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Samsung M393B1G73DB0-YK0 8GB DDR3 RDIMM 1600MT/s|Reliable ECC RDIMM

MPN:M393B1G73DB0-YK0 By:Samsung Warranty:1 year
US$145 - $158
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General

ModelM393B1G73DB0-YK0
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity8 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1600MHz
RAM StandardDDR3-1600/PC3-12800
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL11
RankDual Rank x8
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

This Samsung M393B1G73DB0-YK0 is a 1.35V 8GB DDR3-1600 RDIMM with ECC, purpose-built for virtualization, in-memory databases, and other enterprise server workloads where data integrity and uptime are non-negotiable. Its registered signal type and dual-rank x8 organization deliver superior signal stability and interleaved access efficiency under fully populated configurations, while CL11 latency keeps response times tight for transactional processing.

Technical Specs & Insights

1. ECC error correction safeguards transactional data integrity, preventing silent memory corruption in mission-critical database and financial services.
2. Registered signal buffering stabilizes high-density memory configurations, enabling seamless scaling for large-scale virtualization clusters.
3. Dual Rank x8 organization leverages rank interleaving to boost effective bandwidth, accelerating concurrent VM memory access during heavy consolidation.
4. 1.35V low-voltage operation reduces data center power draw and thermal load, improving total cost of ownership for dense server farms.
5. 8GB capacity per module allows sufficient memory headroom for mid-tier virtualized workloads without oversubscribing host resources.

Why These Specs Matter

The Samsung M393B1G73DB0-YK0 is an 8GB DDR3-1600 registered DIMM, engineered specifically for enterprise servers where every bit matters. Its ECC capability continuously detects and corrects single-bit memory errors, which is non-negotiable for in-memory databases like Redis or SAP HANA—one silent bit-flip during a financial transaction could corrupt records and erode client trust. The registered buffer architecture reduces electrical loading on the memory controller, allowing you to populate all channels with high-capacity modules while preserving signal integrity. In a virtualization cluster running 40 VMs per host, this translates into consistent low latency and stable guest performance even under heavy overcommitment. Operating at a low 1.35V saves significant power across a rack full of nodes, directly lowering cooling demands and operational expenditure. Additionally, the dual-rank x8 organization interleaves two internal ranks to increase bandwidth efficiency, accelerating throughput for large dataset analytics. For IT operators, this module delivers dependable uptime, sustainable density for mixed workloads, and a reduced energy footprint—transforming memory from a generic component into a tangible driver of service reliability and data center economics.

Endurance & Reliability

Memory Type Identification
The M393B1G73DB0-YK0 is a server-grade DDR3 RDIMM with ECC and registered signaling, designed for stability and reliability in multi-socket servers. Its 1.35V low-voltage operation reduces power consumption while maintaining 1600MHz speed.

General Virtualization
Equip dual-socket servers with at least 12–16 identical 8 GB modules spread across all memory channels (e.g., 96–128 GB total) to maximize bandwidth and avoid NUMA imbalances. Populate one DIMM per channel initially, then add a second in each channel for dual-rank balance if memory demand grows, keeping vCPU-to-memory ratios around 1:4.

In-Memory Database
Maximize capacity per server by fully populating all channels with 8 GB RDIMMs, targeting 256 GB or more, so entire datasets reside in RAM. Use a balanced configuration with equal DIMMs per socket and enable interleaving for lowest latency, which is critical for real-time analytics on platforms such as Redis or SAP HANA.

High-Performance Computing
Configure memory for peak bandwidth: install pairs of matched modules per channel (2 DIMMs per channel × 4 channels per socket) to leverage dual-rank parallelism. A typical node would carry 16 modules (128 GB) per socket, supporting memory-bound workloads like computational fluid dynamics or molecular modeling with consistent 12800 MB/s throughput.

Verified Compatibility

Validated for servers, tested compatible with Dell PowerEdge R720, HP ProLiant DL380p Gen8, and IBM x3650 M4.

FAQ

Q: Can I mix this M393B1G73DB0-YK0 with other memory modules of different brands or speeds?

A: Mixing with different brands or speeds is not recommended for server environments. It may cause instability, unbootable states, or reduced reliability. All modules should match specifications exactly.

Q: Is this memory compatible with my system?

A: This DDR3-1600 Registered ECC RDIMM is designed for Intel Xeon E5-2600 series or AMD Opteron 6300 series platforms with 240-pin slots. Verify your server's chipset and supported memory type before ordering.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical dual-rank modules per channel starting from the furthest slot from the CPU. For dual-processor systems, balance memory across both sockets. Consult your server's maintenance guide for exact slot numbering.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a server-grade Registered ECC module operating at JEDEC standard DDR3-1600. Overclocking or XMP is not supported, as stability and data integrity are paramount in enterprise environments.

Q: What warranty and typical failure rate can I expect?

A: This module is backed by a one-year warranty against manufacturing defects. With proper cooling, enterprise DDR3 RDIMMs exhibit an annualized failure rate (AFR) typically below 0.5% under rated specifications.

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