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| Model | M391T2863QZ3-CE6 |
|---|---|
| Product Type | Memory Module |
| Compliance Standards | EU RoHS,FCC |
| Memory Capacity | 1 GB |
| Memory Technology | DDR2 |
| Product Voltage | 1.8V |
| RAM Speed | 667MHz |
| RAM Standard | DDR2-667/PC2-5300 |
| Error Identifying | ECC |
| Signal Type | Unbuffered |
| Column Access Strobe (CAS) | CL5 |
| Rank | Single Rank x8 |
| Quantity of Pins | 240-pin |
| RAM Genre | UDIMM |
Targeted for entry-level servers and workstations requiring data integrity, this Samsung M391T2863QZ3-CE6 1GB DDR2-667 UDIMM leverages unbuffered ECC to detect and correct single-bit errors in real time, safeguarding critical computations in file servers or light virtualization hosts. Its single-rank x8 configuration and CL5 latency reduce the electrical load on the memory controller, ensuring stable, low-latency operation on legacy platforms with 240-pin DDR2 slots.
1. On-the-fly error correction safeguards transactional data integrity, eliminating silent memory corruption that could crash critical legacy workloads.
2. Unbuffered signaling reduces latency and controller overhead, delivering a cost-effective reliability solution for small-scale server deployments.
3. A single-gigabyte density addresses essential OS footprints, ideal for dedicated lightweight services or embedded virtualization hosts.
4. Single-rank configuration minimizes bus loading, enabling full population of all DIMM slots while maintaining stable signal integrity in compact server nodes.
5. PC2-5300 bandwidth delivers balanced throughput for concurrent client requests, matching the needs of entry-level networking appliances and legacy file servers.
The Samsung M391T2863QZ3-CE6 is an unbuffered ECC DDR2 memory module built for entry-level servers and workstations where data integrity and cost-effective reliability intersect. Its most critical feature is Error Correcting Code (ECC), which automatically detects and corrects single-bit memory errors caused by background radiation or electrical noise. In a 24/7 branch-office DNS or firewall appliance, even one uncorrected bit flip can crash the service or corrupt routing tables. ECC ensures your infrastructure stays silently accurate, eliminating mysterious outages that are difficult to diagnose.
The unbuffered design delivers lower latency than registered alternatives because commands travel directly to the DRAM chips without a buffer stage. For a lightweight database server handling inventory lookups or point-of-sale transactions, this means quicker response times under moderate concurrency. Paired with the CL5 latency at 667 MHz and a single-rank x8 organization, the module provides a predictable access pattern that helps older server chipsets maintain stable command-to-data timing margins. The standard 1.8V operating voltage keeps thermal stress low inside compact 1U chassis, where airflow is limited. Together, these characteristics make the module a dependable choice for legacy systems that demand unwavering uptime without excessive power draw.
General Virtualization
For legacy servers supporting DDR2, general virtualization workloads demand maximum memory capacity within limited DIMM slots. Each M391T2863QZ3-CE6 module provides only 1 GB, so populate all available slots to reach at least 8–16 GB for basic hypervisor operations. Enable ECC to protect virtual machine integrity, and ensure identical modules are used to avoid compatibility issues. Given the single‑rank x8 design, sticking to homogeneous configurations prevents signal degradation on older chipsets.
In-Memory Database
In-memory databases require both low latency and large capacity, making this 1 GB DDR2-667 UDIMM insufficient for modern deployments. On legacy systems, maximize usable RAM by installing the maximum number of identical modules (e.g., 8×1 GB for 8 GB) to hold small datasets entirely in memory. Pair with CL5 timings to reduce latency, but acknowledge that the 667 MHz speed and 1 GB density severely restrict dataset size—plan to partition or archive data aggressively.
High-Performance Computing (HPC)
HPC clusters built on older nodes can still leverage these ECC UDIMMs for stability-sensitive calculations. Fill all memory channels with identical M391T2863QZ3-CE6 modules to achieve dual‑ or quad‑channel bandwidth, which helps with memory‑bound parallel workloads. The unbuffered design lowers latency compared to registered alternatives, but the 1 GB capacity limits per‑node memory to a few gigabytes—suitable only for lightweight or highly distributed computational tasks where raw aggregate memory across nodes compensates for per‑node limitations.
Rigorously tested server UDIMM compatible with Dell PE 840, HP ML110 G5, IBM x3200.
Q: Can I mix this M391T2863QZ3-CE6 with other memory modules of different brands or speeds?
A: Mixing modules is not recommended for ECC UDIMMs. Different brands, speeds, or ranks can cause timing conflicts and system instability. For reliable error correction, install identical modules in all occupied slots.
Q: Is this memory compatible with my server or workstation?
A: It is designed for platforms supporting DDR2-667 ECC Unbuffered DIMMs, such as select Intel Xeon 3000/5000 series or AMD Opteron 1000 series boards. Please verify your motherboard requires 240-pin ECC UDIMMs.
Q: What is the recommended DIMM population order for optimal performance?
A: Follow your motherboard manual. Typically, populate slots starting from the farthest channel from the CPU, often in pairs. For single-rank x8 modules, balancing across memory channels maximizes bandwidth while maintaining ECC functionality.
Q: Does this module support overclocking or XMP profiles?
A: No. As a server-grade ECC Unbuffered DIMM, it operates at fixed JEDEC standard DDR2-667 timings. XMP and overclocking are not supported; stability and data integrity are prioritized over enthusiast tuning.
Q: What warranty and typical failure rate can I expect?
A: This module includes a one-year warranty. M391T2863QZ3 is built to rigorous standards, yielding a typical annualized failure rate below 0.5% when operated within specified voltage and temperature conditions.