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Samsung M392B1K73CM0-YF8 8GB DDR3 VLP RDIMM 1066MT/s | Reliable ECC

MPN:M392B1K73CM0-YF8 By:Samsung Warranty:1 year
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General

ModelM392B1K73CM0-YF8
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity8 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1066MHz
RAM StandardDDR3-1066/PC3-8500
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL7
RankQuad Rank x8
Quantity of Pins240-pin
RAM GenreVLP RDIMM

Engineer's Note

This DDR3-1066 VLP RDIMM is purpose-built for rack-dense servers and memory-intensive workloads such as virtualization and in-memory databases, where its registered ECC architecture ensures end-to-end data integrity and signal stability under high channel loads. The quad-rank x8 organization maximizes capacity per channel within ultra-low-profile 1U/2U chassis, while 1.35V operation and CL7 latency deliver an optimal balance of power efficiency and responsive transaction processing.

Technical Specs & Insights

1. The quad-rank architecture amplifies bank-level parallelism, sustaining consistent bandwidth under heavy virtualization and database consolidation.
2. ECC protection transparently corrects single-bit errors, preserving data integrity for financial processing and long-duration compute tasks.
3. Registered buffering isolates the memory controller from electrical loading, ensuring rock-solid stability even when all server slots are densely populated.
4. Ultra-low voltage operation cuts power consumption per module, directly lowering cooling costs and improving energy efficiency in large-scale data centers.
5. The very low-profile design maximizes clearance for chassis airflow, essential for high-density rack and blade servers where thermal constraints are critical.

Why These Specs Matter

Targeting the relentless demands of data center infrastructure, the Samsung M392B1K73CM0-YF8 is an 8GB DDR3 VLP RDIMM engineered for stability in dense server deployments. Its registered architecture with ECC is not just a feature—it is a safeguard. In a virtualized cluster running multiple VMs, cosmic-ray-induced bit flips can silently corrupt guest memory. ECC detection and correction prevents these errors from escalating into application crashes or data loss, ensuring service continuity for businesses where uptime is revenue.

The module’s Quad Rank x8 organization becomes critical under heavy database workloads. A memory-intensive in-memory database like Redis or SAP HANA thrives on high bank-level parallelism; quad rank populates all available banks to sustain command throughput, reducing idle cycles when thousands of concurrent queries hit the same channel. Paired with its very low profile form factor and 1.35V operation, this DIMM allows blade servers to maximize capacity without airflow obstruction or thermal recirculation—meaning higher packing density, cooler running nodes, and less energy spent on cooling, directly lowering your total cost of ownership in scale-out analytics and private cloud environments.

Endurance & Reliability

General Virtualization
For a typical hypervisor host running multiple moderate VMs, populate at least six of these 8GB VLP RDIMMs across triple-channel memory controllers (total 48GB). This balances capacity and memory bandwidth while leaving room for future expansion. Avoid single-channel configurations, as they bottleneck memory throughput under consolidated workloads.

In-Memory Database
In-memory databases like Redis or SAP HANA demand maximum capacity and fault tolerance. Deploy a fully populated system—twelve or more modules (96GB+)—and leverage memory mirroring or sparing modes if supported. The registered ECC and quad-rank design ensure data integrity, but be aware of the slight latency penalty and verify platform compatibility with quad-rank DIMMs at target speeds.

High-Performance Computing
HPC workloads benefit from balanced memory bandwidth per core. Install modules in multiples of the platform’s memory channels (e.g., eight DIMMs for quad-channel boards) to avoid bandwidth starvation. Since these are low-voltage 1066MHz parts, they suit dense, power-conscious clusters where thermal constraints limit higher-speed memory; prioritize population symmetry across sockets for uniform NUMA access.

Verified Compatibility

This DDR3 VLP RDIMM is rigorously tested and compatible with Dell R710, HP DL380 G7, Lenovo x3650 M3.

FAQ

Q: Can I mix this M392B1K73CM0-YF8 with other memory modules of different brands or speeds?

A: We strongly advise against mixing modules with different brands or speeds in server environments. Mismatched DIMMs can cause instability and parity errors, compromising ECC and registered memory reliability.

Q: Is this memory compatible with my system?

A: This DDR3 Registered ECC VLP RDIMM is designed for Intel Xeon E5/E5 v2 and equivalent AMD platforms using the C602/C606 chipset. Verify that your server supports 8 GB quad-rank 240-pin modules.

Q: What is the recommended DIMM population order for optimal performance?

A: Follow the server board manual for memory channel interleaving. Generally, populate identical quad-rank modules starting with the farthest slot from the CPU per channel for balanced signal integrity.

Q: Does this module support overclocking or XMP profiles?

A: No. This is an enterprise DDR3 RDIMM manufactured to JEDEC DDR3-1066 specifications. Overclocking and XMP are not supported, as they would violate the hardware validation and reliability standards required for server operation.

Q: What warranty and typical failure rate can I expect?

A: This module is covered by a one-year warranty. When operated within specifications, enterprise DDR3 Registered DIMMs exhibit an annualized failure rate well below 0.5%, ensuring exceptional long-term data integrity.

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