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Samsung M391B2873GB0-YH9 1GB DDR3 UDIMM 1333MT/s | Reliable ECC

MPN:M391B2873GB0-YH9 By:Samsung Warranty:1 year
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General

ModelM391B2873GB0-YH9
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity1 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL9
RankSingle Rank x8
Quantity of Pins240-pin
RAM GenreUDIMM

Engineer's Note

Designed as an unbuffered ECC UDIMM for cost-conscious server and workstation builds, this DDR3-1333 module ensures 24/7 data integrity in applications like file serving and light virtualization. Its single-rank x8 configuration and 1.35V low-voltage operation reduce electrical loading and power consumption, enabling stable, cool-running memory expansion on legacy AMD and Intel platforms that require ECC support.

Technical Specs & Insights

1. ECC error detection and correction silently prevents single-bit memory faults from cascading into service outages, preserving transaction accuracy in always-on file servers and micro-hosting appliances.
2. Unbuffered signal topology removes the register chip, cutting command-to-data latency and improving compatibility for cost-optimized single-socket server boards running lightweight hypervisors.
3. Low-voltage operation shrinks the power envelope per module, cumulatively lowering energy draw and thermal stress in dense storage nodes that spin nonstop.
4. Mainstream DDR3 frequency supplies consistent bandwidth headroom for concurrent client access, keeping small-office NAS units and proxy caches responsive under peak load.
5. Nine-cycle column-access latency shortens the window between row activation and data fetch, accelerating small-block read patterns common in business database and directory lookups.

Why These Specs Matter

Based on the UDIMM form factor, 240-pin design, and integrated ECC technology, the M391B2873GB0-YH9 is undeniably a server-grade memory module built for entry-level servers and workstations. For IT administrators maintaining legacy systems or specialized appliances, four key characteristics translate directly into operational resilience.

First, the ECC error correction is your safety net against silent data corruption. In a small-business database server processing financial transactions, a single-bit flip caused by background radiation can crash an application or, worse, corrupt a record with zero warning. This module detects and corrects those errors in real time, ensuring data integrity over months of uptime. Second, the Unbuffered architecture and Single Rank x8 configuration minimize access latency. When the same server hosts a lightweight virtualized firewall, every CPU cycle counts; unbuffered signaling eliminates the lag of a register chip, keeping packet inspection snappy. Third, the 1.35V low-voltage operation dramatically curtails power consumption and heat generation inside a cramped 1U chassis, reducing cooling costs and extending the life of surrounding components. Finally, the strict JEDEC DDR3-1333 timing at CL9 guarantees seamless plug-and-play compatibility with older server chipsets that demand proven stability over experimental speed, so your legacy deployment stays predictably operational without erratic boot failures.

Endurance & Reliability

General Virtualization
For DDR3 ECC UDIMMs of 1 GB each, equip both CPU sockets in a dual‑socket server with at least three modules per processor to populate one DIMM per channel. This 6 × 1 GB (6 GB) baseline provides basic memory interleaving and error correction for light virtual machines. Scale to 12 modules (12 GB) if running more guests, but note that modern hypervisors typically demand far larger capacities—consider migrating to higher‑density DIMMs when growth requires it.

In‑Memory Database
In‑memory databases thrive on capacity and bandwidth. Fill every available memory channel with these 1 GB UDIMMs—on a platform with eight channels per CPU, install 16 identical modules (16 GB per node) to maximise interleaving and reduce latency. For larger working sets, use the largest supported kit across all channels, keeping the configuration fully balanced to avoid performance penalties from non‑uniform memory access.

High‑Performance Computing (HPC)
HPC workloads demand peak memory throughput. Populate all memory channels equally with identical M391B2873GB0‑YH9 sticks, for instance four modules per processor on a quad‑channel board, achieving 4 GB per CPU. While total capacity is modest by modern standards, the uniform x8 single‑rank layout ensures consistent low latency and high bandwidth, critical for memory‑bound simulations. Supplement with additional identical DIMMs only when the node supports more channels to maintain perfect symmetry.

Verified Compatibility

Server memory rigorously tested, compatible with Dell PowerEdge T110 II, HP MicroServer Gen8, Lenovo ThinkServer TS140.

FAQ

Q: Can I mix this M391B2873GB0-YH9 with other memory modules of different brands or speeds?

A: Mixing is not recommended for server environments. All modules should share identical ECC, rank, and speed to maintain signal integrity and prevent system instability. Deviation may force fallback to lowest common speed.

Q: Is this memory compatible with my server or workstation platform?

A: It is designed for Intel Xeon E3 series and AMD Opteron 3000/4000 platforms using DDR3-1333 UDIMM ECC. Verify motherboard supports unbuffered ECC, 1.35V, and 240-pin DIMMs to ensure proper functionality.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical modules per memory channel, starting with the slot farthest from the CPU. Follow the motherboard manual; for single-rank x8 UDIMMs like this one, fill channel A first to maintain balanced ECC operation.

Q: Does this module support overclocking or XMP profiles?

A: No. As an ECC UDIMM built for stability, it adheres strictly to JEDEC DDR3-1333/PC3-10600 standards. Overclocking and XMP are disabled to preserve data integrity critical for server and workstation workloads.

Q: What warranty and typical failure rate can I expect?

A: This module carries a 1-year warranty. It is manufactured using Tier-1 components and rigorous screening, yielding an annualized failure rate (AFR) well below 0.5% under specified operating conditions, ensuring reliable long-term deployment.

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