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Samsung M393B5170EH1-CH9Q1 4GB DDR3 RDIMM 1333MT/s | ECC Server RAM

MPN:M393B5170EH1-CH9Q1 By:Samsung Warranty:1 year
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General

ModelM393B5170EH1-CH9Q1
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity4 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

Designed for server platforms, this Samsung M393B5170EH1-CH9Q1 DDR3-1333 Registered ECC RDIMM ensures data integrity in virtualized environments and memory-intensive databases. Its dual-rank x4 configuration with registered signaling enhances signal stability at higher capacities, while the CL9 latency and ECC reliably maintain performance and error correction under sustained workloads.

Technical Specs & Insights

1. ECC: Real-time error correction preserves data accuracy, preventing silent memory corruption in transactional databases and financial processing workloads.
2. Registered: The on-DIMM register buffer isolates the memory controller from heavy electrical loads, enabling fully populated server boards to achieve maximum virtualization density with rock-solid stability.
3. Dual Rank x4: Interleaved dual-rank organization keeps the memory channels highly saturated, delivering steady throughput essential for consistent virtual machine performance under heavy consolidation.
4. This speed grade supplies sufficient bandwidth for legacy enterprise applications while keeping thermal profiles low inside densely packed rack servers.
5. The modest capacity serves as an efficient, low-power building block for cost-optimized single-socket servers and lightweight containerized deployments.

Why These Specs Matter

The Samsung M393B5170EH1-CH9Q1 is a server-grade DDR3 Registered DIMM engineered for environments where data integrity and uptime are non-negotiable. In a virtualization cluster running dozens of VMs, a single undetected bit flip can corrupt hypervisor states or silently poison guest data, leading to cascading failures. The module’s ECC technology corrects single-bit errors on the fly, shielding your workloads from such costly silent data corruption. Meanwhile, the Registered buffer isolates the memory controller from the DRAM chips, stabilizing signal paths when you fully populate channels with multiple DIMMs. This directly translates to confidence when scaling to the 128 GB or larger footprints that database servers and virtualization hosts demand. For in-memory databases like Redis or SAP HANA, the dual-rank x4 organization boosts throughput through rank interleaving, overlapping access cycles to reduce latency under heavy concurrent queries. Paired with a steady 1333 MHz clock and CL9 timing, it delivers predictable, consistent bandwidth that keeps transactional systems responsive and virtual machines performing as if they were on bare metal. Every millisecond of latency equates to lost revenue, and this module ensures your memory subsystem never becomes the bottleneck.

Endurance & Reliability

Memory Type Identification: This is a server-grade DDR3 Registered ECC DIMM (RDIMM), specifically designed for stability and data integrity in always-on environments.

General Virtualization
For a modest virtualization host, populate a balanced number of modules to enable multi-channel memory architecture. A configuration of six or twelve 4GB RDIMMs (24GB or 48GB total) allows ample headroom for multiple light VMs without wasting DIMM slots. Stick to identical, validated modules to guarantee error correction consistency across all channels.

In-Memory Database
Capacity and reliability are paramount here; a large memory pool minimizes disk I/O. Use the maximum supported modules per channel—often three DIMMs per channel on DDR3 platforms—to reach 96GB or more. Plan for 1.5V RDIMMs like these in all slots, ensuring registered ECC signalling can handle the full electrical load without voltage droop under aggressive database workloads.

High-Performance Computing (HPC)
HPC nodes typically demand high bandwidth above raw capacity per core. Install balanced sets (e.g., 8 or 16 identical modules) to saturate all memory channels and sustain peak 1333MHz transfer rates. Keep rank count optimal: dual-rank x4 modules provide a good trade-off between capacity and command rate, but avoid mixing with single-rank DIMMs to prevent clock skew under sustained floating-point calculations.

Verified Compatibility

Rigorously validated server memory, compatible with Dell PowerEdge R720/R620, HP DL380p Gen8, Lenovo RD630.

FAQ

Q: Can I mix this M393B5170EH1-CH9Q1 with other memory modules of different brands or speeds?

A: Mixing RDIMMs is not recommended for server environments. All modules should be identical in part number, rank, and speed to ensure signal integrity and avoid system instability or POST failures.

Q: Is this memory compatible with my system? (Please specify Intel or AMD server platform)

A: This DDR3-1333 ECC Registered DIMM is designed for dual-socket servers using Intel Xeon 5500/5600 series, AMD Opteron 6100/6200 series, and similar platforms with 240-pin slots supporting 1.5V RDIMMs.

Q: What is the recommended DIMM population order for optimal performance?

A: For dual-socket servers, populate identical DIMMs per channel starting with the farthest slot from the CPU. Follow the platform's memory population guide, typically filling blue or black slots first for balanced memory interleaving.

Q: Does this module support overclocking or XMP profiles?

A: No. As an enterprise-grade Registered ECC module, it runs strictly at JEDEC standard DDR3-1333 CL9. Overclocking or XMP is not supported to guarantee data integrity and 24/7 reliability.

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