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Samsung M393B5270DH0-YH9Q8 4GB DDR3 RDIMM 1333MT/s | Reliable ECC

MPN:M393B5270DH0-YH9Q8 By:Samsung Warranty:1 year
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General

ModelM393B5270DH0-YH9Q8
Compliance StandardsEU RoHS,FCC
Product TypeMemory Module
Memory Capacity4 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankSingle Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

Optimized for 24/7 server environments, this Samsung M393B5270DH0-YH9Q8 4GB DDR3-1333 RDIMM with ECC and registered signaling ensures data integrity in virtualization clusters and in-memory databases where even single-bit errors are unacceptable. Its single-rank x4 organization running at a low 1.35V combines reliable 1333 MHz throughput at CL9 latency with reduced power draw, making it an ideal building block for dense, energy-efficient datacenter deployments.

Technical Specs & Insights

1. ECC memory corrects bit-flips silently induced by cosmic rays or electrical noise, safeguarding transactional financial databases and in-memory caches against data corruption.
2. Registered DIMM architecture redrives address and command signals, preserving signal quality in high-capacity server configurations and allowing multiple DIMMs per channel without instability.
3. DDR3L low-voltage operation cuts power consumption per DIMM, directly translating to lower energy bills and less waste heat in always-on enterprise server fleets.
4. This capacity tier is ideal for lightweight virtualized workloads and dedicated appliance servers, where optimized cost per VM matters more than raw gigabytes.
5. Single rank construction reduces bus contention, delivering more deterministic memory access latencies under mixed read/write server workloads.

Why These Specs Matter

This DDR3-1333 registered ECC memory module, built with a low 1.35V operating voltage and a single-rank x4 design, is purpose-built for mission-critical server environments. Its four defining characteristics directly answer the real-world pain points of IT infrastructure, particularly inside virtualization clusters and in-memory database deployments.

When you run dozens of virtual machines on a single host, the registered buffer becomes indispensable: it stabilizes signal integrity across multiple DIMMs per channel, preventing the crashes that threaten multi-tenant uptime. Meanwhile, the ECC engine silently corrects single-bit errors before they can corrupt a VM’s state or a financial transaction—meaning you avoid the hidden cost of silent data corruption. At the rack level, the 1.35V DDR3L specification cuts power draw and thermal output substantially, shrinking both your energy bill and your cooling demands across a dense data center. For latency-sensitive workloads such as a Redis cache that must answer millions of queries per second, the single-rank x4 organization together with CL9 timing delivers lower access latencies and cleaner signal integrity than dual-rank alternatives, ensuring consistently high IOPS under heavy concurrent load. Each attribute translates directly into higher reliability and lower total cost of ownership for your server fleet.

Endurance & Reliability

This DDR3-1333 CL9 registered ECC module (4 GB, 1.35V, single‑rank x4) is built for server platforms.

General Virtualization
Populate two identical modules per channel across all memory channels—an 8‑channel system requires 16 DIMMs for 64 GB. This symmetrical layout maximizes interleaving and NUMA balance. The 1.35 V operation significantly lowers energy and cooling overhead in dense virtualized hosts.

In‑Memory Database
Maximize capacity by filling every available slot with this 4 GB RDIMM; a 24‑slot platform yields 96 GB. Enable mirroring or sparing to protect critical in‑memory datasets. While 96 GB suits caching tiers and test nodes, production databases will likely demand higher‑density modules.

High Performance Computing
For peak bandwidth, install one DIMM per channel (1DPC) at the full 1333 MT/s and CL9. A dual‑socket server with four channels per CPU needs eight modules (32 GB). The single‑rank x4 design and low voltage keep thermal profiles lean, a vital advantage in tightly packed HPC clusters. Always populate identically across all channels to preserve command‑timing consistency.

Verified Compatibility

Server-grade DDR3 RDIMM, rigorously tested for compatibility with Dell PowerEdge R720, HP DL380p Gen8, and similar servers.

FAQ

Q: Can I mix this M393B5270DH0-YH9Q8 with other memory modules of different brands or speeds?

A: Mixing RDIMMs with different brands or speeds is not recommended. It may cause instability or force all modules to operate at the lowest common specification, compromising validated server performance and reliability.

Q: Is this memory compatible with my system?

A: This DDR3 Registered ECC module requires a server platform with a compatible Intel or AMD chipset supporting 1.35V RDIMMs. Please verify your server motherboard's qualified vendor list (QVL) for M393B5270DH0-YH9Q8.

Q: What is the recommended DIMM population order for optimal performance?

A: To maximize memory bandwidth, populate identical RDIMMs per channel starting from the farthest slot from the CPU. Always consult your specific server board manual for the exact balanced population sequence.

Q: Does this module support overclocking or XMP profiles?

A: No. As a server-grade Registered ECC module, it adheres strictly to JEDEC DDR3-1333 standards. It does not support overclocking or XMP profiles, prioritizing data integrity and operational stability.

Q: What warranty and typical failure rate can I expect?

A: This module includes a one-year warranty. It is designed with rigorous server-grade reliability and a very low annualized failure rate (AFR) under specified operating conditions, ensuring stable long-term deployment.

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