| Product Type | Memory Module |
|---|---|
| Compliance Standards | RoHS,WEEE |
| Memory Capacity | 32 GB |
| Memory Technology | DDR4 |
| Product Voltage | 1.2 V |
| RAM Speed | 3200 MHz |
| RAM Standard | DDR4-3200/PC4-25600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL22 |
| Rank | Dual Rank x8 |
| Quantity of Pins | 288-pin |
| RAM Genre | RDIMM |
This RDIMM module, with its registered signal type and ECC, is engineered for server platforms running memory-intensive workloads such as virtualization and in-memory databases, where the Dual Rank x8 configuration boosts bandwidth efficiency and the CL22 latency ensures predictable response under heavy loads. The 1.2V DDR4-3200 design delivers robust data integrity and error correction, making it ideal for enterprise environments that demand high reliability and sustained throughput.
1. ECC error correction silently detects and corrects single-bit memory faults, preserving financial transaction integrity and preventing silent data corruption in always‑on enterprise databases.
2. Registered signal buffering stabilizes command and address buses across populated DIMM slots, enabling confident memory scaling to multi‑terabyte capacities in virtualized server farms.
3. 32GB module capacity raises virtual machine density substantially, letting a single socket host more isolated tenants without tipping into disk‑swap performance cliffs.
4. Dual Rank x8 organization interleaves internal DRAM pages on each module, deepening memory‑level parallelism for consistently fast response under heavy OLAP query concurrency.
5. 3200MT/s transfer rate widens the data pipe to the CPU, shortening batch‑processing windows and speeding in‑memory analytics on large datasets.
The Samsung M393A4G43BB4-CWE is a 32GB DDR4-3200 Registered ECC RDIMM purpose-built for servers. ECC silently corrects single-bit errors, ensuring that a random bit flip in a virtualized cluster won't crash a VM or corrupt transactional data—this is the foundation of 24/7 uptime. The registered buffer stabilizes signal integrity across fully populated memory channels, letting you scale a node to 512GB or more without instability—critical for dense virtualization hosts. Its dual-rank x8 design interleaves access across two ranks, delivering higher effective bandwidth. For an in-memory database like Redis, this parallel operation cuts latency and accelerates response under heavy loads. Finally, 3200MT/s speed keeps latency low for data-hungry analytics. Together, these features enable infrastructure that grows with your business while keeping every bit of data absolutely trustworthy.
Capacity Planning Guide for 32GB DDR4-3200 ECC RDIMM
This 32GB DDR4-3200 Registered ECC module is built for server-class platforms. Its dual-rank x8 design and CL22 latency suit dense, reliable memory configurations. Below are capacity planning recommendations for typical server workloads.
General Virtualization
For consolidated VM hosts, balance capacity and channel utilization. Populate all memory channels symmetrically—one 32GB RDIMM per channel in a dual-socket server (16 DIMMs total) yields 512GB, ideal for moderate consolidation. This configuration sustains 3200 MT/s and delivers maximum bandwidth per core while ECC guards against in-memory errors across numerous VMs.
In-Memory Database
In-memory databases like SAP HANA demand vast capacity and high availability. Maximize capacity by populating all available slots, often achieving 1TB or more with 32GB RDIMMs (e.g., 32 modules in a 4-socket system). Maintain balanced ranks across channels; dual-rank DIMMs may reduce speed to 2933 MT/s when fully loaded, but the large footprint and data integrity outweigh the slight frequency drop for real-time analytics.
High-Performance Computing
HPC clusters prioritize memory bandwidth and predictable latency. Install one 32GB RDIMM per channel to maintain the full 3200 MT/s speed and avoid rank-related clock penalties. For dual-socket nodes with 8 channels, this provides 256GB of fast, symmetric memory per node—sufficient for most computational fluid dynamics or finite-element workloads while keeping power and thermal load in check.
Stringently validated server memory for Dell PowerEdge R750, HPE ProLiant DL380 Gen10 Plus, Lenovo ThinkSystem SR650 V2.
Q: Can I mix this M393A4G43BB4-CWE with other memory modules of different brands or speeds?
A: Mixing RDIMMs of different brands or speeds is strongly discouraged. It may lead to system instability, performance loss, or failure to POST. Use identical modules for guaranteed compatibility and reliability.
Q: Is this memory compatible with my system?
A: This DDR4-3200 Registered ECC RDIMM is designed for server platforms like Intel Xeon Scalable (2nd Gen+) and AMD EPYC 7002/7003 series. Confirm your system board supports Registered DIMMs and check the vendor QVL.
Q: What is the recommended DIMM population order for optimal performance?
A: Populate identical DIMMs per channel in matched sets. Typically, install one DIMM per channel in the primary slots first, then add to secondary slots. Consult your server’s manual for balanced, optimal memory configurations.
Q: Does this module support overclocking or XMP profiles?
A: No. As a server-grade registered ECC module, it adheres to JEDEC DDR4-3200 CL22 standards. It does not support overclocking or XMP, prioritizing data integrity and system stability for enterprise workloads.
Q: What warranty and typical failure rate can I expect?
A: This Samsung module includes a 1-year warranty. The typical annualized failure rate (AFR) for enterprise RDIMMs is well below 0.5%, ensuring exceptional reliability under continuous, mission-critical operation.