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Samsung M393B2G70EB0-CMAQ2M 16GB DDR3 RDIMM 1866MHz | Reliable ECC RAM

MPN:M393B2G70EB0-CMAQ2M By:Samsung Warranty:1 year
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General

Product TypeMemory Module
Memory Capacity16 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1866MHz
RAM StandardDDR3-1866/PC3-14900
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL13
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

Designed for enterprise server platforms, this 16GB DDR3-1866 RDIMM with ECC and registered signal technology ensures data integrity in virtualized environments and memory-intensive workloads like in-memory databases. The dual-rank x4 organization optimizes interleaving for higher sustained bandwidth, while the CL13 latency provides efficient access timing for critical 1.5V operation.

Technical Specs & Insights

1. Registered DIMM architecture buffers command and address signals, enabling high-capacity memory configurations and unwavering signal integrity in large-scale virtualization hosts.
2. ECC protection silently corrects single-bit errors, safeguarding transactional data and preventing costly downtime in always-on enterprise databases.
3. Dual Rank x4 organization interleaves memory accesses across banks, sustaining throughput for heavy consolidation workloads and improving VM responsiveness.
4. 1866 MHz frequency supplies ample bandwidth for real-time analytics and caching, keeping data pipelines saturated without stalling compute cores.
5. CL13 latency shrinks access delays, ensuring snappy response for latency-sensitive financial applications and hypervisor requests.

Why These Specs Matter

The M393B2G70EB0-CMAQ2M is a server-specific DDR3 16GB RDIMM built for always-on enterprise workloads, and four core features make it indispensable: ECC error correction, registered signal buffering, 1866MHz speed, and dual-rank x4 design. In a virtualized VMware cluster, registered logic stabilizes electrical load across up to three DIMMs per channel, enabling dense memory configurations without signal degradation—this directly prevents host crashes during live migration. ECC then continuously scans for and corrects single-bit errors caused by background radiation, ensuring financial calculations in a SAP HANA instance remain accurate to the last bit. Meanwhile, the 1866MT/s throughput and dual-rank architecture interleave memory banks, doubling transaction rates for in-memory databases like Redis, so your e-commerce platform handles flash-sale traffic spikes without latency. Every millisecond and every data integrity check matters here; this module transforms raw capacity into bulletproof reliability, turning memory from a commodity into a business continuity asset.

Endurance & Reliability

General Virtualization
For a moderate consolidation of 10–15 virtual machines, populate at least six of these 16 GB RDIMMs across triple-channel memory banks (96 GB total) to provide headroom for memory overcommitment. Distribute modules evenly across all memory risers and memory channels to maximise bandwidth and reduce NUMA latency. Reserve one or two DIMM slots per channel for future scaling without sacrificing balanced interleaving.

In-Memory Database
In-memory databases thrive on capacity and fault tolerance, so deploy a minimum of twelve modules (192 GB) in a balanced multi-channel configuration to hold large datasets entirely in RAM. Enable mirroring or sparing modes if the platform supports it, pairing identical dual-rank x4 RDIMMs to sustain throughput under heavy write loads. For redundancy-tiered systems, scale in multiples of six to maintain channel symmetry and ECC scrubbing efficiency.

High-Performance Computing (HPC)
HPC clusters require peak bandwidth and low latency; install eight or sixteen modules per node (128 GB or 256 GB) fully populating all available channels. The registered ECC dual-rank design at 1866 MHz delivers stable sustained throughput for tightly coupled parallel workloads. Populate identically across nodes to guarantee predictable performance and leverage the CL13 timing for reduced access latency in iterative scientific simulations.

Verified Compatibility

This rigorously tested DDR3 server RDIMM is compatible with Dell R720, HP DL380p Gen8, IBM x3650 M4.

FAQ

Q: Can I mix this M393B2G70EB0-CMAQ2M with other memory modules of different brands or speeds?

A: Mixing brands or speeds is not recommended for server environments. Mismatched DIMMs can cause instability, ECC errors, or failure to boot. Use identical modules with the same part number, rank, and timings to ensure reliability.

Q: Is this memory compatible with my Intel Xeon server platform?

A: This DDR3-1866 ECC Registered RDIMM is designed for dual-socket Intel Xeon E5-2600 v2 or v1 series and similar platforms with 240-pin RDIMM support. Verify your server board's QVL and check that it accepts 1.5V registered ECC memory.

Q: What is the recommended DIMM population order for this registered memory?

A: For optimal performance, populate identical DIMMs per channel starting with the first slot (often blue or white), following the server board's manual. Balance memory across CPU sockets to enable channel interleaving and maximize bandwidth.

Q: Does this module support overclocking or XMP profiles?

A: No, this server RDIMM operates at the JEDEC standard DDR3-1866 specification and does not support XMP or overclocking. Enterprise systems require strict reliability, so the module runs only at its rated latencies and voltage.

Q: What warranty and typical failure rate can I expect?

A: This module includes a one-year warranty and undergoes rigorous testing. Enterprise DRAM exhibits very low failure rates (AFR typically below 0.5% annually). In the rare event of a defect, we provide a prompt replacement.

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