General

Engineer's Note

This is an 8GB DDR3 Registered ECC memory module (RDIMM) that is optimally suited for entry-level server platforms handling virtualization, in-memory databases, and critical business applications where data integrity is non-negotiable. Its dual-rank x4 organization enables higher memory density per channel, while the ECC and registered signal buffering guarantee robust stability and error correction under 24/7 operation at a low 1.35V voltage.

Technical Specs & Insights

1. Single-bit error correction prevents silent data corruption in financial transaction databases, ensuring long-running server uptime without memory-induced crashes.
2. Registered buffering decouples the memory controller from the DRAM chips, allowing dense multi-DIMM configurations essential for large-scale virtualization hosts.
3. Operating at a reduced voltage slashes datacenter power consumption and reduces cooling demands, directly lowering total cost of ownership per rack.
4. Sized to deliver sufficient headroom for multiple guest operating systems, this module helps maximize VM density on entry-level cloud nodes.
5. Dual rank layout interleaves memory banks to sustain high command rates, minimizing latency spikes when multiple virtual machines contend for memory access.

Why These Specs Matter

The Samsung M393B1K70DH0-YH9Q9 is an 8GB DDR3 Registered ECC DIMM purpose-built for server environments where downtime is measured in lost revenue. Its four core attributes directly solve the real-world pain points of data center operators. First, integrated ECC corrects single-bit errors on the fly, eradicating silent data corruption that could crash a hypervisor or slowly poison an in-memory database like SAP HANA. Second, the Registered buffer re-drives address and command signals, preserving signal integrity when all 24 slots are populated, so your virtual machine cluster scales with absolute stability. Third, the 1.35V low-voltage operation cuts energy consumption against legacy 1.5V modules—a difference that compounds into thousands saved on power and cooling across a server farm. Finally, the Dual Rank x4 organization interleaves accesses across multiple internal banks, boosting sustained bandwidth for latency-sensitive analytics and high-frequency trading platforms. Every one of these features translates directly into hardened resilience, efficient resource utilization, and the confidence that your critical workloads will never fail because of memory that forgot its mission.

Endurance & Reliability

General Virtualization
This module is a DDR3-1333 Registered ECC RDIMM, ideal for last-generation server platforms. For general virtualization, populate all memory channels symmetrically to balance capacity and bandwidth—six or twelve identical 8GB modules for a dual-socket system yield 48–96 GB, sufficient for moderate VM density. Stick to identical dual-rank x4 DIMMs to maintain reliable ECC protection and consistent latency.

In-Memory Database
In-memory databases require maximum capacity and fault tolerance. Install as many of these 8GB RDIMMs as the platform supports, typically 12 or 24 modules across both sockets to hit 96–192 GB, enabling large datasets to reside entirely in RAM. Dual-rank x4 configuration helps sustain throughput under heavy read/write workloads while ECC guards against bit errors during long-running queries.

High-Performance Computing (HPC)
HPC workloads benefit from balanced bandwidth and capacity. Populate one DIMM per channel across all available memory channels—commonly 6 or 8 modules per CPU—to achieve optimal interleaving and memory bandwidth. The 1.35V low-voltage operation reduces power draw in dense compute clusters, and CL9 latency at 1333 MHz delivers reliable, predictable performance for tightly coupled parallel tasks.

Verified Compatibility

Rigorously tested for Dell R720, R520, HPE DL380p Gen8, IBM x3650 M4, Cisco UCS C220 M3 servers.

FAQ