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Samsung M393ABG40M52-CYF 256GB DDR4 RDIMM 2933MT/s | Massive Capacity

MPN:M393ABG40M52-CYF By:Samsung Warranty:1 year
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General

Product TypeMemory Module
Memory Capacity256 GB
Memory TechnologyDDR4
Product Voltage1.2V
RAM Speed2933MHz
RAM StandardDDR4-2933/PC4-23400
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL21
RankOctal Rank x4
Quantity of Pins288-pin
RAM GenreRDIMM

Engineer's Note

Designed for enterprise servers, this 256GB DDR4-2933 Registered DIMM with ECC delivers the data integrity and reliability essential for virtualization, in-memory databases, and mission-critical workloads. Its octal-rank x4 configuration maximizes capacity density per channel while the registered signal type ensures stable operation in high-memory configurations, and the 1.2V low-power design helps reduce thermal overhead in dense rack deployments.

Technical Specs & Insights

1. A 256GB capacity enables massive in-memory databases and high-density virtualization, letting a single server host hundreds of VMs without touching swap space.
2. 2933 MT/s throughput accelerates data-intensive analytics and AI inference pipelines, preventing memory bottlenecks under concurrent multi-tenant workloads.
3. ECC protection silently corrects single-bit errors, preserving data integrity during continuous operation and eliminating corruption risks in financial or scientific computing.
4. Registered signal buffering stabilizes large memory populations across multiple DIMMs per channel, making scale-out configurations feasible without sacrificing uptime.
5. Octal Rank x4 organization saturates memory channels with parallel access, sustaining the high bandwidth needed for real-time transactional processing and cloud microservices.

Why These Specs Matter

Introducing the Samsung M393ABG40M52-CYF, a 256GB DDR4-2933 Registered ECC memory module that redefines server reliability and density. When you run a virtualized cluster with hundreds of VMs, a single undetected memory bit flip can silently corrupt data and crash the entire host. Its ECC engine corrects single-bit errors in real time, directly preserving uptime for critical services. The registered buffer reduces electrical load on the CPU’s memory controller, so you can populate all DIMM slots with these high-capacity modules without sacrificing signal integrity—essential for reaching multi-terabyte footprints in hypervisors. In an in-memory database like SAP HANA, the 2933 MHz clock and octal-rank x4 design interleave operations across eight ranks, boosting parallel access and slashing query latency. The 1.2V operating voltage further lowers power and cooling costs in dense racks. Ultimately, these capabilities let you consolidate more workloads onto fewer servers, reducing licensing and management overhead.

Endurance & Reliability

General Virtualization
For general virtualization hosts, populate memory channels symmetrically to maximize bandwidth. A balanced configuration using eight 32GB RDIMMs (256GB total) across all channels on a dual-socket platform leaves room for growth while maintaining optimal performance. Avoid mixing DIMM ranks or capacities per channel to prevent NUMA imbalances and latency penalties.

In-Memory Database
In-memory databases demand both extreme capacity and low latency. Leverage the registered octal-rank x4 design by fully populating each memory channel with identical 256GB modules, achieving multi-terabyte footprints on a single node. Keep the 2933 MT/s speed and populate two DIMMs per channel only if the platform supports it without clocking down, ensuring large datasets reside entirely in DRAM.

High-Performance Computing (HPC)
HPC workloads like computational fluid dynamics thrive on high memory bandwidth. Populate one DIMM per channel using multiple 256GB RDIMMs to sustain 2933 MT/s, then scale out across nodes. For capacity-optimized HPC, balance core count and memory channels—each socket should see all channels filled identically to avoid bandwidth bottlenecks during parallel I/O and simulation checkpointing.

Verified Compatibility

Lab-validated for server use. Compatible with Dell PowerEdge R740, HPE ProLiant DL380 Gen10, Lenovo ThinkSystem SR650, and similar systems.

FAQ

Q: Can I mix this M393ABG40M52-CYF with other memory modules of different brands or speeds?

A: Mixing this registered ECC module with different brands or speeds is strongly discouraged. It may cause system instability, POST failures, or silent data corruption. Always use identical modules for server-grade reliability.

Q: Is this memory compatible with my system?

A: This RDIMM is compatible with servers supporting DDR4-2933 Registered ECC memory, such as Intel Xeon Scalable Gen2/Gen3 or AMD EPYC platforms. Verify your motherboard’s QVL for M393ABG40M52-CYF.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate DIMMs starting from the farthest slot from the CPU, following the motherboard’s guide. With its octal rank, use one DIMM per channel to maintain 2933 MHz speed and avoid rank loading penalties.

Q: Does this module support overclocking or XMP profiles?

A: No. This server-grade RDIMM strictly adheres to JEDEC DDR4-2933 standards. It does not support overclocking, XMP profiles, or user-configurable timings, prioritizing stability and data integrity above all.

Q: What warranty and typical failure rate can I expect?

A: This Samsung module includes a 1-year warranty. Enterprise RDIMMs like this deliver an extremely low annualized failure rate, typically under 0.1%, ensuring dependable operation in mission-critical deployments.

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