoid mixing ranks to preserve latency predictability. The dual-rank x4 design and CL11 latency of this module provide the reliability required for real-time transactional systems.
High-Performance Computing (HPC)
HPC clusters rely on memory bandwidth as much as capacity. Install at least one RDIMM per channel, and favor two modules per channel where the platform supports it, leveraging dual‑rank interleaving for higher throughput. Balance capacity with core count—plan for 2–4GB per core—and verify that the very low-profile form factor fits dense 1U compute nodes without airflow obstruction.
Strictly tested server memory, compatible with Dell PowerEdge R720, HP ProLiant DL380p Gen8, and more.
Q: Can I mix this M392B1K70DM0-CK0 with other memory modules of different brands or speeds?
A: Mixing RDIMMs of different brands or speeds is not recommended. Inconsistent timings and ranks may cause system instability or failure to POST. Use identical modules to ensure reliable, validated operation.
Q: Is this memory compatible with my Intel Xeon or AMD Opteron server platform?
A: It is compatible with DDR3-based Intel Xeon E5/E5 v2 and AMD Opteron 6300 series platforms that support registered ECC DIMMs. Verify your board supports 1.5V, 1600MT/s, and dual-rank x4 modules.
Q: What is the recommended DIMM population order for optimal performance?
A: Follow your server board's memory population guide, typically filling identical-colored slots per channel first. For dual-rank DIMMs, populate one DIMM per channel to maximize bandwidth, then add second DIMMs.
Q: Does this module support overclocking or XMP profiles?
A: No. This is a JEDEC-compliant enterprise RDIMM. It operates at standard DDR3-1600 speeds with CL11 and does not support XMP or overclocking. Stability and data integrity are prioritized.
Q: What warranty and typical failure rate can I expect?
A: This module includes a one-year warranty. As an enterprise-grade Samsung RDIMM, it offers very low failure rates, typically under 0.5% annually under proper operating conditions.