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Samsung M393B2G70BH0-CH9Q9 16GB DDR3 RDIMM 1333MT/s | Reliable ECC

MPN:M393B2G70BH0-CH9Q9 By:Samsung Warranty:1 year
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General

ModelM393B2G70BH0-CH9Q9
Compliance StandardsEU RoHS,FCC
Product TypeMemory Module
Memory Capacity16 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

This 16 GB DDR3-1333 RDIMM with ECC and registered signaling is purpose‑built for servers and workstations running virtualization, in‑memory databases, and other data‑integrity‑critical workloads. Its dual‑rank x4 organization combined with CL9 latency balances high capacity access and signal stability, while error correction delivers end‑to‑end data integrity essential for 24/7 operation.

Technical Specs & Insights

1. ECC error correction automatically detects and corrects single-bit data errors, eliminating silent data corruption risks that are fatal to financial transactions and patient records.
2. Registered signal buffering offloads the memory controller by re-driving command and address lines, making it possible to populate all channels fully without sacrificing signal integrity in hyper-scale servers.
3. 16GB capacity per stick provides the density headroom to run twice the virtual machines on the same physical node, directly lowering software licensing and power costs per workload.
4. 1333MHz operating speed delivers a predictable bandwidth floor for latency-sensitive enterprise applications, keeping response times stable even when concurrent users spike.
5. Dual Rank x4 organization leverages rank interleaving to overlap read and write bursts, saturating the memory bus more efficiently and boosting overall throughput for virtualized databases.

Why These Specs Matter

When you are running a virtualized cluster hosting multiple mission‑critical workloads or an in‑memory database where microseconds define transaction success, the M393B2G70BH0‑CH9Q9 RDIMM is not just a component—it is your reliability foundation. Its built‑in ECC silently detects and corrects single‑bit errors, the kind that cosmic rays or voltage fluctuations can trigger. In a dense server farm, that means a corrupted memory cell will never cascade into a hypervisor crash or a silent data corruption that forces an expensive database consistency check. The registered buffer on this 16 GB DDR3‑1333 module stabilizes signal integrity across fully‑populated memory channels; when you equip a rack running dozens of virtual machines per node, the dual‑rank x4 organization further balances capacity and bandwidth, delivering predictable 10.6 GB/s throughput that prevents I/O stalls during rapid VM migration or Redis cache flushes. Every millisecond of latency avoided in a memory‑resident analytics engine translates directly into faster financial forecasts or real‑time fraud detection. With strict EU RoHS compliance and a 1.5 V operating envelope that respects your thermal budget, this module keeps your infrastructure both dependable and ecologically responsible, so your operations team can focus on innovation instead of memory‑related outages.

Endurance & Reliability

General Virtualization
For general virtualization hosts, deploy this 16GB DDR3-1333 RDIMM in balanced quantities to maximize memory density per channel. A common configuration is to populate all three channels per CPU with at least one DIMM each, totaling six modules for 96GB, which supports a moderate number of virtual machines without oversubscribing memory bandwidth.

In-Memory Database
In-memory databases demand both capacity and reliability; use the full 24 DIMM slots of a dual-socket server to reach 384GB with these 16GB ECC modules. Loading all slots with identical dual-rank x4 RDIMMs ensures consistent latency and the lowest possible access times, while registered buffering maintains signal integrity under heavy loads.

High-Performance Computing (HPC)
For HPC workloads that are sensitive to memory bandwidth, balance capacity with channel population rules. Install three DIMMs per processor to populate one DIMM per channel, delivering triple-channel throughput at 1333MHz, then scale by adding a second set of three for 96GB per node—this configuration optimizes for both bandwidth-sensitive simulations and capacity-bound data analysis without exceeding the supported ranks per channel.

Verified Compatibility

Validated for Dell R720, HP DL380p Gen8, IBM x3650 M4 — rigorously tested for seamless compatibility.

FAQ

Q: Can I mix this M393B2G70BH0-CH9Q9 with other memory modules of different brands or speeds?

A: Mixing is not recommended for server environments. This registered ECC module requires identical part numbers to maintain signal integrity and stability. Mismatched ranks, timings, or vendors may cause POST failures or memory errors.

Q: Is this memory compatible with my system? It's a server platform, Intel or AMD.

A: Compatibility requires a DDR3-based server board supporting registered ECC RDIMMs at 1333MHz (PC3-10600) with 1.5V. Verify with your system's qualified vendor list, especially for Intel Xeon E5-2400/E5-2600 v1/v2 or equivalent AMD Opteron platforms.

Q: What is the recommended DIMM population order for optimal performance?

A: Install identical DIMMs per memory channel, populating slots furthest from the CPU first. For this dual-rank RDIMM, populate in sets of three or four per channel for balanced interleaving. Consult your server board manual for exact slot numbering.

Q: Does this module support overclocking or XMP profiles?

A: No, this is an enterprise server module. It adheres strictly to JEDEC DDR3-1333 specifications with fixed CAS 9 latency. Overclocking or XMP is not supported and would compromise ECC reliability and platform stability.

Q: What warranty and typical failure rate can I expect?

A: This module carries a one-year warranty. As a premium server-grade RDIMM, it has a very low annualized failure rate (AFR) under 0.5% when operated within specified voltage and thermal limits, typical for mission-critical deployments.

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