General

Engineer's Note

This is a server-class DDR3 VLP RDIMM with ECC, purpose-built for dense virtualization platforms, in-memory databases, and other enterprise workloads demanding 24/7 data integrity. Its dual-rank x4 architecture and Registered signal type ensure strong signal stability and reliable error correction in multi-DIMM configurations, while the low-profile form factor makes it an ideal fit for space-constrained 1U/2U rack servers.

Technical Specs & Insights

1. ECC protection detects and corrects single-bit errors, crucial for preserving data integrity in long-running server workloads and preventing silent data corruption.
2. Registered signal type buffers command and address signals, allowing stable operation across fully populated memory channels in multi-socket servers.
3. Very low-profile form factor reduces module height to improve airflow in dense rack servers, directly lowering fan power consumption and thermal buildup.
4. Dual Rank x4 organization leverages interleaving to boost effective memory bandwidth, accelerating concurrent data access for virtual machines and databases.
5. This capacity per module hits a sweet spot for cost-effective server consolidation, supporting a healthy number of virtual machines while leaving room for future scaling.

Why These Specs Matter

The Samsung M392B1K70BM1-CH9 is a DDR3 VLP RDIMM purpose‑built for enterprise servers, and its four core attributes directly address the critical pain points of always‑on data centers. In a virtualization cluster, the registered signal buffer ensures signal integrity even when all memory slots are populated, letting you maximize capacity to host dozens of virtual machines on a single node without risking unexpected crashes or memory errors that stall production workloads. The integrated ECC continuously corrects single‑bit flips before they silently corrupt records in an in‑memory database like Redis or SAP HANA, preserving transactional accuracy and the trust of your financial or healthcare analytics. With a dual‑rank design, the module leverages bank interleaving to raise effective bandwidth, shrinking query latency and speeding real‑time data ingestion under heavy concurrent access. Meanwhile, the Very Low Profile form factor carves out precious millimeters in dense 1U and blade chassis, improving airflow and reducing thermal hotspots; this lowers fan power draw and extends component lifespan across your entire rack. For operators managing virtualized infrastructure or performance‑critical database tiers, these capabilities translate directly into fewer service interruptions, higher throughput, and a measurably better total cost of ownership.

Endurance & Reliability

Capacity Planning Guide for M392B1K70BM1-CH9 (DDR3-1333 ECC Registered VLP RDIMM)

This module is a server-class DDR3 ECC Registered DIMM, identified by its registered signal type, error correction, and 240-pin very low profile form factor. Capacity planning should leverage its reliability and compatibility with dual-socket or multi-socket platforms.

General Virtualization
For a vSphere or Hyper-V host running 20–40 typical VMs, populate six to eight identical 8 GB RDIMMs per socket to balance memory channels and maximize bandwidth. Configure in multiples of three or four DIMMs per CPU (tri-channel or quad-channel) to avoid performance penalties. Reserve spare ranks for advanced ECC features like SDDC where supported.

In-Memory Database
Workloads such as Redis or SAP HANA with large in-memory datasets demand high capacity and fault tolerance. Install the maximum supported DIMMs per server node, typically twelve to sixteen 8 GB modules, to reach 96–128 GB while maintaining heat efficiency through VLP design. Populate all memory channels evenly to sustain high throughput and low latency under heavy read/write loads.

High-Performance Computing
HPC clusters often require a balance of capacity and memory bandwidth per core. For a dual-socket compute node, configure eight or twelve 8 GB RDIMMs (64–96 GB total) in a balanced channel population to feed all memory controllers. The registered buffer reduces electrical load, enabling stable, large-scale deployments at 1333 MHz, while ECC ensures data integrity during long-running simulations.

Verified Compatibility

Rigorously tested. Compatible with Dell PowerEdge R620/R720, HP ProLiant DL380p Gen8, IBM System x3650 M4.

FAQ