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| Product Type | Memory Module |
|---|---|
| Memory Capacity | 8 GB |
| Memory Technology | DDR4 |
| RAM Speed | 3200 |
| RAM Standard | DDR4-3200/PC4-25600 |
| Signal Type | Unbuffered |
| Column Access Strobe (CAS) | CL22 |
| Rank | Single Rank x8 |
| Quantity of Pins | 260-pin |
| RAM Genre | SoDIMM |
This unbuffered DDR4-3200 SO-DIMM, featuring a single-rank x8 configuration, delivers stable plug-and-play performance ideal for upgrading notebooks and mobile workstations with moderate multitasking workloads. Its CL22 timing and 260-pin form factor ensure broad platform compatibility and efficient low-power operation in thermally constrained chassis.
1. The SoDIMM form factor allows a seamless physical fit into compact laptop chassis, turning a memory upgrade into a straightforward plug-and-play process without hunting for niche adapters.
2. An 8GB capacity provides enough headroom for smooth multitasking across numerous browser tabs, conferencing apps, and office suites, preventing the slowdown of SSD-based swapping.
3. DDR4-3200 transfer rate feeds modern mobile processors with the bandwidth needed for quick file opens and responsive application switching in daily productivity scenarios.
4. CL22 latency balances command response speed with conservative power draw, helping the system run cooler and prolong battery runtime during typical undocked use.
5. Single rank x8 organization minimizes the electrical loading on the memory controller, reducing overall power consumption and heat buildup inside tightly constrained notebook enclosures.
The M474A1K43DB1-CWE is a notebook-class SO-DIMM, immediately evident from its 260-pin form factor and unbuffered, single-rank architecture. For mobile professionals, this isn't just a specification sheet—it's a tangible upgrade in daily productivity. The 3200 MT/s DDR4 speed, combined with a CL22 latency, translates directly into snappier responsiveness when toggling between massive spreadsheets, browser tabs, and video calls on an ultraportable. In a thin-and-light chassis where thermal headroom is scarce, its native 1.2V operation draws measurably less power than older generations, preserving battery life during long-haul flights or back-to-back meetings away from an outlet. For the mobile workstation user rendering 3D models or compiling code, the single-rank x8 design delivers clean signal integrity on compact circuit boards, reducing command delays and boosting sustained throughput—meaning a simulation finishes faster without throttling. Crucially, the SO-DIMM format ensures effortless physical installation: a 15-minute upgrade that sidesteps the soldered-memory limitation of many modern laptops, extending the system's useful life. You gain multitasking stability, prolonged mobility, and a cost-effective path to keep demanding applications fluid.
Laptop Upgrade
When upgrading a notebook with a single 8 GB SODIMM, the simplest capacity doubling is to add a second identical 8 GB DDR4-3200 module for 16 GB dual-channel operation, which noticeably improves integrated graphics performance and multitasking. If the system has a soldered 8 GB rank, match it with another single-rank x8 stick at CL22 to ensure symmetric dual-channel behavior and avoid BIOS compatibility issues.
Mobile Workstation
For professional workloads like 3D rendering, scientific simulation, or large in-memory databases, populate both SO-DIMM slots with the maximum supported density per channel—often two 32 GB modules for 64 GB total—while keeping the same 3200 MT/s speed and CL22 timing. Verify the chipset’s per-rank limit; if you need capacities beyond 32 GB, select dual-rank modules, but be aware that mixing ranks may force a slight command-rate penalty on some mobile platforms.
Ultrabook Power Saving
A pair of 8 GB single-rank DDR4-3200 SODIMMs running at the standard 1.2 V already strikes a good balance between idle power and bandwidth for thin-and-light notebooks. To maximize battery life, avoid populating empty slots beyond 16 GB unless your workflow demands it, since every additional rank increases active and refresh power; keep the configuration compact and dual-channel to let the memory controller enter deeper low-power states during light productivity.
Validated for laptops: tested in Dell XPS, Lenovo ThinkPad, HP EliteBook series with DDR4-3200 SODIMM.
Q: Can I mix this M474A1K43DB1-CWE with other memory modules of different brands or speeds?
A: Mixing modules is not recommended. Unmatched brands, speeds or timings often cause instability. For best results, install identical DDR4-3200 CL22 SO‑DIMMs to guarantee dual‑channel operation and reliable system behavior.
Q: Is this memory compatible with my system?
A: It fits most notebooks and mini PCs that use 260‑pin DDR4 SO‑DIMM slots, typically Intel 8th‑gen or newer and AMD Ryzen mobile platforms. Always verify your model’s maximum supported capacity and DDR4‑3200 compatibility before purchase.
Q: What is the recommended DIMM population order for optimal performance?
A: In a dual‑slot notebook, install a pair of identical modules to enable dual‑channel memory. For single‑channel systems, any available slot works. Equal capacity on both channels maximizes bandwidth.
Q: Does this module support overclocking or XMP profiles?
A: No, this JEDEC‑compliant DDR4‑3200 CL22 SO‑DIMM does not support XMP or manual overclocking. It operates at fixed standard timings validated for stable plug‑and‑play performance in laptops.
Q: What warranty and typical failure rate can I expect?
A: It includes a 1‑year limited warranty. The module is built with high‑quality components, resulting in a very low annualized failure rate typically under 0.5%, ensuring dependable long‑term operation.