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| Model | M393B5273CH0-YH9 |
|---|---|
| Compliance Standards | EU RoHS,FCC |
| Product Type | Memory Module |
| Memory Capacity | 4 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.35V |
| RAM Speed | 1333MHz |
| RAM Standard | DDR3-1333/PC3-10600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL9 |
| Rank | Dual Rank x8 |
| Quantity of Pins | 240-pin |
| RAM Genre | RDIMM |
Designed as a registered DDR3-1333 RDIMM with ECC, this module is optimized for entry-level servers and small-scale virtualization hosts where data integrity and system stability are paramount. Its dual-rank x8 organization and 1.35V low-voltage operation enhance memory bandwidth efficiency and reduce power consumption, making it a reliable choice for memory-intensive workloads like in-memory databases or consolidated virtual machines.
1. ECC error correction protects transactional data integrity in server memory, eliminating silent bit-flips that could otherwise bring down virtualized workloads unnoticed.
2. Registered DIMM buffering isolates the memory controller from electrical loading, allowing fully populated racks to scale capacity without compromising signal stability.
3. Modest per-stick capacity keeps per-channel density cost-effective, so dense virtualization hosts can hit high total RAM targets without overspending.
4. Low-voltage operation cuts power draw and waste heat generation node by node, directly shrinking data center OPEX and improving long-term hardware reliability.
5. Dual-rank interleaving delivers sustained bandwidth under heavy consolidation, keeping VM response times consistent even when multiple tenants stress the same memory channel.
The Samsung M393B5273CH0-YH9 is a DDR3-1333 Registered ECC DIMM engineered specifically for server environments, where every bit of data integrity and system uptime directly impacts business operations. Its four core characteristics translate directly into resilience and performance for mission‑critical workloads. First, ECC error correction actively detects and fixes single‑bit memory errors, preventing silent data corruption that could crash virtual machines or poison financial records in an in‑memory database like Redis or SAP HANA. Second, the registered interface buffers command and address signals, allowing a server to populate far more DIMMs per channel without signal degradation. This is essential when virtualizing dozens of workloads on a single host, because adding RAM must not compromise stability. Third, the dual‑rank x8 organization enables rank interleaving, which boosts effective bandwidth and lowers transaction latency for heavy database queries or multi‑tenant cloud applications. Fourth, the 1.35V low‑voltage operation slashes power consumption across a fully populated rack, reducing thermal stress and cooling costs while extending component life in 24/7 data centers. In virtualized clusters and memory‑intensive analytics alike, this module is a bedrock of dependability.
General Virtualization
For a hypervisor consolidating several VMs, populate all memory channels evenly with these 4GB ECC Registered DIMMs. In a dual-socket server using triple-channel architecture, six modules per CPU provide 24GB of protected capacity, delivering balanced throughput and high reliability for moderate virtualized workloads.
In-Memory Database
Maximize capacity by filling every available DIMM slot with identical 4GB RDIMMs. A dual-processor platform with 18 slots can reach 72GB—sufficient for smaller Redis or Memcached instances. Although density is limited, using matched modules preserves ECC stability and offers a cost-effective path for expanding legacy servers.
High-Performance Computing
Sustaining memory bandwidth is key in HPC. Install one dual-rank 4GB RDIMM per channel to keep the full 1333 MT/s speed and avoid downclocking. A triple-channel node thus uses three modules per CPU (12GB). The 1.35V low-voltage operation also reduces power consumption across dense cluster deployments.
Rigorously tested server memory, compatible with Dell PowerEdge R720, HP ProLiant DL380p Gen8, and more.
Q: Can I mix this M393B5273CH0-YH9 with other memory modules of different brands or speeds?
A: Mixing is not recommended for this registered server DIMM. Different brands or speeds can cause signal integrity issues and may disable ECC protection. Use identical Samsung M393B5273CH0-YH9 modules to ensure validated RAS performance.
Q: Is this memory compatible with my system?
A: This DDR3-1333 registered ECC RDIMM is designed for server platforms supporting Intel Xeon E5-2600 v1/v2 or AMD Opteron 6300 series. Please verify that your motherboard explicitly requires 1.35V, 240-pin registered DIMMs with ECC support.
Q: What is the recommended DIMM population order for optimal performance?
A: For dual-socket servers, populate identical DIMMs in identical slots across memory channels—usually slots A1 and B1 first. Always follow your system board's population guide to achieve balanced memory interleaving and full ECC coverage.
Q: Does this module support overclocking or XMP profiles?
A: No. This JEDEC-compliant registered ECC module does not support overclocking or XMP profiles. It operates strictly at DDR3-1333 CL9 under 1.35V to guarantee data integrity and 24/7 server reliability.
Q: What warranty and typical failure rate can I expect?
A: This module comes with a 1-year warranty. As enterprise-grade Samsung memory with rigorous screening, its typical failure rate is extremely low, often referenced under 0.1% annually in properly cooled server environments.