| Model | M393B2G70BH0-YK009 |
|---|---|
| Compliance Standards | EU RoHS,FCC |
| Product Type | Memory Module |
| Memory Capacity | 16 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.35V |
| RAM Speed | 1600MHz |
| RAM Standard | DDR3-1600/PC3-12800 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL11 |
| Rank | Dual Rank x4 |
| Quantity of Pins | 240-pin |
| RAM Genre | RDIMM |
Designed for server environments, this Samsung 16GB DDR3L-1600 RDIMM (M393B2G70BH0-YK009) with ECC and registered logic ensures rock-solid data integrity for virtualization and in-memory database workloads. Its dual-rank x4 organization and low 1.35V operating voltage maximize memory bandwidth and energy efficiency in dense rack deployments.
1. The 16 GB capacity allows a single server to host more virtual machines and memory-resident services, directly improving consolidation ratios in demanding data centers.
2. ECC protection continuously corrects single-bit errors, preserving transactional integrity and preventing costly downtime for mission-critical enterprise applications.
3. Registered buffering stabilizes high-density memory configurations, enabling reliable multi-DIMM scaling without signal degradation in always-on server environments.
4. A 1600 MHz data rate delivers swift memory access that accelerates in-memory databases and real-time analytics under heavy user concurrency.
5. Dual Rank x4 interleaving maximizes channel utilization, sustaining consistent throughput even when virtualization workloads fluctuate dramatically.
The Samsung M393B2G70BH0-YK009 is a server-grade RDIMM engineered for mission-critical enterprise workloads. For a virtualization cluster running dozens of VMs per host, the integrated ECC is non-negotiable—it transparently detects and corrects single-bit memory errors caused by background radiation, preventing silent data corruption that could crash your entire tenant infrastructure or compromise transactional integrity. The registered buffer directly addresses signal degradation: it stabilizes the electrical load on the command bus, enabling you to fully populate 24 slots in a dual-socket server with these 16GB modules while preserving signal integrity, which is essential for scaling VM density without unexplained instability. Meanwhile, the dual-rank x4 organization interleaves internal memory banks to maximize throughput and reduce average latency. In an in-memory database like SAP HANA or a high-frequency Redis cache, this rank interleaving turns microsecond-level gains into faster query responses and higher transactions per second. Finally, operating at 1.35V instead of the legacy 1.5V standard cuts power consumption significantly—in a fully populated rack, this cumulative saving lowers energy bills and reduces thermal stress, extending the service life of your servers and memory.
General Virtualization
For a typical dual-socket server, install a minimum of six M393B2G70BH0-YK009 16GB RDIMMs per CPU to populate half the memory channels, achieving 96GB per node while maintaining balanced memory interleaving. This 1.35V low-power DDR3-1600 registered DIMM reduces overall energy draw in hypervisor clusters hosting 20–30 light VMs.
In-Memory Database
Maximize capacity by populating all 24 DIMM slots across two processors with identical 16GB sticks, yielding 384GB total. The RDIMM’s ECC and registered signal architecture is mandatory for transactional integrity in SAP HANA or Redis deployments. Operate at the native 1600MT/s to keep latency predictable under heavy caching workloads.
High-Performance Computing (HPC)
Deploy eight modules per node in a quad-channel configuration to sustain 51.2 GB/s theoretical bandwidth per socket. Dual Rank x4 organization boosts bank-level parallelism for large MPI matrix operations. Combine with a second identical set if job sets demand >128GB per compute node without sacrificing the performance benefits of populated channels.
Rigorously tested server memory, compatible with Dell PowerEdge R720/R620, HP DL380p Gen8, IBM x3650 M4, and more.
Q: Can I mix this M393B2G70BH0-YK009 with other memory modules of different brands or speeds?
A: Mixing is strongly discouraged in servers. Mismatched brands or speeds undermine signal integrity and may force the memory controller to downclock, causing instability or POST failures. Always use identical, validated modules.
Q: Is this memory compatible with my system? Which Intel or AMD platforms support it?
A: This DDR3 RDIMM is compatible with Intel Xeon E5-2600 v1/v2 and AMD Opteron 6300 series platforms using the C602/C606 chipsets. Verify your server board's Qualified Vendor List for this specific 1.35V registered DIMM.
Q: What is the recommended DIMM population order for optimal performance?
A: Populate identical DIMMs per channel, starting with the farthest slot from the CPU. For dual-processor systems, balance memory evenly across CPUs. Follow the server manual's memory-mirroring or sparing guidelines if supported.
Q: Does this module support overclocking or XMP profiles?
A: No. This is a registered server DIMM running at JEDEC-standard DDR3-1600. It does not support XMP or overclocking. Enterprise platforms require strict compliance with JEDEC timings for guaranteed data integrity.
Q: What warranty and typical failure rate can I expect?
A: This module is backed by a 1-year warranty. Enterprise-class DDR3 RDIMMs have an annualized failure rate below 0.5% under proper thermal conditions. ECC corrects most soft errors to ensure high reliability.