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| Product Type | Memory Module |
|---|---|
| Compliance Standards | |
| Memory Capacity | 256 GB |
| Memory Technology | DDR4 |
| Product Voltage | 1.2 V |
| RAM Speed | 3200 MHz |
| RAM Standard | DDR4-3200/PC4-25600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL22 |
| Rank | Octal Rank x4 |
| Quantity of Pins | 288-pin |
| RAM Genre | RDIMM |
This 256GB DDR4-3200 RDIMM with Octal Rank x4 organization and ECC is purpose-built for enterprise servers and high-density memory platforms, delivering exceptional capacity per channel for memory-intensive workloads such as large-scale virtualization, in-memory databases, and real-time analytics. Its registered signal architecture ensures stable operation under heavy load conditions, while the ECC engine and octal-rank configuration maximize data integrity and allow dense population in multi-slot servers without compromising reliability.
1. Octal Rank x4 design packs immense memory density per channel, enabling massive virtualization workloads without sacrificing host server responsiveness.
2. 256GB capacity per module lets a single server handle large in-memory databases and countless containers, reducing the need for costly multi-node scale-out.
3. Registered signal buffering stabilizes command and address lines across fully populated server boards, ensuring reliable operation under heavy and sustained access loads.
4. ECC error correction actively prevents single-bit data corruption, safeguarding financial transactions and mission-critical analytics against silent memory faults.
5. DDR4-3200 speed delivers 25.6 GB/s peak bandwidth per channel, accelerating parallel data processing in virtualized and AI-inference environments.
Designed for demanding server environments, the Samsung M386ABG40M51-CAE is a 256GB DDR4-3200 RDIMM that addresses the critical pain points of enterprise IT: preventing costly downtime and maximizing workload density. Its ECC technology actively corrects single-bit memory errors, which is non-negotiable in a virtualized cluster hosting dozens of VMs — a single undetected bit flip could silently corrupt a database transaction or crash a hypervisor, triggering cascading failures. The registered (Registered) signal buffer is equally vital; it stabilizes the electrical load on the memory bus, allowing you to fully populate all 24 DIMM slots per server without signal degradation, directly enabling the vast memory footprint that in-memory databases like SAP HANA demand. Furthermore, the module’s octal rank architecture leverages rank interleaving to keep the 3200 MT/s bus saturated. In a real-time financial analytics engine, this translates directly to lower effective latency and higher sustained throughput, as the memory controller can dispatch reads to alternating ranks while others are refreshing. Operating at a cool 1.2V, it also helps constrain the thermal envelope inside densely packed 2U data center chassis, where every watt of saving reduces cooling overhead and extends component lifespan.
This module is a 256GB DDR4-3200 Registered ECC RDIMM (octal-rank x4), purpose-built for enterprise servers. Below are capacity planning guidelines for typical server workloads.
General Virtualization
Populate one DIMM per memory channel (typically 8 modules per dual-socket server) to deliver 2TB of balanced, high-bandwidth capacity. This comfortably supports 100+ moderate virtual machines while leaving headroom for memory overcommitment without excessive swap pressure. Leave half the slots empty for future scale-out.
In-Memory Database
Deploy at least 4 modules (1TB) for mid-tier in-memory workloads such as Redis or SAP HANA, and scale to 12–16 modules (3–4TB) for large production instances. Always use identical 256GB RDIMMs in interleaved configurations to avoid NUMA imbalances, and rely on ECC to eliminate silent data corruption.
High-Performance Computing
For bandwidth-sensitive HPC jobs, install exactly one DIMM per channel across all available channels—usually 8 modules per node for 2TB of uniform-bandwidth memory. If capacity is the primary constraint, populate two DIMMs per channel, but plan for a slight drop in memory clock speed. Registered ECC safeguards data integrity across extended parallel runs.
Rigorously tested and compatible with Dell PowerEdge R760, HPE ProLiant DL380 Gen11, Lenovo ThinkSystem SR650 V3 servers.
Q: Can I mix this M386ABG40M51-CAE with other memory modules of different brands or speeds?
A: Mixing RDIMMs from different brands or with varying speeds is not recommended. It may cause system instability or failure to POST. For reliable 24/7 server operation, always install identical modules with the same rank, speed, and ECC characteristics.
Q: Is this memory compatible with my server platform (Intel Xeon or AMD EPYC)?
A: It is a standard DDR4-3200 ECC Registered DIMM. It is broadly compatible with Intel Xeon Scalable (2nd Gen and newer) and AMD EPYC 7002/7003 series platforms. Always verify against your server motherboard’s qualified vendor list (QVL).
Q: What is the recommended DIMM population order for optimal performance with this octal-rank RDIMM?
A: Populate identical modules per channel starting with the farthest slot from the CPU. With octal-rank modules, install them in matched sets across memory channels to maintain balanced interleaving and avoid reduction in operating speed as per platform guidelines.
Q: Does this 256GB DDR4 ECC Registered module support overclocking or XMP profiles?
A: No. This is a server-grade, JEDEC-compliant RDIMM running at its native DDR4-3200 speed (PC4-25600) with a fixed CL22 latency. It does not support overclocking or XMP profiles, ensuring maximum data integrity.
Q: What warranty and typical failure rate can I expect for this module?
A: It includes a 1-year warranty. Engineered with high-quality ECC DRAM, typical AAFR is extremely low under specified conditions, making it suitable for mission-critical enterprise environments where uptime is paramount.