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| Product Type | Memory Module |
|---|---|
| Memory Capacity | 16 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.35V |
| RAM Speed | 1333MHz |
| RAM Standard | DDR3-1333/PC3-10600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL9 |
| Rank | Dual Rank x4 |
| Quantity of Pins | 240-pin |
| RAM Genre | RDIMM |
This Samsung M393B2G70AH0-YH9Q5 is a server-grade DDR3-1333 Registered DIMM with ECC, ideally suited for virtualization hosts and in-memory databases where data integrity and stability under heavy load are critical. Its dual-rank x4 organization and 1.35V low-voltage operation reduce power consumption while maintaining reliable signal integrity through the registered architecture, ensuring consistent performance in dense multi-DIMM server configurations.
1. Enhanced module capacity allows data centers to pack more virtual machines per server node, directly cutting hardware footprint and licensing costs.
2. ECC protection corrects single-bit memory faults on the fly, safeguarding transactional databases from silent data corruption that could crash critical services.
3. The registered buffer architecture stabilizes command and address signals across fully populated channels, enabling large memory configurations without compromising uptime.
4. A dual-rank layout multiplies internal bank resources, sustaining peak bandwidth even when multiple analytics workloads contend for memory simultaneously.
5. Low-voltage operation reduces overall rack power draw and thermal output, which is vital for dense server farms striving to lower cooling overhead.
As a server-grade DDR3 Registered DIMM, the Samsung M393B2G70AH0-YH9Q5 is engineered to solve the real-world pain points of data center operators. Its four defining characteristics—ECC error correction, registered buffering, dual-rank architecture, and 1.35V low-voltage operation—directly translate into measurable uptime, scalability, and efficiency. In a virtualized cluster running dozens of VMs per host, a single bit flip caused by background radiation can silently corrupt guest memory and crash services. ECC hardware proactively detects and corrects these errors, letting your hypervisor maintain flawless multi-tenant operations and protecting data integrity around the clock. For in-memory databases like Redis or SAP HANA, the dual-rank x4 organization leverages rank interleaving to amplify bandwidth and slash latency during peak query loads, so real-time analytics never stall. The onboard registered clock buffer conditions and re-drives signals, enabling you to fully populate multiple DIMMs per channel without sacrificing speed—a must when scaling to hundreds of gigabytes of reliable memory. Meanwhile, DDR3L at 1.35V draws substantially less power than standard 1.5V modules, directly shrinking your energy bills and cooling demands in dense rack deployments. Every design choice in this module delivers rock-solid reliability, sustained high throughput, and a lower total cost of ownership for your critical server infrastructure.
General Virtualization
Populate all available memory channels with identical 16 GB DDR3-1333 RDIMMs to maximize capacity and maintain balanced channel bandwidth. Aim for one DIMM per channel for optimal speed, or two per channel if higher VM density is required, while observing the platform’s maximum supported ranks. ECC and registered signaling ensure stability for multiple tenant workloads.
In-Memory Database
Deploy six or more 16 GB modules across a triple- or quad-channel architecture to build a 96–128 GB low-latency footprint. Install matching DIMMs in each channel, leveraging dual-rank x4 organization for better bank interleaving and reduced access gaps. Enable memory sparing or mirroring on supported platforms to satisfy the strict uptime demands of Redis or SAP HANA-style workloads.
High-Performance Computing
Configure eight to twelve identical RDIMMs in a quad-channel server for 128–192 GB of uniform memory. Use one DIMM per channel where peak 1333 MT/s bandwidth is critical, or two per channel for capacity-intensive simulations, accepting slight clock downshifting. The 1.35 V low-power operation helps control thermals in dense clusters, while ECC protects long-running parallel jobs from silent data corruption.
Validated server DDR3 RDIMM, rigorously tested, compatible with Dell PowerEdge R720, HP DL380p Gen8, and more.
Q: Can I mix this M393B2G70AH0-YH9Q5 with other memory modules of different brands or speeds?
A: Mixing is not recommended for server environments. To ensure signal integrity and stability, populate all channels with identical RDIMMs of the same brand, speed, and rank configuration.
Q: Is this memory compatible with my system?
A: This DDR3-1333 ECC Registered DIMM requires a server board supporting 1.35V RDIMMs, such as Intel Xeon E5-2600 v1/v2 or select AMD Opteron 6300 series platforms. Please verify your motherboard’s memory QVL.
Q: What is the recommended DIMM population order for optimal performance?
A: Follow your server board’s manual, typically populating slots per memory channel evenly. For dual-rank x4 modules, fill identical slots first to maintain balanced interleaving and avoid bandwidth penalties.
Q: Does this module support overclocking or XMP profiles?
A: No. This is a JEDEC-compliant enterprise RDIMM with fixed CL9 and 1333MHz, designed for stability. It does not support overclocking or XMP profiles, ensuring 24/7 data integrity.
Q: What warranty and typical failure rate can I expect?
A: It comes with a 1-year warranty. As a Samsung-built ECC RDIMM, the annualized failure rate is extremely low, typically below 0.2%, delivering enterprise-class reliability for critical workloads.