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| Product Type | Memory Module |
|---|---|
| Memory Capacity | 32 GB |
| Memory Technology | DDR4 |
| Product Voltage | 1.2 V |
| RAM Speed | 3200 MHz |
| RAM Standard | DDR4-3200/PC4-25600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL22 |
| Rank | Dual Rank x4 |
| Quantity of Pins | 288-pin |
| RAM Genre | RDIMM |
This 32GB DDR4-3200 RDIMM is purpose-built for enterprise server platforms, delivering uncompromising data integrity in virtualization clusters and memory-resident databases. Its dual-rank x4 configuration combined with Registered signaling ensures robust signal stability and interleaved bandwidth, while integrated ECC corrects single-bit errors to sustain round-the-clock reliability.
1. ECC protection actively detects and corrects single-bit memory errors, preserving data integrity for mission-critical enterprise workloads and financial transactions.
2. Registered signal buffering stabilizes command and address lines at high capacities, allowing dense server configurations without compromising signal integrity or uptime.
3. 32GB capacity per stick maximizes virtualization density, enabling more VMs per server and smoother live migrations in consolidated data center environments.
4. Dual Rank x4 organization interleaves memory accesses across multiple banks, sustaining throughput under concurrent heavy database queries and analytics.
5. DDR4-3200 speed delivers up to 25.6 GB/s bandwidth per channel, accelerating in-memory caching and real-time data processing with responsive latency.
The Samsung M393A4K40DB3-CWE is a 32GB DDR4-3200 Registered DIMM purpose-built for server platforms that cannot compromise on resilience or scale. In virtualized clusters running VMware or Hyper‑V, the onboard ECC silently corrects single‑bit memory errors caused by background radiation before they can corrupt a hypervisor’s state, effectively eliminating silent guest kernel panics that otherwise lead to unexplained downtime. Its registered architecture buffers command and address signals, decoupling the memory controller from heavy electrical loads. For you, this means fully populating all 24 DIMM slots in a dual‑socket rack server without sacrificing signal integrity, enabling truly dense virtual machine consolidation. When that same infrastructure powers an in‑memory database such as SAP HANA or Redis, the dual‑rank x4 organization works in concert with 3200MT/s bandwidth to interleave banks and saturate the channel, dramatically accelerating real‑time query processing. At just 1.2V, the module further reduces aggregate power draw across your data center, easing thermal management and operating costs. This memory transforms raw stability and bandwidth into tangible business outcomes: zero‑disruption virtualization and high‑velocity database transactions.
General Virtualization
For a virtualization host running multiple VMs, memory capacity and reliability are critical. This 32GB DDR4-3200 RDIMM allows you to densely populate a dual-socket server with eight or more identical modules, achieving 256GB+ while maintaining balanced memory channels. The registered ECC design ensures data integrity under sustained, mixed-workload conditions, and populating one DIMM per channel (1DPC) at 3200 MT/s delivers the optimal balance of bandwidth and latency for hypervisor overhead.
In-Memory Database
In-memory databases such as Redis or SAP HANA demand large, error-free memory pools and low latency. Deploy these 32GB dual-rank RDIMMs in a configuration that fills all memory channels, aiming for 512GB to 1TB total capacity using 16 to 32 modules on a multi-socket platform. The x4 organization and ECC protection are essential for handling high-velocity transactions, while the 3200 MT/s speed helps reduce data access stalls during heavy cache loads.
High-Performance Computing (HPC)
HPC clusters often require maximum memory bandwidth per node alongside absolute data integrity. Install these modules in a symmetric, fully populated layout—typically one or two DIMMs per channel—across all memory controllers to sustain peak throughput for simulation and modeling codes. Registered ECC and dual-rank construction enable stable operation at 3200 MT/s, preventing silent data corruption during week-long parallel runs, while 32GB capacity per stick lets you scale nodes to the 256GB–512GB sweet spot without wasting precious budget on over-provisioning.
Rigorously tested, this server DDR4 RDIMM is compatible with Dell PowerEdge R750, HPE ProLiant DL380 Gen10, Lenovo ThinkSystem SR650 V2.
Q: Can I mix this M393A4K40DB3-CWE with other memory modules of different brands or speeds?
A: Mixing different brands or speeds in a registered server environment is not recommended. It may cause signal integrity issues, instability, and is not validated for mission‑critical workloads.
Q: Is this memory compatible with my system? Specifically, which Intel or AMD server platforms support this 32GB DDR4‑3200 RDIMM?
A: This RDIMM is compatible with Intel Xeon Scalable (Skylake‑SP and newer) and AMD EPYC 7002/7003 series platforms that support DDR4‑3200 registered ECC memory. Verify your board’s memory QVL.
Q: What is the recommended DIMM population order for optimal performance with this dual‑rank x4 RDIMM?
A: Follow your server board’s manual. Typically, populate one DIMM per channel first, then add matching pairs. For dual‑rank x4 modules, balanced channel loading ensures best throughput and thermal balance.
Q: Does this module support overclocking or XMP profiles?
A: No. As a server‑grade registered DIMM, it operates exclusively at JEDEC standard DDR4‑3200 with CL22 timings. There is no XMP profile and overclocking is not supported for reliability reasons.
Q: What warranty and typical failure rate can I expect for this Samsung RDIMM?
A: This unit includes a 1‑year warranty. Server memory like this Samsung RDIMM has very low AFR (annual failure rate), typically below 0.3%, due to rigorous screening and 24/7 enterprise validation.